JPS6014002U - embedded hardware - Google Patents

embedded hardware

Info

Publication number
JPS6014002U
JPS6014002U JP10591683U JP10591683U JPS6014002U JP S6014002 U JPS6014002 U JP S6014002U JP 10591683 U JP10591683 U JP 10591683U JP 10591683 U JP10591683 U JP 10591683U JP S6014002 U JPS6014002 U JP S6014002U
Authority
JP
Japan
Prior art keywords
embedded hardware
embedded
hardware body
welding
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10591683U
Other languages
Japanese (ja)
Inventor
茂 村山
Original Assignee
石川島播磨重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 石川島播磨重工業株式会社 filed Critical 石川島播磨重工業株式会社
Priority to JP10591683U priority Critical patent/JPS6014002U/en
Publication of JPS6014002U publication Critical patent/JPS6014002U/en
Pending legal-status Critical Current

Links

Landscapes

  • Joining Of Building Structures In Genera (AREA)
  • Forms Removed On Construction Sites Or Auxiliary Members Thereof (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す斜視図、第２図は溶接時
にフィトノットを起こした状態でスタッドを含む面での
断面図である。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the plane including the stud with a phytoknot raised during welding.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] コンクリート表面に埋込む埋込金物本体に、該埋込金物
本体へのサポート等の溶接による熱を大気中に放つため
の放熱板を設けたことを特徴とする埋込金物。An embedded hardware body that is embedded in a concrete surface is provided with a heat dissipation plate for dissipating heat from welding of supports to the embedded hardware body into the atmosphere.
JP10591683U 1983-07-07 1983-07-07 embedded hardware Pending JPS6014002U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10591683U JPS6014002U (en) 1983-07-07 1983-07-07 embedded hardware

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10591683U JPS6014002U (en) 1983-07-07 1983-07-07 embedded hardware

Publications (1)

Publication Number Publication Date
JPS6014002U true JPS6014002U (en) 1985-01-30

Family

ID=30248073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10591683U Pending JPS6014002U (en) 1983-07-07 1983-07-07 embedded hardware

Country Status (1)

Country Link
JP (1) JPS6014002U (en)

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