JPS59125672A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS59125672A
JPS59125672A JP58000831A JP83183A JPS59125672A JP S59125672 A JPS59125672 A JP S59125672A JP 58000831 A JP58000831 A JP 58000831A JP 83183 A JP83183 A JP 83183A JP S59125672 A JPS59125672 A JP S59125672A
Authority
JP
Japan
Prior art keywords
emitter
electrode
base
base junction
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58000831A
Other languages
Japanese (ja)
Other versions
JPH0586678B2 (en
Inventor
Makoto Roppongi
誠 六本木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58000831A priority Critical patent/JPS59125672A/en
Publication of JPS59125672A publication Critical patent/JPS59125672A/en
Publication of JPH0586678B2 publication Critical patent/JPH0586678B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/11Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers or surface barriers, e.g. bipolar phototransistor
    • H01L31/1105Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers or surface barriers, e.g. bipolar phototransistor the device being a bipolar phototransistor

Abstract

PURPOSE:To reduce leakage current ICEO of a semiconductor device without causing the channel preventing effect by forming a photoreceiving element and electrode wirings formed along a base junction on an insulating film of the base junction of the element and connected to he emitter electrode of the element. CONSTITUTION:Electrode (aluminum) wirings 61 formed along a base junction on an insulating film 4 of the base junction of a photoreceiving element 11 and connected to the emitter electrode of the element 11 are formed. In this case, since the base junction is formed annularly as seen planely, the wirings 61 corresponding thereto are also annular. Since a bias voltage is always applied to the emitter via the bias between the collector and the emitter, the electrode 61 can constantly perform the channel preventing effect. As a negative bias voltage is applied to an emitter layer 3, a forward bias voltage is applied between the emitter and the base at this time so that the base layer 2 and the wirings 61 become substantially equal voltage, no carrier which causes the leakage current is not induced in the layer 2, thereby preventing the production of the leakage current ICEO.

Description

【発明の詳細な説明】 〔発明の技術分5・f〕 本発明はフォトトランジスタ等の受光素子全形成する半
導体装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Part 5.f of the Invention] The present invention relates to a semiconductor device in which all light receiving elements such as phototransistors are formed.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

従来の受光素子は、チャネル防止用としてベース接合上
にアルミニウム配線を行なっている。
Conventional light-receiving elements have aluminum wiring on the base junction to prevent channels.

第1図はその従来の受光素子を示し、1はコレクタ層、
2はベース層、3はエミツタ層、4はS + 02膜(
絶縁膜)、5はベース電4・メ、5□lはこのベース電
極に接続されたアルミニウム配線、6はエミッタ電極で
ある。即ち従来は、ベース接合上にアルミニウム配線5
1及びベース’Ij’) uj。
FIG. 1 shows the conventional photodetector, in which 1 is a collector layer;
2 is the base layer, 3 is the emitter layer, and 4 is the S + 02 film (
(insulating film), 5 is a base electrode 4, 5□l is an aluminum wiring connected to this base electrode, and 6 is an emitter electrode. That is, in the past, aluminum wiring 5 was placed on the base junction.
1 and base 'Ij') uj.

5を配置し、該配線′rd極5I とベース層2間を同
電位にしてチャネル防止を行なっていた。
5 was placed, and the potential between the wiring 'rd electrode 5I and the base layer 2 was set to be the same to prevent a channel.

受光素子は一般的にコレクタ、エミッタ間にバイアスを
かけ、ベースを受光部として+1・11作4せている。
Generally, a light receiving element is configured such that a bias is applied between the collector and the emitter, and the base is used as the light receiving part.

よってコレクタ、エミ、り間のリーク電流工。。0が高
いと、光を感知する1)1■にオン状態となり問題であ
る。従来枝術のものだと、コレクタ、エミッタ間にバイ
アスをかげても、ベース側はノンバイアス状態となるこ
とがあり非受光期間)、チャネル防止も不完全で、IJ
−り箱、流工。8゜も筒くなるものであっfc、。
Therefore, there is a leakage current between the collector, emitter, and rim. . If 0 is high, it will be in the ON state in 1) 1■ which senses light, which is a problem. With conventional branch technology, even if a bias is applied between the collector and emitter, the base side may be in a non-bias state (during the non-light receiving period), channel prevention is incomplete, and IJ
- Ribako, Ryuko. It is cylindrical by 8 degrees, fc.

〔発明の目的〕[Purpose of the invention]

本発明は上記実情に鑑みてなきれたもので、チャネル防
止の効果をおとすことなく、リーク電流工。ゆ。を低減
させることができる坐り、“j(体装置i’1′を提供
しようとするものである。
The present invention was developed in view of the above-mentioned circumstances, and is designed to prevent leakage current without compromising the effectiveness of channel prevention. hot water. The purpose is to provide a sitting device i'1' that can reduce the amount of stress.

〔発明の概要〕[Summary of the invention]

本発明は、製品を組み立てるlpJモベースの電;!1
yを取シ出すものは少なく、エミッタの’FIN夕を、
1、全て0ff(j品で取り出すことから、エミッタの
電位をベース接合上のrjg Rへ供給させることで、
終始チャネル防止に加え、リーク電流の減少が実現でき
て、ダブル効果を発揮できるようにしたものである。
The present invention is based on the LPJ mobile base that assembles the product;! 1
There are few that extract y, and the 'FIN evening of the emitter,
1. All 0ff (Since it is taken out with j product, by supplying the emitter potential to rjg R on the base junction,
In addition to preventing channels from beginning to end, it also reduces leakage current, providing a double effect.

〔発明の実施例〕[Embodiments of the invention]

1ヅ下図面を参照して本発明の一実施例を説明する。第
2(′12Iは同実施例を示すしT面イ(り電図である
が、これ妊]第1図のものと対応ざぜた場合の例である
から、対応個所には同一符号をイ1]シて説明を省略し
、特徴とする点の説明を行なう。
1. One embodiment of the present invention will be described with reference to the drawings below. 2nd ('12I indicates the same embodiment, and T-side A (represents an electric diagram, but this is an example) Since this is an example of a case where it corresponds to the one in Figure 1, the same reference numerals are assigned to corresponding parts. 1] The detailed explanation will be omitted, and the characteristic points will be explained.

同実施例の特徴は、受光素子11のベース接合の絶縁n
・;J4上で前記ベース接合に沿って設けられ受光素子
11のエミッタ電極6に接続された’flj: 1夕(
アルミニウム)配線61を具備させた点である。この」
ん合ベース接合(ベース、コレクタ間接合)は、平面的
に見れば環状であるため、これに対応する電棲配綜61
 も環状となる。
The feature of this embodiment is that the insulation n of the base junction of the light receiving element 11 is
・; 'flj: 1 evening (
This is because a wiring 61 (aluminum) is provided. this"
Since the joint base joint (joint between the base and the collector) is annular when viewed from above, the corresponding electrical connection 61
It also becomes circular.

上記の如くh′4成きれた受光素子にあっては、コレク
タ、エミッタ間バイアスにより、エミッタには終始バイ
アス電圧がかがっているから、電4■61で終始チャネ
ル防止効果を発揮できる。
In the light-receiving element which has completed h'4 as described above, a bias voltage is applied to the emitter from beginning to end due to the bias between the collector and emitter, so that the channel prevention effect can be exhibited from beginning to end with the voltage 4.times.61.

またエミ、り層3に負のバイアス電圧ががかり、この時
エミッタ、ベース間に1![q方向バイアス電圧がかか
ってベース層2と電(・\配線61 とが略同電位とな
り、従ってベースj・す2(こリーク’i’11.流の
原因となるキャリアが誘起されず、リーク・:1゜流’
CEQの発生を防止できる。実験によれば、第3図に示
す如くリーク電流■。EOを略1/1oに減少できた。
Also, a negative bias voltage is applied to the emitter layer 3, and at this time, 1! [When the q-direction bias voltage is applied, the base layer 2 and the electric wire 61 have approximately the same potential, so carriers that cause leakage 'i'11. Leak: 1° flow'
The occurrence of CEQ can be prevented. According to experiments, as shown in Figure 3, leakage current ■. The EO was reduced to approximately 1/1o.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く本発明によれば、エミッタ電極に接続
されるベース接合上の’)li 141!配線に終始バ
イアス電圧をかけられるから、チャネル防止効果が完全
化され、捷た上記’l+’、4・・反配糸′jjとベー
ス層を同電位化できるから、リーク電流I。。。を極少
化し得る半導体装置が提供できるものである。
As explained above, according to the present invention, ')li 141! on the base junction connected to the emitter electrode. Since a bias voltage is applied to the wiring from beginning to end, the channel prevention effect is perfected, and the base layer can be made to have the same potential as the twisted 'l+', 4... anti-wiring 'jj', so the leakage current I. . . Therefore, it is possible to provide a semiconductor device that can minimize the amount of noise.

【図面の簡単な説明】[Brief explanation of drawings]

第1図1d従来装置の構成を示す断面図、第2[ン1は
本発明の−り7in例のれf成を示すトリ1面し11第
3[5:iは同描成の効果を示す特性し1である。−・
1・・・コレクタ層、2・・・ベース層、3・・・エミ
ツタ層、4・・・絶縁1漢、5・・・ベース電極、6・
・・エミッタ電極、61 ・・・エミッタ電極につなが
る11L極1・妃線、11・・・受光シを子。
Fig. 1d is a sectional view showing the configuration of a conventional device; The characteristics shown are 1. −・
DESCRIPTION OF SYMBOLS 1... Collector layer, 2... Base layer, 3... Emitter layer, 4... Insulation 1 layer, 5... Base electrode, 6...
...Emitter electrode, 61...11L pole 1/pin wire connected to the emitter electrode, 11...Light receiving wire.

Claims (1)

【特許請求の範囲】[Claims] 受光素子と、該受光素子0のベース接合の絶縁膜上で前
記ベース接合に沿って設けられ前記受光素子のエミッタ
電極に接続された電極配腺とを具備したことを特徴とす
る半導体装置。
1. A semiconductor device comprising: a light-receiving element; and an electrode wiring provided on an insulating film at a base junction of the light-receiving element 0 along the base junction and connected to an emitter electrode of the light-receiving element.
JP58000831A 1983-01-07 1983-01-07 Semiconductor device Granted JPS59125672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58000831A JPS59125672A (en) 1983-01-07 1983-01-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58000831A JPS59125672A (en) 1983-01-07 1983-01-07 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS59125672A true JPS59125672A (en) 1984-07-20
JPH0586678B2 JPH0586678B2 (en) 1993-12-13

Family

ID=11484565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58000831A Granted JPS59125672A (en) 1983-01-07 1983-01-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS59125672A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942294A (en) * 1972-03-03 1974-04-20
JPS50144396A (en) * 1974-05-09 1975-11-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942294A (en) * 1972-03-03 1974-04-20
JPS50144396A (en) * 1974-05-09 1975-11-20

Also Published As

Publication number Publication date
JPH0586678B2 (en) 1993-12-13

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