JPS59122086A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To eliminate the space between an image pickup element and a light transmissive body with a metallized pattern and remove dust and stains, and to set the element is the center of an optical axis with high precision by fixing the light transmissive body and image pickup element in one body inbetween a conductive adhesive. CONSTITUTION:The light transmissive body 2a provided to the light incidence surface of an image pickup device has the metallized pattern on the surface where the element is adhered. This metallized pattern consists of an electrode group 9 having the same array with electrodes of the image pickup element 3, a wiring group 10 connected to the electrode group 9, and a connecting electrode group 11 which is connected to the wiring group 10 and used for connections with external wiring. Then, the pad of the image pickup element 3 and the metallized part of the light transmissive body 2a are fixed with the conductive adhesive 12 to unite the image pickup element 3 and light transmissive body 2a in one body.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a solid-state imaging device such as a COD, and more particularly to an envelope of a solid-state imaging device.

[Technical background of the invention]

Generally, a package of a solid-state imaging device having a photoelectric conversion function has a configuration as shown in FIGS. 1 and 2. That is, the image sensor 3 is bonded to a conductive metallized portion formed on the inner bottom surface of the ceramic container 1 via a conductive adhesive 5, and the electrodes of the image sensor 3 and the metallized wiring 7 are connected to each other by bonding wires 6. connected by. On the other hand, a transparent glass plate 2 is fixed and sealed to the opening of the container via an adhesive 4 in order to protect the image sensor 3 and allow light to enter.

[Problems with conventional technology]

In conventional solid-state imaging devices as described above, electrodes are wired using bonding wires after the imaging element is bonded inside the ceramic container, which creates a space between the transparent glass plate and the light incident surface of the imaging element. That is inevitable. Therefore, dust and dirt adhering to the transparent glass plate have an adverse effect on the device characteristics. For example, dust that got mixed in before the transparent glass plate was sealed with adhesive may move after the glass is sealed, which may cause poor reproducibility of imaging characteristics or characteristics that may differ depending on the optical system used. Problems such as showing the

Furthermore, in the conventional solid-state imaging device described above, the positional accuracy of the light incident surface is poor. In other words, manufacturing of conventional solid-state imaging devices involves adhesion of imaging cords,
Connection of bond-in wires and adhesion of transparent glass plates,
The following process steps are followed, and the adhesion of the transparent glass plate is
Since this is usually done by heat treatment such as passing through a high-temperature furnace, the adhesive of the image sensor may melt during the process of bonding the transparent glass plate. Therefore, the position of the element moves due to the tension of the bonding wire connected to the element.
, there is a problem that the S-accuracy deteriorates as the light incidence surface approaches.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a solid-state imaging device in which element characteristics are improved and positioning of a light incident surface is made highly accurate.

[Summary of the invention]

The present invention achieves the above object by forming a metallized pattern on a light-transmitting body for protecting and sealing an image sensor, and closely fixing the light-transparent body to the light incident surface of the image sensor. It is something.

That is, in the solid-state imaging device of the present invention, a light-transmitting body on which a metallized pattern is formed and an image sensor on which an electrode is formed on a light incident surface, the metallized pattern and the electrode of the imaging cord are electrically bonded together. It is characterized by being integrated by adhering with materials.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. First, FIG. 3 shows a plan view of a light-transmissive body on which a metallized pattern used in the present invention is formed. As shown in this figure, a metallized pattern is formed on the surface of the light-transmissive body 2a provided on the light incident surface of the solid-state imaging device to which the elements are bonded, and this metallized pattern is formed on the electrodes of the imaging device. (pad), a group of electrodes 9 having the same arrangement, a group of wiring 10 connected to this electrode 9, and a group of connecting electrodes 1 connected to this group of wiring 10 and used for connection with external wiring.
Consists of 1. Further, a conductive adhesive 12 is provided on the electrode group 9, and a pad of an image sensor is connected and fixed via this adhesive 12. A glass plate or a plastic plate can be used as the light-transmitting body. As adhesive materials, Ag, Au
A conductive epoxy resin containing fine powder may be used.

FIG. 4 shows a cross-sectional view of the solid-state imaging device of the present invention. As shown in this figure, the pad of the image sensor 3 and the metallized portion of the light-transmitting body 2a are adhesively fixed with a conductive material 12, and the image sensor and the light-transparent body are integrated. . To fix the imaging probe and the light-transmitting body, first, a conductive adhesive is applied to the desired metallized portion to be connected to the pad of the element.
This can be done by arranging the elements so that the bonded portions coincide, and then bonding the metallized portion of the light-transmitting body and the pad of the imaging cord by thermocompression bonding. For example, after a light-transmitting body is placed and fixed so as to match the pad of the element, the conductive adhesive is melted by passing it through a high-temperature furnace, thereby bonding the pad and the metallized portion.

Furthermore, for the purpose of protecting the image sensor and improving mechanical strength, it is preferable to fix and seal the periphery of the image sensor 3 with a resin material 14.

With the above configuration, integration of the image sensor and the light-transmitting body is achieved.

〔Effect of the invention〕

In the solid-state imaging device of the present invention, the light-transmitting body on which the metallized pattern is formed and the imaging element are integrally fixed via a conductive adhesive. The space between the device and the body is eliminated, and it is possible to prevent deterioration of device characteristics due to the adhesion of dust and dirt. Furthermore, since the electrodes of the element and the metallized portion are connected integrally using a conductive adhesive, it is possible to achieve high accuracy in setting the element at the center of the optical axis. Furthermore, since the unnecessary space inside the imaging device is reduced to t, there is an effect that the device can be made smaller.

[Brief explanation of the drawing]

1 and 2 are a cross-sectional view and a plan view of a conventional solid-state SP device, respectively, FIG. 3 is a plan view of a light-transmitting body in an imaging device of the present invention, and FIG. 4 is a plan view of a conventional solid-state SP device. FIG. 2 is a cross-sectional view of a solid-state imaging device. 1... Ceramic container, 2... Transparent glass plate, 2a
... Light-transmitting body, 3 ... Image pickup element, 4, 5 ... Adhesive material, 6 ... Bonding wire, 7 ... Metallized wiring, 8 ... Lead, 9 ... Electrode, DESCRIPTION OF SYMBOLS 10... Wiring, 11... External connection electrode, 12... Conductive adhesive, 13... Optical axis center, 14... Resin material. Applicant's agent Kiyoshi Inomata Engraving of the drawing (no change in content) 51 Figure also 2 m Flood 3 Draft procedure amendment (method) % formula % 1. Indication of the case 1982 Patent Application No. 232308 2. Invention Name: Solid-state imaging device 3, person making the amendment Relationship to the case Patent applicant (307) Tokyo Shibaura Electric Co., Ltd. Power of attorney, specification, drawings, and contents of amendments (1) The power of attorney is amended as shown in the attached sheet.

Claims (1)

[Scope of Claims] 1. A light-transmissive body on which a metallized pattern is formed and an image sensor on which an electrode is formed on a light incident surface, the metallized pattern and the electrode of the image sensor are bonded together using a conductive adhesive. A solid-state imaging device characterized by being integrated by. 2. The solid-state imaging device according to claim 1, wherein the light-transmitting body is a glass plate.