JPS59115693U - Mounting structure of electronic components to heat sink - Google Patents
Mounting structure of electronic components to heat sinkInfo
- Publication number
- JPS59115693U JPS59115693U JP736883U JP736883U JPS59115693U JP S59115693 U JPS59115693 U JP S59115693U JP 736883 U JP736883 U JP 736883U JP 736883 U JP736883 U JP 736883U JP S59115693 U JPS59115693 U JP S59115693U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- mounting structure
- electronic components
- contact area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係る電子部品の取付構造を示す斜視図
、第２図は別の実施例に係る電子部品の取付構造を示す
斜視図である。
１：ヒートシンク、２． ２’ ：電子部品、３：押
え金具、３ｂ、 ３ｂ’ ：折曲部。FIG. 1 is a perspective view showing an electronic component mounting structure according to the present invention, and FIG. 2 is a perspective view showing an electronic component mounting structure according to another embodiment. 1: heat sink, 2. 2': Electronic component, 3: Holding metal fitting, 3b, 3b': Bent part.
Claims (2)
柱等の形状で発熱を伴う電子部品を押え金具を介してヒ
ートシンクの板面に当接固定するにあたり、上記ヒート
シンクに対する接触部分を除く電子部品の周側面形状と
相応する押え金具の折曲部で電子部品を抱込み支持した
ことを特徴とする電子部品の取付構造。(1) When an electronic component that generates heat in the form of a cylinder or a prism with a small contact area with the heat sink is fixed in contact with the plate surface of the heat sink via a holding metal fitting, the peripheral surface of the electronic component excluding the contact area with the heat sink. A mounting structure for an electronic component, characterized in that the electronic component is held and supported by a bent portion of a holding fitting corresponding to the shape.
れているところの実用新案登録請求の範囲第１項記載の
電子部品の取付構造。(2) The electronic component mounting structure according to claim 1, wherein the holding metal fitting is made of a material with good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP736883U JPS59115693U (en) | 1983-01-22 | 1983-01-22 | Mounting structure of electronic components to heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP736883U JPS59115693U (en) | 1983-01-22 | 1983-01-22 | Mounting structure of electronic components to heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59115693U true JPS59115693U (en) | 1984-08-04 |
Family
ID=30138900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP736883U Pending JPS59115693U (en) | 1983-01-22 | 1983-01-22 | Mounting structure of electronic components to heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59115693U (en) |
-
1983
- 1983-01-22 JP JP736883U patent/JPS59115693U/en active Pending
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