JPH11354634A - Wiring board, resistance wire board, thin-film device, formation of photoresist and manufacture of the wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board, wherein an upper pattern can be formed continuously without generating defects in a place where an upper pattern crosses over a lower pattern. SOLUTION: This method comprises a second pattern formation process of forming a magnetic multilayer film 47 on a substrate 41, where a copper film pattern 42 is formed to cross over the pattern 42, and an edge processing process for rounding at least a part of an edge part of the pattern 42, which crosses over a magnetic multilayer film 47 before the second pattern formation process. The edge processing process has a processing film formation process for forming an edge processing film 43 on the substrate 41 and the pattern 42, a resist application process for applying resist 44 on the edge processing film 43, an exposure development process for performing exposure and development to leave the shape of a resist pattern 45 in a side surface of an edge part of the pattern 42 thereafter and a removing process of a processing film for obtaining an edge processing pattern 46 by etching the edge processing film 43.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wiring substrate, a resistance wire substrate, a thin film device, a method for forming a photoresist, and a method for manufacturing a wiring substrate.

[0002]

2. Description of the Related Art Hitherto, the following methods have been mainly used for forming a resistance wire or a device with a thin film.

FIG. 5 is a schematic sectional view showing a procedure of a conventional method of manufacturing a wiring board. First, a substrate 1 such as silicon
A metal film 2 such as copper or a magnetic film is formed by plating, sputtering, or the like, and a positive photoresist 3 is coated on the metal film 2 with a constant thickness using a spinner (FIG. 5A). ). After contacting the mask 4 or approaching a certain distance, the mask 5 is irradiated with ultraviolet rays 5 (FIG. 5B). The resist 3 is patterned by developing with a developer (FIG. 5).
(C)). Conductive metal patterning by dry etching such as wet etching or ion milling,
The resist 3 is removed with a remover (FIG. 5D).
In this case, the edge side surface may be tapered by tilting and rotating the substrate during dry etching.
In the case of multi-layering, FIGS. 5A to 5D are repeated.

[0004]

However, when a wiring board is manufactured by the above-mentioned conventional manufacturing method, a step corresponding to the thickness of the pattern is generated between the substrate and the pattern. Therefore, in the case of a pattern configuration in which several types of patterns intersect, the pattern 2 arranged at the top as shown in FIG.
2 will be patterned on the step. On this occasion,
Since the edge portion of the lower pattern 21 is angular, if the step is larger than the film thickness of the upper pattern 22, the film of the upper pattern 22 is likely to be discontinuous at the edge portion 23 of the lower pattern 21. Even if the film thickness does not become discontinuous, if the film thickness is remarkably different, for example, in the case of a resistance wire, problems such as heat generation, disconnection, and change in resistance value occur. Even in the case of a thin film device, the thickness of a multilayer magnetic film may be several hundred angstroms, and when the upper pattern 22 is formed of a multilayer magnetic film, the film may be discontinuous at the edge portion 23. The properties are extremely high, and it is difficult to obtain good magnetic properties. For example, in the case of a head having a configuration as shown in FIG. 7 (Japanese Patent Laid-Open No. 10-69613), when a multilayer magnetic film is used, a conductor line 32 is arranged between a lower magnetic film pattern 31 and an upper magnetic film pattern 33. In this case, there is a problem that the film of the upper magnetic film 33 becomes discontinuous at the edge portion 34 of the pattern, and good magnetic characteristics cannot be obtained.

[0005] As measures to solve the above-mentioned problems,
It is conceivable to form the upper pattern after at least making a corner of an edge portion of the lower pattern that intersects the upper pattern.

[0006] As a method of obtaining a corner of an edge portion of a pattern, there is an etch-back method. The etch-back method is a method of removing the corners of the edge portion of a pattern, and utilizes the fact that once a pattern is patterned, a thin resist is spin-coated to make the resist at the edge portion thinner.
FIG. 8 is a schematic sectional view showing the procedure of the etch-back method. Hereinafter, the procedure of the etch-back method will be described with reference to FIG.

First, a substrate 41 having a first copper film 42 having a trapezoidal cross section on one side is prepared (FIG. 8A).

Next, a thin resist 51 is spin-coated on the first copper film pattern 42 (FIG. 8B). The thickness of the resist can be controlled by selecting the type of the resist and the number of rotations of the spinner. When the thickness of the resist is reduced, the thickness of the resist can be reduced particularly at the upper portion and the edge portion of the pattern as compared with other portions.

Next, etching is performed by ion milling under the condition that the etching rates of the resist 51 and the copper pattern 42 become equal to each other, and the etching is completed in a state where only the edge portion of the pattern 42 having a small resist film thickness is processed. FIG. 8 (c)).

Finally, by removing the resist 51 with a remover, the corners of the edge portion of the pattern 42 can be obtained (FIG. 8D).

However, the corner of the edge portion of the pattern obtained by the etch back method is very small, and a substantial effect of forming the corner cannot be obtained particularly for a pattern having a rectangular cross section.

In view of the above-mentioned problems of the conventional wiring board and the method of manufacturing the wiring board, the present invention considers that the upper pattern crosses over the lower pattern or covers the lower pattern to remove defects. It is an object of the present invention to provide a method of manufacturing a wiring board that can be formed continuously without causing any problem.

Further, the present invention provides a photo for a lower pattern for continuously forming an upper pattern without causing a defect at a place where an upper pattern of a wiring board crosses over or covers a lower pattern. It is an object of the present invention to provide a method for forming a resist.

It is another object of the present invention to provide a wiring board and a resistance wire board in which an upper pattern is formed continuously without causing defects.

Still another object of the present invention is to provide a thin film device having high reliability by providing a wiring board and / or a resistance wire board in which an upper pattern is formed continuously without causing defects. Things.

[0016]

Means for Solving the Problems To solve the above problems, a first present invention (corresponding to the first aspect of the present invention)
Forming a second pattern on the substrate on which the first pattern is formed so as to intersect with the first pattern or to cover the first pattern; , At least a portion of the edge portion of the first pattern that intersects with the second pattern or a portion that is covered with the second pattern,
Prior to the pattern forming step, comprising an edge processing step of performing round processing, wherein the edge processing step includes forming an edge processing film on at least a portion of the substrate and the first pattern where the second pattern is formed. Forming a processing film to be formed, applying a resist on the edge processing film, and after the resist applying step, the resist remains on the side surface of the edge portion of the first pattern. And a processing film removing step of etching the edge processing film.

A second aspect of the present invention (corresponding to the second aspect of the present invention) includes a third pattern forming step of forming a third pattern on the substrate before the second pattern forming step. Wherein the step of applying a resist and the step of exposing and developing the resist in the third pattern forming step are performed simultaneously with the step of applying the resist and the step of exposing and developing, respectively. This is a method for manufacturing a substrate.

A third aspect of the present invention (corresponding to the third aspect of the present invention) is characterized in that the material of the edge processing film is the same as the material of the first pattern. Another embodiment is a method for manufacturing a wiring board according to the second invention.

A fourth aspect of the present invention (corresponding to the fourth aspect of the present invention) is the wiring board according to the first or second aspect, wherein the edge processing film is an insulator. It is a manufacturing method.

According to a fifth aspect of the present invention (corresponding to the fifth aspect of the present invention), a first pattern forming step of forming a first pattern on a substrate, and after the first pattern forming step, the first pattern forming step is performed. A second pattern forming step of forming a second pattern so as to intersect with the first pattern or to cover the first pattern; and at least the second pattern in an edge portion of the first pattern. An edge processing step of rounding a portion intersecting with the pattern or a portion covered by the second pattern before the second pattern forming step, wherein the first pattern forming step includes: A first resist forming step of forming a first resist layer on the first pattern film formed on the substrate and patterning the first resist film, and after the first resist forming step, Said A second resist forming step of forming a second resist layer so as to cover the turned first resist layer; and after the second resist forming step, patterning the first pattern film. And a patterning step of forming the first pattern.

According to a sixth aspect of the present invention (corresponding to the sixth aspect of the present invention), in the second resist forming step, the thickness of the second resist layer is smaller than the thickness of the first resist layer. A fifth method of manufacturing a wiring board according to the present invention, wherein the second resist layer is formed.

According to a seventh aspect of the present invention (corresponding to the seventh aspect of the present invention), when the resist layer is patterned, the resist layer and the mask pattern are exposed at a predetermined distance from each other. A method of forming a photoresist, comprising patterning the resist layer so that an edge portion thereof is rounded.

According to an eighth aspect of the present invention (corresponding to the eighth aspect of the present invention), a first pattern forming step of forming a first pattern on a substrate, and after the first pattern forming step, the first pattern forming step is performed. A second pattern forming step of forming a second pattern so as to intersect with the first pattern or to cover the first pattern; and at least the second pattern in an edge portion of the first pattern. An edge processing step of rounding a portion intersecting with the pattern or a portion covered by the second pattern before the second pattern forming step, wherein the first pattern forming step includes: Forming a first resist layer on the first pattern film formed on the substrate by using the photoresist forming method of the seventh aspect of the present invention; 1 Regis And forming step, after the first resist forming step, a method of manufacturing a wiring substrate characterized by having a patterning step of patterning the first pattern layer to form the first pattern.

According to a ninth aspect of the present invention (corresponding to the ninth aspect of the present invention), the first resist forming step is repeated a plurality of times, and the first resist layer is formed by lamination. An eighth aspect of the present invention is a method for manufacturing a wiring board according to the present invention.

According to a tenth aspect of the present invention (corresponding to the tenth aspect of the present invention), in the patterning step, the etching time of each of the resist layers is equal to the etching time of the first pattern film. The method according to any one of the fifth, sixth, eighth, and ninth aspects, wherein the thickness and the etching rate of each of the resist layers and the first pattern film are selected. It is.

According to an eleventh aspect of the present invention (corresponding to the eleventh aspect of the present invention), the wiring substrate is manufactured by any one of the first to sixth, eighth to tenth aspects of the present invention. A wiring board characterized by the above.

A twelfth invention (corresponding to the twelfth invention) is the wiring substrate according to the eleventh invention, wherein the second pattern is a multilayer magnetic film.

According to a thirteenth aspect of the present invention (corresponding to the thirteenth aspect of the present invention), the wiring board is manufactured by any one of the first to sixth, eighth to tenth aspects of the present invention. First
And / or the second pattern is a resistance wire.

A fourteenth aspect of the present invention (corresponding to the fourteenth aspect of the present invention) includes the eleventh or twelfth wiring board of the present invention and / or the thirteenth resistance wire board of the present invention. Is a thin film device.

[0030]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) First, the first embodiment of the present invention will be described.
An embodiment will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing a method of manufacturing a wiring board according to a first embodiment of the present invention in accordance with manufacturing steps. Hereinafter, the procedure of the method of manufacturing a wiring board according to the present embodiment will be described with reference to FIG.

First, a substrate 41 having a thickness of 2 μm and having a patterned first copper film 42 on one side is prepared (FIG. 1A). In FIG. 1, the cross-sectional shape of the first copper film pattern 42 is shown as a trapezoid in order to easily explain the effect of the present embodiment.
The shape is not limited to this, and may be rectangular.

Next, a second copper film pattern 42
The copper film 43 of FIG.
(B)). This step corresponds to the processing film forming step of the present invention. The first copper film pattern 42 and the second copper film 43 correspond to the first pattern and the edge processing film of the present invention, respectively. Corresponding.

Next, a positive photoresist 44 is coated on the second copper film 43 with a thickness of 4 μm using a spinner (FIG. 1C). This step corresponds to the resist coating step of the present invention.
Reference numeral 4 corresponds to the resist of the present invention.

Next, the photoresist 44 is exposed and developed.
When the photoresist 44 remains on the side surface of the edge of the first copper film pattern 42 as the resist pattern 45, the development is completed (FIG. 1D). This step corresponds to the exposure and development step of the present invention.

Next, etching is performed from the upper surface side of the substrate 41 by ion milling. Thus, the copper film pattern 46 is patterned on the side surface of the edge of the first copper film pattern 42 in a shape reflecting the shape of the resist pattern 45 (FIG. 1E). This step corresponds to the processing film removing step of the present invention.

Finally, a magnetic multilayer film 47 is formed and patterned so as to intersect (or cover) the first copper film pattern 42 and the copper film pattern 46 (FIG. 1).
(F)). The magnetic multilayer film 47 is formed by laminating ten layers each of a 0.1-micron amorphous film and a 0.05-micron silicon oxide film. Lower pattern (1st edge) processed into a gentle shape with sharp edges and side edges
On the copper film pattern 42 and the copper film pattern 46) of
Since the magnetic multilayer film 47 is formed, the film can be formed continuously, and good magnetic characteristics can be maintained. This step corresponds to the second pattern forming step of the present invention, and the magnetic multilayer film 47 corresponds to the second pattern of the present invention.

The values of the thicknesses of the respective films in the above description are specific examples, and are not limited to these values.

In the wiring board manufactured as described above, the upper pattern can be continuously formed at the place where the upper pattern crosses the lower pattern or covers the lower pattern. It is possible to avoid problems such as changes and poor magnetic characteristics. When the substrate manufactured by the method for manufacturing a wiring substrate according to the present embodiment was cut into a magnetic thin film device, it was confirmed that good magnetic properties were achieved.

Prior to the processing film forming step shown in FIG. 1B, the corner of the edge portion of the first copper film 42 is previously taken by the conventional etch-back method shown in FIG. Otherwise, it is more effective.

In the present embodiment, copper is used for the lower pattern (the first pattern of the present invention) and a magnetic multilayer film is used for the upper pattern (the second pattern of the present invention). However, the present invention is not limited to this.

In the present embodiment, the same copper film as the lower pattern (the first pattern of the present invention) is used as the lower part of the edge processing film of the present invention.
Even if films of different materials are used, the shape effect given to the upper pattern does not change. For example, if the cross-sectional area of the lower pattern is strictly set for the purpose of keeping the resistance constant, an insulator is used.

In the manufacturing process, if there is a step of forming a third pattern which does not overlap the lower pattern after forming the lower pattern (third pattern forming step of the present invention),
The step of applying a resist and the step of developing the resist in the third pattern forming step may be performed simultaneously with the resist applying step and the exposure and developing step, respectively.

In this embodiment, a thin film device in which the upper pattern is formed of a magnetic film has been described. However, the present invention is also effective for a case where the upper pattern is formed of a metal such as copper, chromium, or tantalum. is there.

Further, in this embodiment, the magnetic multilayer film 47 is described as forming ten layers each of an amorphous film and a SiO 2 film. However, other materials may be used, and the number of layers is not limited to this. .

(Second Embodiment) Next, a second embodiment of the present invention will be described.
An embodiment will be described with reference to the drawings.

FIG. 2 is a schematic sectional view showing a method of manufacturing a wiring board according to a second embodiment of the present invention according to manufacturing steps. Hereinafter, the procedure of the method for manufacturing a wiring board according to the present embodiment will be described with reference to FIG.

First, a substrate 71 which is a glass substrate having a first copper film 72 patterned and formed on a side having a thickness of 2 μm is prepared, and a first copper film 72 is formed on the first copper film 72. The resist layer 73 is formed with a thickness of just over 2 microns (FIG. 2)
(A)). This step corresponds to the first resist forming step of the present invention, and the first copper film 72 and the first resist layer 73 are the first pattern film and the first resist film 73 of the present invention, respectively.
Of the resist layer.

Next, a thin resist is coated on the first copper film 72 and the first resist layer 73 using a spinner to form a second resist layer 74 (FIG. 2).
(B)). The second resist layer 74 is formed so as to have a thickness of 0.6 μm on the first copper film 72 and is thinner than the thickness of the first copper film 72. This step corresponds to the second resist forming step of the present invention, and the second resist layer corresponds to the second resist layer of the present invention.

Finally, etching is performed by ion milling from the upper surface of the substrate 71 to pattern the first copper film 72 (FIG. 2C). At this time, as described later, by controlling the angle of the substrate with respect to the ion beam, control is performed so that the etching rates of the first copper film 72 and the resists 73 and 74 become equal. By making the etching rates equal, the resist shape shown in FIG. 2B is faithfully reflected on the shape of the pattern 75 of the first copper film 72. This step corresponds to the patterning step of the present invention, and the pattern 75 corresponds to the first pattern of the present invention.

By forming the upper pattern after processing so that the pattern edge is rounded in this way, the upper pattern can be formed in a favorable state. Note that the second pattern forming step follows the above-described first embodiment.

What is important here is that the step A of the resist in FIG. 2B is made equal to the thickness of the first copper film 72 to be patterned. Since the second resist layer 74 becomes thinner on the first resist layer 73, the thickness of the first resist layer 73 needs to be slightly larger than the thickness of the copper film 72 including the thickness. If the thickness of the copper step must be different from that of the resist step A, it can be dealt with by controlling the ratio of the etching rates of the copper film 72 and the resists 73 and 74.

Referring to FIG. 2C, a method of controlling the etching rate by adjusting the angle of the substrate with respect to the ion beam will be described with reference to FIG. FIG.
FIG. 3 is a diagram showing a relationship between an angle of a substrate with respect to an ion beam and an etching rate of resist and copper. FIG.
As shown in (1), the etching rate of the resist and copper changes depending on the angle of the substrate with respect to the ion beam (the direction perpendicular to the main surface of the substrate is 0 ° and the direction parallel thereto is 90 °). Thus, the etching rate can be controlled. In this embodiment, by setting this angle to slightly less than 60 degrees, the etching rates of the resist and copper are made substantially equal.

In the wiring board manufactured as described above, the upper pattern can be continuously formed at the place where the upper pattern crosses over the lower pattern or covers the lower pattern. It is possible to avoid problems such as changes and poor magnetic characteristics. When the substrate manufactured by the method for manufacturing a wiring substrate according to the present embodiment was cut into a magnetic thin film device, it was confirmed that good magnetic properties were achieved.

In this embodiment, copper is used for the lower pattern (first pattern of the present invention). However, the present invention is not limited to this.

(Third Embodiment) Next, a third embodiment of the present invention will be described.
An embodiment will be described with reference to the drawings.

FIG. 4 is a schematic sectional view showing a method of manufacturing a wiring board according to a third embodiment of the present invention in accordance with manufacturing steps. Hereinafter, the procedure of the method for manufacturing a wiring board according to the present embodiment will be described with reference to FIG.

First, a substrate 81 which is a glass substrate having a copper film 82 formed on one side thereof with a thickness of 2 μm and a first resist layer 83 coated thereon with a thickness of 2 μm is prepared. When exposing the resist with an exposing machine, the mask pattern 84a of the mask 84 is irradiated with ultraviolet rays 85 with a predetermined distance from the resist layer 83. If there is a space between the mask pattern 84a and the resist 83, the ultraviolet rays 8
5 is also diffracted below the mask pattern 84a, and the resist under the mask pattern 84a is also exposed (FIG. 4A).
When the resist is developed in this state, the end portion of the resist pattern 86 is slightly exposed due to the diffraction of the ultraviolet rays at the time of exposure, and the resist pattern 86 has a rounded shape with the edge portion dropped (FIG. 4). (B)). This step includes the method of forming a photoresist of the present invention and the first method.
The copper film 82 and the first resist layer 83 correspond to the first pattern film and the first resist layer of the present invention, respectively.

In the state of FIG. 4B, etching is performed by ion milling under the condition that the etching rates of the copper film 82 and the resist pattern 86 become equal to each other.
4 is faithfully reflected on the shape of the pattern 89 of the copper film 82 (FIG. 4D). This step corresponds to the patterning step of the present invention, and the pattern 89 corresponds to the first pattern of the present invention.

By forming the upper pattern after etching so that the pattern edge becomes round, the upper pattern can be formed in a good state. In addition,
The second pattern forming step follows the above-described first embodiment.

When the thickness of the copper film 82 is large and the pattern width is large, the resist pattern 8 shown in FIG.
In the shape of No. 6, the roundness may be insufficient. In that case, as shown in FIG. 4C, the second resist pattern 88 is formed by the method shown in FIG.
It may be formed by superimposing. Here, it should be noted that the total thickness of the first resist pattern 87 and the second resist pattern 88 is made equal to the thickness of the copper film 89. If the resist film thickness and the copper film thickness must be different, the copper film 82 and the resist pattern 86
And 88, 87 by controlling the ratio of the etching rate.

In the wiring board manufactured as described above, the upper pattern can be formed continuously where the upper pattern crosses the lower pattern or covers the lower pattern. It is possible to avoid problems such as changes and poor magnetic characteristics. When the substrate manufactured by the method for manufacturing a wiring substrate according to the present embodiment was cut into a magnetic thin film device, it was confirmed that good magnetic properties were achieved.

The manufacturing method, film thickness and material of each layer, and the material of the glass substrate are not limited to those described here. As a method of forming each layer, various thin film forming methods such as vapor deposition, sputtering, and plating may be used.

In the first to third embodiments described above, the wiring substrate, the method of manufacturing the wiring substrate, and the method of forming the photoresist of the present invention have been mainly described. The first pattern and / or the second pattern are manufactured by the method for manufacturing a wiring board of the present invention, and the first pattern and / or the second pattern are resistance wires. A resistance wire substrate according to the present invention is provided, thereby improving the yield related to magnetic characteristics and / or improving the yield related to resistance wires.

Further, the shapes of the wiring board and the resistance wire substrate used in the thin film device of the present invention are not limited to the shapes of the wiring boards in the above-described first to third embodiments.

[0067]

As is apparent from the above description, the first to sixth and eighth to tenth aspects of the present invention provide a method in which the upper pattern has a defect at the place where the upper pattern crosses the lower pattern or covers the lower pattern. It is possible to provide a method for manufacturing a wiring board which can be formed continuously without causing the problem.

Further, according to the present invention, at a place where the upper pattern of the wiring substrate crosses over the lower pattern or covers the lower pattern, the lower pattern for continuously forming the upper pattern without causing a defect is provided. A method for forming a photoresist for a pattern can be provided.

Further, according to the present invention, it is possible to provide a wiring board in which the upper pattern is formed continuously without causing defects.

According to the thirteenth aspect of the present invention, it is possible to provide a resistance wire substrate in which an upper pattern is formed continuously without causing a defect.

Further, the present invention of claim 14 provides a reliable thin film device by providing a wiring substrate and / or a resistance line substrate in which the upper pattern is formed continuously without causing defects. Can be.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a method of manufacturing a wiring board according to a first embodiment of the present invention in accordance with manufacturing steps.

FIG. 2 is a schematic sectional view illustrating a method of manufacturing a wiring board according to a second embodiment of the present invention in accordance with manufacturing steps.

FIG. 3 is a diagram showing a relationship between an angle of a substrate with respect to an ion beam and an etching rate of resist and copper.

FIG. 4 is a schematic sectional view illustrating a method of manufacturing a wiring board according to a third embodiment of the present invention in accordance with manufacturing steps.

FIG. 5 is a schematic sectional view showing a procedure of a conventional method for manufacturing a wiring board.

FIG. 6 is a schematic sectional view showing a conventional wiring board.

FIG. 7 is a schematic perspective view showing a head provided with a conventional wiring board.

FIG. 8 is a schematic sectional view showing a procedure of a conventional etch back method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Metal film 3 Photoresist 4 Mask 5 Ultraviolet 21 Lower pattern 22 Upper pattern 23 Edge part 31 Lower magnetic film pattern 32 Conductor line 33 Upper magnetic film pattern 34 Edge part 41 Substrate 42 First copper film pattern 43 Second Copper film 44 Photoresist 45 Resist pattern 46 Copper film pattern 47 Magnetic multilayer film 51 Resist 71 Substrate 72 First copper film 73 First resist layer 74 Second resist layer 75 Pattern 81 Substrate 82 Copper film 83 First resist Layer 84 mask 85 ultraviolet ray 86 resist pattern 87 first resist pattern 88 second resist pattern 89 pattern

Claims (14)

[Claims] 1. A method according to claim 1, wherein the first pattern is formed on a substrate.
A second pattern forming step of forming a second pattern so as to intersect with the first pattern or to cover the first pattern; and at least an edge portion of the first pattern. A portion that intersects with the second pattern, or a portion that is covered with the second pattern,
An edge processing step of performing round processing before the second pattern forming step, wherein the edge processing step includes performing edge processing on at least a portion of the substrate and the first pattern where the second pattern is formed. Forming a film for processing, a resist coating step of coating a resist on the edge processing film, and after the resist coating step, the resist on the side surface of the edge portion of the first pattern, A method of manufacturing a wiring board, comprising: an exposure and development step of exposing and developing so that a pattern remains; and a processing film removal step of etching the edge processing film. 2. The method according to claim 1, further comprising: a step of forming a third pattern on the substrate before the step of forming the second pattern. 2. The method according to claim 1, wherein the exposure and development steps are performed simultaneously with the resist coating step and the exposure and development step, respectively. 3. The material of the edge processing film is the first material.
3. The method for manufacturing a wiring board according to claim 1, wherein the material is the same as that of the pattern. 4. The method according to claim 1, wherein the edge processing film is an insulator. 5. A first method for forming a first pattern on a substrate.
After the pattern forming step and the first pattern forming step,
A second pattern forming step of forming a second pattern so as to intersect with the first pattern or to cover the first pattern; and at least an edge portion of the first pattern. A portion that intersects with the second pattern, or a portion that is covered with the second pattern,
An edge processing step of performing round processing before the second pattern forming step, wherein the first pattern forming step also serves as the edge processing step, and the first pattern forming step is performed on a first pattern film formed on the substrate. A first resist forming step of forming and patterning a first resist layer, and after the first resist forming step, forming a second resist so as to cover the patterned first resist layer. A second resist forming step of forming a resist layer; and a patterning step of patterning the first pattern film to form the first pattern after the second resist forming step. Manufacturing method of wiring board. 6. The method according to claim 1, wherein the second resist layer is formed such that a thickness of the second resist layer is smaller than a thickness of the first resist layer. The method for manufacturing a wiring board according to claim 5. 7. When patterning the resist layer, the resist layer and the mask pattern are exposed so as to be spaced apart from each other by a predetermined distance, thereby patterning the resist layer so that an edge portion of the resist layer is rounded. A method of forming a photoresist. 8. A first method for forming a first pattern on a substrate.
After the pattern forming step and the first pattern forming step,
A second pattern forming step of forming a second pattern so as to intersect with the first pattern or to cover the first pattern; and at least an edge portion of the first pattern. A portion that intersects with the second pattern, or a portion that is covered with the second pattern,
An edge processing step of performing round processing before the second pattern forming step, wherein the first pattern forming step also serves as the edge processing step, and the first pattern forming step is performed on a first pattern film formed on the substrate. 8. A first resist forming step of forming and patterning a first resist layer by using the photoresist forming method according to claim 7, and after the first resist forming step, forming a first resist layer. A patterning step of patterning a film to form the first pattern. 9. The method according to claim 8, wherein the step of forming the first resist is repeated a plurality of times, and the first resist layer is formed by lamination. 10. In the patterning step, the thickness and the thickness of each of the resist layers and the first pattern film are set such that an etching time of each of the resist layers is equal to an etching time of the first pattern film. An etching rate is selected, wherein the etching rate is selected.
10. The method for manufacturing a wiring board according to any one of items 9. 11. A wiring board manufactured by the method for manufacturing a wiring board according to any one of claims 1 to 6, 8 to 10. 12. The wiring board according to claim 11, wherein the second pattern is a multilayer magnetic film. 13. A method of manufacturing a wiring board according to claim 1, wherein the first pattern and / or the second pattern is a resistance wire. Resistance wire substrate. 14. A thin-film device comprising the wiring substrate according to claim 11 and / or the resistance wire substrate according to claim 13.