JPS6054400B2 - plating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of the Invention The present invention relates to a self-service plating device, and more particularly to a method for energizing an object to be plated during plating.

(b) Background of the technology The process of plating the surface of a plated object, such as printer type, is automated to achieve mass production.

(c) Conventional technology FIG. 1 is a diagram showing the principle of conventional self-loading processing.

In the figure, 1 is a lifting arm, 2 is a rack, 3 is a plating object, 4 is a pedestal, 5 is an anode, 6 is a plating bath, and 7 is a plating liquid.

The object 3 is provided with an arm 3' for suspending the object from the rack 2.

Further, the rack 2, arm 3', and pedestal 4 are made of conductive material. Explain the operation. The elevating arm 1 is placed at the position indicated by the broken line while plating is not being performed, and when plating is being performed, it moves to the position shown by the solid line and is further lowered until the rack 2 is held on the pedestal 4. When the lifting arm 1 is in the broken line position, the attached object 3 is attached to the support part 1' of the lifting arm 1 together with the rack 2.
automatically or manually. When the elevating arm 1 descends, the object 3 to be plated is immersed in the plating solution 7 of the plating bath 6. A predetermined potential is applied to the pedestal 4 and the anode 5 from a power source (not shown) so that each has negative and anode polarity. Therefore, the plating process is started when the elevating arm 1 descends and the rack 2 comes into contact with the pedestal 4.

Then, after sufficient time has passed for plating, the lifting arm 1 is automatically raised and the object 3 to be plated is taken out from the plating liquid 7 in the plating bath 6, completing the plating process. do. In the conventional plating apparatus as described above, the object 3 to be plated is immersed in the plating liquid 7 before the rack 2 and the pedestal 4 come into contact with each other. There is a disadvantage that the plated object 3 is corroded or passivated.

(d) Object of the Invention The object of the present invention is to provide a plating device that can plate without corroding or passivating the object to be plated, in order to eliminate the above-mentioned conventional drawbacks.

(e) Structure of the Invention In order to achieve the above object, in the present invention, the elevating arm is also configured to be able to conduct electricity to the rack, and at least before the object to be plated comes into contact with the plating liquid, the It is designed so that objects have one pole for glazing.

(f) Embodiment FIG. 2 is an explanatory diagram of the principle of an embodiment of the present invention, and FIG. 3 is a perspective view of the main parts.

In the figure, the same parts as those used in FIG. 1 are designated by the same numbers.

Further, reference numeral 10 denotes a support section, and in the case of this embodiment, this support section 1'' is made of an electrically conductive member.

In FIG. 3, 11, 12, 14 and 16 are conductive rods, 13 and 15 are conductive brushes, 17 is an arm, and 18 is a threaded rod, which is connected to a rotational drive system (not shown), such as a motor. 19 is a guide rod for raising and lowering the arm 17 by rotation.
In the present invention, the potential of the conductive rod 16 as a cathode is always
Or it is applied when a switch not shown is activated.

Further, the conductive rod 14 is fixed upright at a position where the brush 13 is always in contact. The conduction rod 14 is fixed to a frame (not shown) with screws or the like, and a brush 15 provided at the tip of the conduction rod 14 contacts the conduction rod 16. Therefore,
By applying a potential to the conductive rod 16, the support part 10 can be connected to the brush 15, the conductive rod 14, the brush λ etc. 13, the conductive rod 12,
A potential is always maintained through the conductive rod 11. Further, the anode 5 is always energized. Explain the operation. In FIG. 2, when the lifting arm 1 is located at the position shown by the broken line,
A mounted object 3 is set on a rack 2 via an arm 3'' and is set on a support part 10.

Thereafter, when the aforementioned motor or the like is started using the aforementioned switch, the threaded rod 18 rotates. At this time, the conductive rod is energized at the same time. The threaded rod 18 is engaged with a female threaded portion 17'' provided on a part of the arm 17, and the guide rod 19 is engaged with the guide portion 1r of the arm 17, so that the threaded rod 18 cannot be rotated. When the arm 17 is moved, the arm 17 moves in the downward direction.As described above, since the support part 10 is applied with a potential that can serve as a cathode for plating processing, the object 3 to be plated
has a potential equivalent to that of the cathode. As the arm 17 moves, the brush 13 slides on the surface of the conducting rod to maintain electrical connection between the conducting rod 16 and the rack 2. When the object 3 to be plated comes into contact with the plating liquid 7, the contact portion of the object 3 to be plated becomes a cathode, and plating starts immediately.

Thereafter, the support part 10 continues to descend in the same manner as before, and the pedestal 4
The rack 2 is placed on the rack 2, and the rotation of the threaded rod 18 by the motor is stopped. The pedestal 4 is set at the same potential as the conductive rod 16 via a lead wire 4'. Therefore, even when the rack 2 is transferred from the support part 1' to the pedestal 4, the covered object 3 is always held as a cathode. (e) Effects of the Invention As explained above, according to the present invention, since the object to be plated is energized before it comes into contact with the plating liquid, the surface of the object to be plated is not corroded. , passivation etc. can eliminate the drawbacks.

In addition, in the above embodiment, using a conductive rod and a brush,
Although the configuration is such that electricity is always applied to the plated object, the present invention is not limited to this.In other words, the structure is such that conduction between the cathode, the lifting arm, and the rack is established at least before the plated object comes into contact with the plating solution. It is good if it is configured as follows.

[Brief explanation of the drawing]

FIG. 1 is a principle diagram of a conventional plating apparatus, and FIGS. 2 and 3 are a principle diagram and a perspective view of essential parts of an embodiment of the present invention. In the figure, 1 is a lifting arm, 2 is a rack, 3 is a fitting, 4 is a pedestal, 5 is an anode, 6 is a fitting bath, and 7 is a fitting liquid.

Claims (1)

[Claims] 1. A rack made of a conductive material on which the object to be plated, which becomes one electrode during plating, is mounted, and an elevator that holds both ends of the rack, applies a potential to the object to be plated, and raises and lowers the position of the object to be plated relative to the plating bath. an arm, a plating bath provided under the elevating arm and having an electrode having a potential opposite to that of the plating solution and the object to be plated; and a plating bath provided above the plating bath to hold the rack. The rack is provided with a cradle that holds the object to be plated in the plating solution and applies a plating potential to the rack, and with the rack supported by the elevating arm, the elevating arm descends and the object to be plated is plated. A plating device characterized in that a current-carrying circuit is formed from the moment it comes into contact with a liquid.