JPS5912556U - Wafer processing pressure control mechanism of double-sided polishing equipment - Google Patents

Wafer processing pressure control mechanism of double-sided polishing equipment

Info

Publication number
JPS5912556U
JPS5912556U JP1982109153U JP10915382U JPS5912556U JP S5912556 U JPS5912556 U JP S5912556U JP 1982109153 U JP1982109153 U JP 1982109153U JP 10915382 U JP10915382 U JP 10915382U JP S5912556 U JPS5912556 U JP S5912556U
Authority
JP
Japan
Prior art keywords
double
sided polishing
control mechanism
pressure control
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982109153U
Other languages
Japanese (ja)
Inventor
正治 木下
川上　英雄
正美 遠藤
優 池辺
Original Assignee
株式会社東芝
東芝機械株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝, 東芝機械株式会社 filed Critical 株式会社東芝
Priority to JP1982109153U priority Critical patent/JPS5912556U/en
Publication of JPS5912556U publication Critical patent/JPS5912556U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例の機構図、第２図は本考案の一実施例の
機構図、第３図は本考案における加ニジーケンスの一例
を示した線図である。 １１・・・上定盤、１２・・・下定盤、３３ないし３６
・・・圧力調整弁。FIG. 1 is a mechanical diagram of a conventional example, FIG. 2 is a mechanical diagram of an embodiment of the present invention, and FIG. 3 is a diagram showing an example of the rotation sequence in the present invention. 11...Upper surface plate, 12...Lower surface plate, 33 to 36
...Pressure regulating valve.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上定盤と下定盤との間に複数のウェハーを挾み前記画定
盤を互に異方向に回転させると共に、前記上定盤を下定
盤に対して加圧するようにした両面ポリッシング装置に
おいて、前記加圧力を少くとも３個以上の圧力調整弁に
よって回転の初期から順次増加するようにした両面ポリ
ッシング装置のウェハー加工圧力制御機構。In the double-sided polishing apparatus, a plurality of wafers are sandwiched between an upper surface plate and a lower surface plate, the dividing surface plates are rotated in different directions, and the upper surface plate is pressurized against the lower surface plate. A wafer processing pressure control mechanism for a double-sided polishing apparatus in which the pressurizing force is sequentially increased from the initial stage of rotation using at least three or more pressure regulating valves.
JP1982109153U 1982-07-19 1982-07-19 Wafer processing pressure control mechanism of double-sided polishing equipment Pending JPS5912556U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982109153U JPS5912556U (en) 1982-07-19 1982-07-19 Wafer processing pressure control mechanism of double-sided polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982109153U JPS5912556U (en) 1982-07-19 1982-07-19 Wafer processing pressure control mechanism of double-sided polishing equipment

Publications (1)

Publication Number Publication Date
JPS5912556U true JPS5912556U (en) 1984-01-26

Family

ID=30254382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982109153U Pending JPS5912556U (en) 1982-07-19 1982-07-19 Wafer processing pressure control mechanism of double-sided polishing equipment

Country Status (1)

Country Link
JP (1) JPS5912556U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307935A (en) * 1991-04-05 1992-10-30 Fujikoshi Kikai Kogyo Kk Double-side simultaneous grinding method of wafer and device thereof
JP2011103379A (en) * 2009-11-11 2011-05-26 Sumco Corp Flat processing method of wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307935A (en) * 1991-04-05 1992-10-30 Fujikoshi Kikai Kogyo Kk Double-side simultaneous grinding method of wafer and device thereof
JP2011103379A (en) * 2009-11-11 2011-05-26 Sumco Corp Flat processing method of wafer

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