JPS59118959A - Heat insulating panel for building - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention involves filling the inside of a substantially U-shaped member with a synthetic resin foam, and filling the exposed surface of the synthetic resin foam with a synthetic resin foam.

This invention relates to a heat insulating board for construction, to which a back sheet made of aluminum, waterproof paper, etc. is attached in order to prevent warping and improve heat insulating properties.

[Background technology]

Conventionally, this type of thermal insulation board for construction, as shown in FIG. As shown in Fig. 2, the approximately F-shaped material 1, which is conveyed by a conveyor 4.4'' below -L in an upwardly open state in the direction a, is first placed in a cotton blending machine. 5, the synthetic resin foam 2 is injected, and 9, the back sheet 3 fed out from the uncoiler 6 is pressed onto the synthetic resin foam 2 that is in the process of foaming by the upper conveyor 4, and then 1 The resin foam 2 was foamed and cured, and the back sheet 3 was adhesively fixed by its self-adhesive force.

However, in this case, during manufacturing, a release agent is applied to the upper conveyor 4 in order to improve the separation between the back sheet 3 or the leaked synthetic resin foam 2 and the conveyor 4 on the -1- side. Therefore, during construction, the mold release agent remains on the surface of the back sheet 3, making it difficult to adhere and fix it to the construction base surface even if an adhesive is used.

[Purpose of the invention]

The present invention was invented in view of the above-mentioned background art. 1. That is, the purpose is to be able to easily remove the mold release agent that adheres during manufacturing, and to
To provide a heat insulating board for construction which can be adhesively fixed to a subsurface without using an adhesive.

[Disclosure of the invention]

The present invention will be explained below based on the drawings.

The architectural insulation board shown in FIG. 3 is one embodiment of the present invention.
Filling the inside of the roughly U-shaped shrine 1 with a synthetic resin foam 2,
A back sheet 3 is attached to the exposed surface of the synthetic resin foam 2, and %l is applied to the surface of the back sheet 3 via an adhesive layer 7.
It is made by pasting an l-1 type sheet 8. The substantially U-shaped member 1 is extruded from synthetic resin 9, and has a fitting piece 9 projecting outward on one side plate. The other side plate portion is integrally provided with an IM matching groove 10 that is concave inward. As shown in FIG. 4, the architectural heat insulating board is placed inside a substantially U-shaped material 1 of a fixed length, which is conveyed via a spacing holder 11 with the upper and lower convex hairs 4 and 4 degrees open upward in the direction a. First, a synthetic resin foam 2 made of urethane resin is injected by a kneader 5, and then a back sheet 3 as shown in FIG. Adhesive layer 7.
A sheet body 12 formed by laminating the release sheets 1 and 8 is fed out from the uncoiler 6 with the release sheets 8 on the two sides, and the upper layer is placed on top of the synthetic resin foam 2 during foaming. The sheet body 12 is manufactured by being pressed down by a conveyor 4, and then the synthetic resin foam 5 is foamed and cured, and the sheet body 12 is adhesively fixed by its self-adhesive force. In this case, in order to improve the separation between the sheet body 12 or the leaked synthetic resin foam 2 and the upper hair 4, a release agent is applied to the upper hair 4. Therefore, in this thermal insulation board for construction, a mold release agent adheres to the surface of the sheet body 12 during manufacturing, but the mold release agent does not peel off the mold release sheet 8 that forms the surface of the sheet body 12 later. Moreover, during construction, the adhesive layer 7 remains on the surface of the back sheet 3 after the release sheet 8 is peeled off, as shown in FIG.
It can be adhesively fixed to the construction base surface 13 without using adhesive. In addition, in the construction insulation board, the fitting pieces 9 and the fitting grooves 10 are fitted and connected to each other, and fixed to the construction base surface 13 with nails 14, but the adhesive layer 7 is not used for adhesion. The fixing is effective as temporary fixing or other supplementary fixing means.
As in the embodiment shown in the figure, the back sheet 3. Adhesive layer 7. By pasting the sheet body 12 formed by laminating the release sheets 8 so as to cover both side edges of the substantially U-shaped member 1, leakage of the synthetic resin foam 2 can be prevented during manufacturing.

During construction, the adhesive area by the adhesive layer 7 is fixed, and the adhesive layer 7 is not fixed in a connected manner as in the embodiment shown in FIG. It is also possible to use a heat insulating board for construction.

〔Effect of the invention〕

As mentioned above, the architectural heat insulating board of the present invention has a substantially U-shaped member filled with a synthetic resin foam, a back sheet is attached to the exposed surface of the synthetic resin foam, and a back sheet is attached to the surface of the back sheet. Since the release sheet is pasted through the adhesive layer, the release agent adheres to the surface of the Type 1 sheet during 9J construction, but the release agent cannot be removed after the release sheet is peeled off. It can be easily removed by
Since the adhesive layer remains on the surface of the back sheet after the release sheet is peeled off δ11, it can be adhesively fixed to the construction base surface without using an adhesive.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing a conventional example of the present invention, Fig. 2 is a schematic diagram showing the manufacturing process of the conventional example, Fig. 3 is a sectional view showing an embodiment of the present invention, and Fig. 4 is a sectional view showing the same embodiment. A schematic diagram showing the manufacturing process of the example, FIG. 5 is a sectional view taken along the line X-X in FIG. 4, FIG. 6 is a sectional view showing the construction state of the same example, and FIGS. It is a sectional view showing an example. In the figure, 1 is a substantially U-shaped material, 2 is a synthetic resin foam, and 3 is a U-shaped material.
is the back sheet, 4.4' is the conveyor, 5 is the kneading machine, 6
is an uncoiler, 37 is an adhesive layer, 8 is a release sheet, 9 is a fitting piece, 10 is a fitting groove, ] 1 is a spacer, 12 is a sheet body, 13 is a construction base surface, and 14 is a nail . Patent applicant Matsushita Electric Works Co., Ltd. Representative patent attorney Toshimaru Takemoto (and 2 others)

Claims (1)

[Claims] 1) Fill the inside of the approximately U-shaped material with synthetic resin foam,
A heat insulating board for construction, comprising a back sheet attached to the exposed surface of the synthetic resin foam, and a release sheet attached to the surface of the back sheet via an adhesive layer.