JPS59119186A - 板状ヒ−トパイプ - Google Patents

板状ヒ−トパイプ

Info

Publication number
JPS59119186A
JPS59119186A JP23219282A JP23219282A JPS59119186A JP S59119186 A JPS59119186 A JP S59119186A JP 23219282 A JP23219282 A JP 23219282A JP 23219282 A JP23219282 A JP 23219282A JP S59119186 A JPS59119186 A JP S59119186A
Authority
JP
Japan
Prior art keywords
wick
heat pipe
wall
plate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23219282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6235593B2 (enExample
Inventor
Migiwa Ando
安藤　汀
Yukiaki Ito
伊藤　幸昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tokushu Togyo KK
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Nippon Tokushu Togyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd, Nippon Tokushu Togyo KK filed Critical NGK Spark Plug Co Ltd
Priority to JP23219282A priority Critical patent/JPS59119186A/ja
Publication of JPS59119186A publication Critical patent/JPS59119186A/ja
Publication of JPS6235593B2 publication Critical patent/JPS6235593B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP23219282A 1982-12-24 1982-12-24 板状ヒ−トパイプ Granted JPS59119186A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23219282A JPS59119186A (ja) 1982-12-24 1982-12-24 板状ヒ−トパイプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23219282A JPS59119186A (ja) 1982-12-24 1982-12-24 板状ヒ−トパイプ

Publications (2)

Publication Number Publication Date
JPS59119186A true JPS59119186A (ja) 1984-07-10
JPS6235593B2 JPS6235593B2 (enExample) 1987-08-03

Family

ID=16935430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23219282A Granted JPS59119186A (ja) 1982-12-24 1982-12-24 板状ヒ−トパイプ

Country Status (1)

Country Link
JP (1) JPS59119186A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002076165A1 (en) * 2001-03-19 2002-09-26 Harris Corporation Electronic module including a cooling substrate and related methods
JP2004088048A (ja) * 2002-07-05 2004-03-18 Sony Corp 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
JP2004085186A (ja) * 2002-07-05 2004-03-18 Sony Corp 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法。
KR100486710B1 (ko) * 2001-05-15 2005-05-03 삼성전자주식회사 미세 윅(Ｗｉｃｋ) 구조를 갖는 씨피엘(ＣＰＬ) 냉각장치의 증발기
CN105091645A (zh) * 2015-09-01 2015-11-25 胡祥卿 一种微重力分子传热热导体及用途

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002076165A1 (en) * 2001-03-19 2002-09-26 Harris Corporation Electronic module including a cooling substrate and related methods
KR100486710B1 (ko) * 2001-05-15 2005-05-03 삼성전자주식회사 미세 윅(Ｗｉｃｋ) 구조를 갖는 씨피엘(ＣＰＬ) 냉각장치의 증발기
JP2004088048A (ja) * 2002-07-05 2004-03-18 Sony Corp 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
JP2004085186A (ja) * 2002-07-05 2004-03-18 Sony Corp 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法。
CN105091645A (zh) * 2015-09-01 2015-11-25 胡祥卿 一种微重力分子传热热导体及用途

Also Published As

Publication number Publication date
JPS6235593B2 (enExample) 1987-08-03

Similar Documents

Publication Publication Date Title
US5870823A (en) Method of forming a multilayer electronic packaging substrate with integral cooling channels
WO1985002515A1 (fr) Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication
CN216597591U (zh) 一种显示模组及显示装置
JPS59119186A (ja) 板状ヒ−トパイプ
WO2024139605A1 (zh) 非对称刚挠结合板的制造工艺
EP4141896A1 (en) Magnetic power component and power module to which magnetic power component is applied
CN214407103U (zh) 一种柔性均热板
JPS59173690A (ja) ヒ−トパイプ構造ｉｃ基板
CN211141946U (zh) 多元件集成式胶带组件
CN118984523A (zh) 一种嵌有含孔陶瓷散热体电路板及其制备方法
CN113767470A (zh) 即烧结型银膜
JP3023492B2 (ja) 複合プリント配線板の製造方法
CN212625546U (zh) 板级扇出型散热结构及电子元器件
CN212499279U (zh) 一种透气性好的覆铜板
CN223978837U (zh) 一种二次回流焊隔热装置
JP2915468B2 (ja) プリント基板の冷却構造
CN218162997U (zh) 一种防翘曲的高性能陶瓷基板
US20070131448A1 (en) Circuit board structure with heat radiating layer
CN221948409U (zh) 一种高导热陶瓷印刷电路板结构
CN218632091U (zh) 一种多晶倒装芯片封装结构
CN112738980A (zh) 一种散热板与印制板之间绝缘方法
CN205584616U (zh) 散热效率高用于摄像头模组的fpc板
CN211297136U (zh) 一种覆铜板及功率器件
CN223810072U (zh) 一种用于航天电子组件的散热结构
CN112770537B (zh) 一种铜基电路板制作方法及铜基电路板