JPS59118899A - Plating device - Google Patents

Abstract

PURPOSE:To eliminate the defects such as corrosion on the surface of an object to be subjected to plating and passivation by constituting a titled device in such a way that electricity can be conducted to a lifting arm and a rack and maintaining both in a conducted state before the object contacts with a plating soln. CONSTITUTION:A titled device is constituted of a rack 2 which is constituted of a conductive material and fixes an object 3 to be subjected to plating, a lifting arm 1 which holes both ends of said rack, moves upward and downward the rack 2, and applies potential on an object 3 via the rack 2, a plating bath 6 having electrodes 5 which are provided in the down position of the rack 2 and are applied with the potential of the polarity reversed from the polarity of the rack, and having a plating soln. 7, and a receiving base 4 which is provided in the bath 6, holds the end part of the rack 4 and applies the plating potential on the rack 2. Electricity is conducted to the object 3 by such constitution before the object 3 is dipped in the soln. 7.

Description

DETAILED DESCRIPTION OF THE INVENTION +a) Field of the Invention The present invention relates to self-plating equipment, and more particularly to ninety methods for energizing a wave-rejecting plated object to be plated.

Tb) Background of the technology The plating process on the surface of objects to be plated, such as typefaces in printers, is automated to achieve quick production.

(C) Prior art' FIG. 1 is a diagram showing the principle of conventional self-plating processing.

In the figure, 1 is the lifting arm, 2 is the rack, 3 is the object to be plated, 4 is the support, 5 is the anode, 6 is the plating bath, and 5 is the plating solution. An arm 3' is provided to suspend the object to be plated. Also, the rack 2 and the arm 3',
The receiver base 4 is made of a conductive member. Explain the operation. The elevating arm 1 is placed at the position shown by the dotted line when plating is not performed, and moves to the solid line position when plating is performed.
Further, the rack 2 is lowered until it is held on the pedestal 4. When the elevating arm 1 is at the broken line position, the object 3 to be plated is automatically or manually set together with the rack 2 on the support portion 1' of the elevating arm l. When the lifting arm 1 descends, the object 3 to be plated is immersed in the plating solution of the plating bath 6.

The pedestal 4 and the anode 5 are not shown in the drawings.
[Each is given a predetermined electrification that makes it negative and positive polarity.

Therefore, when the lifting arm 1 is lowered F and the rack 2 comes into contact with the pedestal 4, the plating process will start.Then, after enough time has passed for plating, the lifting arm 1 will be lifted and lowered automatically. The arm 1 rises and the object 3 to be plated is taken out from the plating solution 7 in the plating bath 6, completing the plating process.

In the conventional plating device as described above, the rack 2,
The plated object 3 is plated before the receiver contacts the table 4.
, '2, there is a drawback that the object 3 to be plated is corroded or passivated by the plating solution 7.

(d) Object of the Invention The object of the present invention is to provide a plating apparatus capable of plating without corroding or passivating the object to be plated, in order to eliminate the above-mentioned conventional drawbacks.

(θ) Borrowing of the Invention In order to achieve the above object, in the present invention, the lifting arm is also borrowed to obtain an iEL through the rack, and at least:
Before the object to be plated comes into contact with the plating solution, the object to be plated has one pole of the plating reservoir.

(f) Embodiment FIG. 2 is an explanatory diagram of the principle of an embodiment of the present invention, and FIG. 3 is a perspective view of the main part.

In the figure, the same parts as those used in FIG. 1 are designated by the same numbers.

Further, reference numeral 10 denotes a support portion, and in the case of this embodiment, this support portion 10' is made of an electrically conductive member.

In FIG. 3, 11, 12, 14.16 are conductive rods, 13.15 is a conductive brush, one is an arm, and 18 is a threaded rod, which are connected to a rotational drive system (not shown), such as a motor. 19 is a guide rod for raising and lowering the arm l'7 by rotating it.

In the present invention, the potential of the conductive rod 16 as a cathode is always
Or it is applied when the switch yf (not shown) is activated. Further, the conductive rod 14 is fixed in an upright position at a position where the brush 13 is always in contact. The conductive rod 14 is fixed to a frame (not shown) with screws, etc. The plan 15e provided at the tip of l a contacts the 4-way rod 16. Therefore, the support part 10 is connected to the brush 15 and the lead 1LFt frame by giving the 6th position to the η7-way rod 16. 14, brush 13, conduction rod 12, conduction (will always have a potential through rll).

In addition, 5 tons of electricity is constantly energized. To explain the operation, when the elevating arm 1 is located at the broken line position shown in Figure 12, the object 3 to be plated is set on the rack 2 via the arm 3' on the support part 10.

Second, start the motor etc. mentioned above with the switch mentioned above.
J) Then, the threaded rod 18 rotates. At this time, at the same time, conduction is made to '++, =ii ii. The threaded rod 18 has a female threaded portion 17' provided on a portion of one arm.
is engaged, and since the guide m 1'7// of arm 1 is engaged with the guide rod 19, the threaded rod 1
8 rotates, the arm 17 moves in the downward direction.

As described above, the support portion 10 is provided with a potential that can serve as a cathode for plating, so the object to be plated 3 has the same potential as the cathode. As the arm 17 moves, the brush 13 slides on the surface of the conductive rod and the four conductive rods 16
and rack 2.

When the object 3 to be plated comes into contact with the plating solution, the object 3 to be plated
The contact area becomes a cathode, and plating starts immediately. Thereafter, the support part 10 continues to be lowered in the same manner as before, the rack 2 is placed on the cradle number, and the screw rod 1 is driven by the motor.
8 stops rotating.

The pedestal 4 is brought to the same potential as the conductive rod 16 via a lead wire 4'. Therefore, even when the rack 2 is transferred to the pedestal 4 from the support section 10', the object 3 to be plated is always held as a cathode.

(e) Effectiveness of the Invention According to the present invention as explained, at least the object to be plated is energized before it comes into contact with the plating solution, so that the surface of the object to be plated is not corroded or It can eliminate the drawbacks of passivation etc.

In addition, in the above embodiment, using a conductive rod and a brush,
Although the configuration is such that electricity is constantly applied to the wave-plated object, the present invention is not limited to this, but in short, the configuration is such that conduction between the cathode, the lifting arm, and the rack can be established at least before the plated object comes into contact with the plating solution. It would be good if it were done.

[Brief explanation of drawings]

FIG. 1 is a principle diagram of a conventional plating apparatus, and FIGS. 2 and 3 are a principle diagram and a perspective view of essential parts of an embodiment of the present invention. In the figure, 1 is a lowering arm, 2 is a rack, 3 is an object to be plated, 4 is a pedestal, 5 is an anode, and 6 (li plating bath) is a plating solution. l -1t, -1'1', a4-rlLJ+ wa 1 Figure

Claims (1)

[Claims] A rack made of a conductive material and to which a part of the object to be plated is fixed; and an elevating arm that holds both ends of the rack and raises and lowers the rack, and applies an electric potential to the object to be plated through the rack. , provided at the lowering position of the rack, an electrode having a potential opposite to the potential and a plating bath for carrying the plating solution, and provided in the plating bath to hold the end of the rack. The plating method is characterized in that the rack is provided with a support for applying the plating, the readable plated item is immersed in at least a plating solution, and the readable plated item is energized from the front.