JPS59119701A - Method of forming resistance material - Google Patents
Method of forming resistance materialInfo
- Publication number
- JPS59119701A JPS59119701A JP22676182A JP22676182A JPS59119701A JP S59119701 A JPS59119701 A JP S59119701A JP 22676182 A JP22676182 A JP 22676182A JP 22676182 A JP22676182 A JP 22676182A JP S59119701 A JPS59119701 A JP S59119701A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- thermal
- resistance value
- resistance
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、抵抗体の形成方法に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a method of forming a resistor.
従来、混成集積回路装置等に広く使用されている抵抗体
は， Ｒｕ０２系の抵抗体ペーストをアルミナセ゛ラミ
ック等からなる基板の所定領域に印刷し、焼成して形成
されたものである。このようにして形成された抵抗体は
、耐熱性に優れておシ、シかも抵抗値にも変動が少なく
安定した特性を有するが、貴金属系統のペーストを使用
するため創造コストが高い。製造コストを低減させるた
めに、フェノール樹脂基板上に樹脂層を基礎化してカー
ボン抵抗体を形成したものが開発されている。このよう
な抵抗体は、製造コストを低減させて、しかも比較的低
温（１５０〜２００℃）で形成できる利点を有するが、
基板自体の耐塩を高々８０℃温度にしか保てない欠点が
ある。Conventionally, resistors widely used in hybrid integrated circuit devices and the like are formed by printing a Ru02-based resistor paste on a predetermined area of a substrate made of alumina ceramic or the like and firing the paste. The resistor formed in this manner has excellent heat resistance and stable characteristics with little fluctuation in resistance value, but the production cost is high because a paste based on noble metals is used. In order to reduce manufacturing costs, carbon resistors have been developed in which a resin layer is used as a base on a phenolic resin substrate to form a carbon resistor. Such a resistor has the advantage of reducing manufacturing costs and being able to be formed at relatively low temperatures (150 to 200°C).
The drawback is that the salt resistance of the substrate itself can only be maintained at a temperature of 80°C.
これらの抵抗体の形成方法に代わるものとして、溶射に
よシ抵抗体を形成する方法が開発されている。この溶射
による抵抗体の形成方法は、プラズマ溶射ガンと称せら
れる電極量に、不活性ガスとしてアルゴンまたはヘリウ
ムの混合ガスを供給し、電極量に電気アークを発生させ
てガスを励起させ、熱プラズマを生じさせる。この熱プ
ラズマの発生した炎の中に抵抗体の材料である粉体を導
入して溶かし、溶かしたままの状態で抵抗体の形成材料
を基板上の所定領域に付着させるものである。As an alternative to these methods of forming resistors, a method of forming resistors by thermal spraying has been developed. This method of forming a resistor by thermal spraying involves supplying a mixed gas of argon or helium as an inert gas to an electrode called a plasma spray gun, generating an electric arc in the electrode to excite the gas, and generating a thermal plasma. cause Powder, which is the material for the resistor, is introduced into the flame generated by this thermal plasma and melted, and the material for forming the resistor is adhered to a predetermined area on the substrate in the melted state.
このような１溶射技術を採用した抵抗体の形成方法は、
既に知られ、例えば特開昭５３−５２９９５、特開昭５
５−１４６９０６の各号公報にも示されている。The method for forming a resistor using such thermal spraying technology is as follows:
Already known, for example, JP-A-53-52995, JP-A-5
5-146906.
何れも、抵抗体材料をプラズマ溶射して抵抗体被覆を堆
積した膜状抵抗体の製造方法について述べている。All of them describe a method for manufacturing a film resistor in which a resistor coating is deposited by plasma spraying a resistor material.
しかし、記述されているところのに従って形成された厚
い膜状抵抗体は、その抵抗特性を一定にしない欠点が認
められる。抵抗値が安定せず、熱履歴があるとき抵抗値
が例えば−３０℃〜＋１５０°Ｃの熱履歴の前後で異な
る値を示し、繰返される熱履歴につれてその抵抗値が増
大してゆく現象がみられるのである。このため温度によ
って一次的に抵抗値が決まらないという本質的な欠点を
伴う。However, a thick film resistor formed according to the method described has the disadvantage that its resistance characteristics are not constant. There is a phenomenon in which the resistance value is not stable and when there is a thermal history, the resistance value shows different values before and after the thermal history from -30°C to +150°C, and the resistance value increases as the thermal history is repeated. It will be done. Therefore, there is an essential drawback that the resistance value is not determined primarily by temperature.
即ち、従来の溶射法による抵抗値被覆法は、大気中で金
属、合金、セラミック等を単独および混合粉末を溶融状
態で絶縁基板上に溶射するために溶射特有の空孔が被覆
層に介在する。更に、大気中で溶射するために金属、合
金が酸化するなどして被覆層の付着力および抵抗特性が
不安定である欠点を有していた。そのため、粉末の粒度
調整や溶射条件を選択することによって被覆層の空孔低
下および付着力はある程度改善させられる。しかし、熱
履歴による抵抗の変動を防ぐ充分な方策ではない。In other words, in the conventional resistance coating method using thermal spraying, pores unique to thermal spraying are present in the coating layer because metals, alloys, ceramics, etc. are sprayed in the atmosphere in the molten state onto an insulating substrate. . Furthermore, since the metals and alloys are oxidized due to thermal spraying in the atmosphere, the adhesion and resistance characteristics of the coating layer are unstable. Therefore, by adjusting the particle size of the powder and selecting thermal spraying conditions, the reduction in pores and the adhesion of the coating layer can be improved to some extent. However, this is not a sufficient measure to prevent resistance fluctuations due to thermal history.
この発明は溶射によって形成される抵抗体を、温度特性
女性に得させる改良された抵抗体の形成方法を提供させ
るものである。The present invention provides an improved method for forming a resistor that allows a resistor formed by thermal spraying to have improved temperature characteristics.
本発明は、基板に形成する全ての抵抗体の抵抗体形成領
域が露出するようにレジスト膜やメタルマスクによって
所定のシート抵抗値のもの毎に対応した形状と配置のマ
スクを用い、３ＱＴｏｒｒ〜２００Ｔｏｒｒ減圧下の調
整 囲気で溶射法にょシ被覆性能が高く、かつ温度特性
に安定な抵抗体を形成できるようにした抵抗体の形成方
法である。The present invention uses a resist film or a metal mask with a shape and arrangement corresponding to each predetermined sheet resistance value so that the resistor formation regions of all the resistors formed on the substrate are exposed. Adjustment under reduced pressure This is a method of forming a resistor that has high coating performance and stable temperature characteristics compared to thermal spraying in an ambient atmosphere.
・以下、図面を参照してこの発明の一実施例を説明する
。- Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
先ず、４０Ｘ５０− 厚さ２−のアルミニウム板の片面
に１００μｍのアルミ＋絶縁層を施した基板４を第１図
に示す真空容器１の固定治具５に設置する。First, a substrate 4 made of a 40×50-2-thick aluminum plate with a 100 μm aluminum+insulating layer on one side is placed in the fixing jig 5 of the vacuum vessel 1 shown in FIG.
基板を設置後容器内を１０ ’Ｔｏｒｒ程度に減圧し、
Ｎｉ→Ｃｒ粉末の溶射条件設定と同時に容器内を７０Ｔ
ｏｒｒのＡ ｒ ／Ｈ１ガス 囲気に調整する。After installing the substrate, reduce the pressure inside the container to about 10' Torr,
At the same time as setting the thermal spraying conditions for Ni→Cr powder, the inside of the container was heated to 70T.
A r /H1 gas of orr Adjust to ambient atmosphere.
しかる後、Ｎｉ−Ｃｒ粉末を金属マスクを通して溶射し
、厚さ２０１１ｍの抵抗体を形成する。同様に、Ｃｕ粉
末を溶射し電極端部を抵抗体の端部と接続す形成された
被膜は空孔のない性能の高い被膜が樽られるのに比べ大
気中７６０Ｔｏｒｒ（ａ）で形成され被膜は空孔ととも
に酸化層が介在し抵抗体被膜としては充分でない。Thereafter, Ni--Cr powder is sprayed through a metal mask to form a resistor with a thickness of 2011 m. Similarly, the coating formed by thermally spraying Cu powder and connecting the end of the electrode to the end of the resistor is formed at 760 Torr (a) in the atmosphere, compared to a high-performance coating without pores. An oxide layer is present along with the pores, making it insufficient as a resistor coating.
一方、電極Ｃｕも７ＱＴｏｒｒの雰囲気で溶射すること
によって被膜は酸化することなく光沢のある電極が得ら
れ電極自身の、付着力と同様に抵抗体との付着力も向上
する。午の実施例に係る抵抗体と、大気中で溶射した比
較例抵抗体について２０’Ｃから１５０℃への繰返し熱
履歴による抵抗値変化率Ｃ％）について図３に示す。On the other hand, by thermally spraying the electrode Cu in an atmosphere of 7Q Torr, a glossy electrode is obtained without oxidizing the coating, and the adhesion force with the resistor is improved as well as the adhesion force of the electrode itself. FIG. 3 shows the resistance change rate (C%) due to repeated heat history from 20'C to 150C for the resistor according to the example and the comparative resistor sprayed in the atmosphere.
実施例に係る抵抗体（１）の抵抗値は熱履歴によって変
動しないが、比較例に係る抵抗体（２）は熱履歴に↓り
・て抵抗値が変動し、抵抗値を不安定にし、抵抗体とし
て使用に適さない。The resistance value of the resistor (1) according to the example does not vary depending on the thermal history, but the resistance value of the resistor (2) according to the comparative example fluctuates depending on the thermal history, making the resistance value unstable. Not suitable for use as a resistor.
尚、上記実施例においては、ＮｉＣｒ粉末を用いて説明
したが、これに限らず抵抗性物質であればよいことは勿
論である。In the above embodiment, NiCr powder was used, but the material is not limited to this, and any resistive material may be used.
以上のようにして形成された抵抗体は、熱履歴によって
抵抗値を変化することなく、安定した抵抗体特性を示し
膜抵抗器として実用価値を向上し、回路部品としての応
用範囲が拡がシ実用に好適する。The resistor formed as described above does not change its resistance value due to thermal history, exhibits stable resistor characteristics, improves its practical value as a film resistor, and expands its range of applications as a circuit component. Suitable for practical use.
第３図は、実施例並びに比較例抵抗体に繰返し熱履歴を
施した時の抵抗変化率を示す線図である。
１：真空容器、２ａ：溶射ガン、２ｂ＝粉末供給管２Ｃ
：作動サス管、２ｄ：電源ホース、３：プラズマ炎４：
基板、５：基板固定治具、６：真空ポンプ代理人 弁理
士 則近憲佑（はか１名）第１図
Ｚ
第３図
−〉４１）つゝえし」１室１１慶
第２図
（久ン
（ム）FIG. 3 is a diagram showing the rate of change in resistance when the example and comparative example resistors are subjected to repeated thermal history. 1: Vacuum container, 2a: Thermal spray gun, 2b = Powder supply pipe 2C
: Operating suspension tube, 2d: Power hose, 3: Plasma flame 4:
Board, 5: Board fixing jig, 6: Vacuum pump representative Patent attorney Kensuke Norichika (1 person) Fig. 1Z Fig. 3-〉41) Tsueshi” 1 room 11 Kei Fig. 2 (Kun (mu)
Claims (1)
ｒの不活性劣囲気下で溶射形成させることを特徴とする
特許A resistive material is placed on an insulating substrate at a temperature of 3 to 200 Torr.
A patent characterized by spraying formation under an inert, subdued atmosphere of r.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22676182A JPS59119701A (en) | 1982-12-27 | 1982-12-27 | Method of forming resistance material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22676182A JPS59119701A (en) | 1982-12-27 | 1982-12-27 | Method of forming resistance material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59119701A true JPS59119701A (en) | 1984-07-11 |
| JPH047082B2 JPH047082B2 (en) | 1992-02-07 |
Family
ID=16850196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22676182A Granted JPS59119701A (en) | 1982-12-27 | 1982-12-27 | Method of forming resistance material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119701A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6347409B1 (en) | 1993-08-05 | 2002-02-19 | Ansell Healthcare Products Inc. | Manufacture of rubber articles |
| US7709766B2 (en) | 2002-08-05 | 2010-05-04 | Research Foundation Of The State University Of New York | System and method for manufacturing embedded conformal electronics |
-
1982
- 1982-12-27 JP JP22676182A patent/JPS59119701A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6347409B1 (en) | 1993-08-05 | 2002-02-19 | Ansell Healthcare Products Inc. | Manufacture of rubber articles |
| US7709766B2 (en) | 2002-08-05 | 2010-05-04 | Research Foundation Of The State University Of New York | System and method for manufacturing embedded conformal electronics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH047082B2 (en) | 1992-02-07 |
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