JPS5912508A - Method of bonding conductive adhesive tape - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching a conductive adhesive tape, and more specifically, the present invention relates to a method for attaching a conductive adhesive tape. Application of a conductive adhesive tape that provides electrical conductivity provides a method.

Generally, conductive adhesive tape (or sheet) is composed of a conductive tape or sheet base material and a conductive pressure-sensitive adhesive layer in which conductive powder is dispersed. Since a large amount of conductive powder is blended, the adhesive layer has an insufficient adhesive force.

As a conductive adhesive tape or sheet that solves these drawbacks, one has been proposed in which a large number of small protrusions are formed at predetermined intervals on one side of a conductive tape or notebook base material, and a pressure-sensitive adhesive layer is provided on the protrusions. ing.

When a voltage is applied between this tape and the conductive adherend to which it is attached, the adhesive layer at the tip of the protrusion breaks down and conducts electricity. Because it is slightly inside the layer surface, it has the disadvantage that uniform conductivity cannot be obtained at all times unless pressure is applied from the tape or sheet surface, and the surface of the conductive adherend is not smooth and has irregularities. If it is present, this disadvantage will be further aggravated.

The present invention provides a method for applying a novel conductive adhesive tape that solves these drawbacks, and the gist thereof is to adhere a self-supporting conductive hoop (or sheet) to the surface of a substrate. While bonding the conductive adhesive tape (or sheet) provided with the adhesive layer to the conductive adherend, or after bonding, the tape is stamped or crushed from the non-bonded surface of the tape to form the tape base material. A partial direct conductive portion is formed in the substrate, and the conductive portion is brought into contact with the surface of the adherend.

According to the method of the present invention, while applying a smooth conductive adhesive tape to a conductive adherend, or after applying it, a large number of partial portions are attached to a conductive tape (or sheet) substrate by physical means. Since a direct conductive portion is formed, good conductivity can be obtained without being affected by the surface shape of the conductive adherend surface.

The conductive adhesive tape used in the present invention has a thickness of about 10 to
Ethylene-vinyl acetate is applied to the surface of a 500-μm self-supporting conductive tape (or sheet) base material made of copper, aluminum, silver, iron, etc. (including plastic tape formed by blending conductive powder materials). Pressure-sensitive adhesives made of thermoplastic synthetic resin compounds such as copolymers,
It is provided with an adhesive layer having a thickness of about 5 to 500 μm, which is composed of a thin ice-activated adhesive layer, a solvent-activated adhesive layer, and the like.

The conductive adhesive tape constructed in this manner is applied to a conductive adherend, for example, and is stamped from the back side of the tape with a roll provided with protrusions. The tape is deformed so as to pass through the tape base material sill and the adhesive layer on the back side to form a direct conduction part, the tip of which reliably contacts the surface of the adherend.

Therefore, if the adhesive layer is heat-meltable, such as a heat-activated adhesive layer, heating the roll by an appropriate means will help in adhering the tape to the surface of the adherend and forming a direct conductive part. can be formed all at once. Further, the heating roll is preferable even when the tape base material is the plastic tape because the base material can be easily deformed.The shape of the protrusion is not particularly limited, but it is preferable, for example, to When forming a direct conduction part by deforming only the carved part, it is preferable that the tip part is not an acute angle but an obtuse angle such as a flat or spherical shape, and the tip part is preferably flat or obtuse, such as a spherical shape. When the pin-like shape formed by the K is used as the direct conduction part, it is preferable to use a protrusion with an acute angle at the tip.

The pasting of the hexagram is the same as described above even when physical processing is performed later, and whether or not to heat the conductive part forming jig such as a roll can be selected as appropriate depending on the product of the adhesive or tape base material as described above. It will be understood that it will be done.

The pasting method of the present invention is to form a direct conductive part by physical means while pasting the conductive adhesive tape or after pasting it, so the pasting method prevents peeling of the tape later and It has the characteristics that it does not float and can be energized well over a long period of time.

patent applicant Nitto Electric Industry Co., Ltd. Daishishisha Earth way 3rd part 38

Claims (1)

[Claims] While laminating a conductive adhesive tape (or sheet) formed by providing an adhesive layer on the surface of a conductive tape (or sheet) base material having self-supporting properties to a conductive adherend, or after lamination, The conductive material is formed by stamping or crushing the non-bonded surface of the tape to form a partial direct conduction part on the tape base material and bringing the core conduction part into contact with the surface of the adherend. Attaching adhesive tape is illegal.