JPS59117123A - Resist remover - Google Patents

Abstract

PURPOSE:To remove a resist film on the edge of a wafer easily and avoid the insufficiency of exposure and etching defect caused by resist powder by porous member impregnated by solvent to the circumference surface of the rotating wafer. CONSTITUTION:A porous member 13 is pressed to the circumference surface of a wafer 12, on which a resist film 11 is formed, while the wafer 12 is rotated. The porous member 13 is impregnated by the solvent, which is suitable for the material of the resist film 11 and supplied by a solvent supplying tube 14, so that only the resist film wrapped in the circumference of the wafer 12 is easily removed. As a result, the resist film is prevented from touching the transfer guide or the wafer fall off protecter of a carrier and the remaining fraction of the resist film is prevented from adhering to the surface of the wafer 12.

Description

[Detailed description of the invention] [Technical field of invention] TECHNICAL FIELD The present invention relates to a resist removal device.

[Technical background of the invention]

Conventionally, on the surface of sea urchin...? -) After applying a type of resist, the production of semiconductor devices is carried out.

In order to remove unnecessary resist attached to the periphery of the wafer, as shown in FIG. The solvent 4 is dripped onto the periphery of the sample 3.

[Problems with background technology]

However, when the solvent is dropped onto the peripheral edge of the rotating wafer 2, the area coated with the resist film 3 becomes smaller, as shown in FIG. 2(A). Therefore, the result is essentially the same as reducing the diameter of the wafer 2, and productivity is reduced. Further, as shown in FIG. 2B, it is difficult to remove the resist film 3 near the so-called orientation flat 2a whose peripheral edge is cut out. Furthermore, if the wafer 2 is placed on the wafer chuck 2 in an eccentric state,
), the removed portion of the resist film 3 is uneven and cannot be removed uniformly. As a result, there have been problems such as insufficient exposure and poor etching due to resist powder.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a resist removal device that can easily remove a resist film on an esso part of a wafer, prevent insufficient exposure and etching defects caused by the resist film, and improve wafer productivity. That is.

[Summary of the Invention] The present invention provides for easily removing the Rennost film at the edge of the wafer by impregnating a porous member impregnated with a solvent on the circumferential surface of the rotating wafer. This is a renost removing apparatus 1t that can prevent insufficient exposure and etching defects and improve wafer productivity.

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

443 is an explanatory diagram showing a schematic configuration of one embodiment. In the figure, 10 indicates a wafer 12 coated with a resist film 11.
This is a wafer chuck with a fixed wafer. wafer chuck 10
is designed to rotate at a rotational speed of, for example, 1000 to 6000 rpm. A porous member 13 is placed near the wafer chuck 10 so that the surface of the wafer 120 comes into contact with it.
is hanging down. The porous member 13 is formed of, for example, a cylindrical velvet part. A solvent supply pipe 14 is connected to the porous member 13 . An elastic member 15 such as a spring is attached to the side of the solvent supply pipe 14. The porous member 13 is made of silane by this elastic member 15.
It is pressed toward the center of the chuck 10. Elastic member 1
The other end of 5 is connected to an extrusion mechanism including an air cylinder 16 and the like.

According to the resist removing apparatus U configured in this manner, the wafer 12 on which the resist M 11 is formed is removed by 20
While rotating at a rotational speed of 0 to 3000 rpm, the porous member 13 is still in contact with its peripheral surface. A solvent suitable for the material of the resist film 11 is supplied from the solvent supply tube 14 and impregnated into the porous member 13, so that the wafer is impregnated as shown in FIG.・Only the cyst film can be easily removed. In addition, since the porous member 13 is extruded along the center direction of the wafer chuck lθ, it is possible to completely remove the resist film wrapped around the Ft1M orientation flat surface 12a. As a result, sea urchin...
During the transportation of the wafer 12, the wafer 12 can be prevented from coming into contact with the wafer fall prevention part of the transport guide or carrier, and the chipped remaining part of the wafer 12 can be prevented from adhering to the surface of the wafer 12. . Therefore, insufficient exposure and etching defects due to the Lennost film can be prevented.

Furthermore, since only the resist film wrapped around the peripheral surface of the wafer 12 can be completely removed, the effective diameter of the 7'C wafer 12 coated with the resist film 11 can be increased. As a result, the wafer coated with Lesost Sniff 11
You can improve 12 raw 1S items.

〔Effect of the invention〕

As explained above, the resist removal apparatus according to the present invention can easily remove the resist film on the edge portion of the wafer, prevent insufficient exposure and etching defects due to the Renost film, and improve wafer productivity. This has remarkable effects, such as the ability to

[Brief explanation of drawings]

Figure 2 (4) to Figure 2 (C) are explanatory diagrams showing the state of the wafer after the resist on the peripheral surface has been removed by conventional means. 3 is an explanatory diagram showing the schematic configuration of one embodiment of the present invention, and FIG. 4 (support) and FIG. It is an explanatory view showing the state of the sea urchin from which the lenost on the peripheral surface has been removed. 10... Wafer chuck, 11... Renost film, 1
2...way, 13...porous member, 14...
Solvent supply pipe, 15...Elastic member, 16...Air cylinder, U...Resist coating device. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 3 Figure 4 (B) and = B → 2 1

Claims (1)

[Claims] a wafer chuck that has a wafer fixing surface at its tip and is rotatably installed; a porous member that is provided near the wafer chuck so that the circumferential surface of the wafer is in contact with the wafer chuck;
It is characterized by comprising a solvent supply pipe connected to the porous member, and an elastic member attached to the solvent supply pipe so as to extrude the porous member toward the center of the wafer chuck. resist removal equipment.