JPS5911084A - Solid-state image pickup device for color - Google Patents

Abstract

PURPOSE:To obtain a high-contrast picture which is free from flares, by providing an optical low-pass filter having light shielding part formed on the side surface to the surface of a solid-state image pickup device. CONSTITUTION:A CCD chip 11 is fixed on a package 13, and a color filter array 15 is formed on the upper surface of the chip 11. The array 15 contains the transmitting parts of red, green and blue respectively arranged checkerwise. An optical low-pass filter 17 is adhered on the surface of the opening part of the package 13. A light shielding part 18 is formed with carbon, etc. on the circumference side surface of the filter 17. This filter 17 reduces the horizontal image resolution by making use of a double refraction effect. Therefore, it is possible to obtain a high-contrast picture by vignetting in spite of surface soil. Furthermore, an input of the high-frequency component is prevented to eliminate the beat disturbance.

Description

[Detailed Description of the Invention] [Technical field of Akira Tsuwo] Akira Kibo is concerned with a solid-state R image device for non-Japanese color, which has a solid-state image pickup device such as a COD, a color filter array, and an optical low-pass filter.

[Technical background of the invention and its problems] ``JIi (solid-state color dance using solid-state image device 1)
Research and development of fA devices is actively being carried out. A color solid-state image retrieval device is one in which a color filter array is formed on the photosensitive surface of a solid-state R image element such as a COD or MOS, and is usually used in a hermetically sealed state in a package.

Conventionally, this type of packaged solid l1iiPli
The device is a ceramic package in which a color solid-state image element is housed and fixed 1), and a glass plate coated with a resin-like molten adhesive, such as a sealer, is placed on the package so as to cover one part of the back cover. , just 200
The package was manufactured by passing it through a firing furnace at temperatures close to 10°C to melt the adhesive and bonding the package to a glass plate.

In this conventional color solid state image device, for example, the second
By forming an optical image on the surface of a solid-state image carrier through a color filter array such as the IC shown in the figure, 1q color information can be obtained. Since V-pumping is applied, there are problems such as beat interference and moiré at the outline of the subject.

To solve this problem, an optical pass filter is used that takes advantage of the birefringence of crystal. By inserting an optical low-pass filter into the color solid-state imaging device in the middle of the beam of light, it is possible to remove high frequency components of the optical image of the object and reduce beat disturbance. However, when such ti optical components are installed, the reflection of light increases,
The disadvantages include that flare occurs, making it impossible to obtain a clear image, and that the brightness of the optical image becomes weak, resulting in poor sensitivity. Furthermore, since birefringent plates (optical [corvus filters]) using crystal usually have a thickness of 1.2 to 1.5 mm, the light that enters from the side of the optical low-pass filter is This has the disadvantage that flare occurs, causing further fogging and deterioration of the optical image.

[Purpose 1 of the present invention was made in view of the above points,
The purpose of this project is to create a new color solid-state decoy image device that makes it possible to obtain clear images without flare.

The present invention is a color solid-state imaging device in which the solid-state imaging device is made airtight by providing an optical II-bus filter with a light blocking portion formed on the side surface on the surface of the solid-state historical imaging device.

[Embodiment 1 of Defense] Hereinafter, one embodiment of the present invention will be explained in detail with reference to the drawings.

FIG. 1 shows the cross-sectional structure of the color solid 11i (I-vis) of the present invention.
is a ceramic package (13) with adhesive (12)
It is glued and fixed in place. The terminals of the COD chip (11) and the terminals of the ceramic package (13) are connected by bonding wires (14) made of aluminum or gold.
A color filter array (15) is formed on the D chip (11).

For example, as shown in FIG. 2, the color filter array (15) has a light transmitting portion R1, a green transmitting portion G, and a blue transmitting portion B formed in a checkered pattern.

An optical low-pass filter (17) is adhesively fixed to one part of the surface of the lamic package (13) with an adhesive (16). A light blocking portion (18) made of 7J-bon or the like is provided on the side surface of the periphery.

Optical low-pass filter (17) 4.1 For example, an optical filter that utilizes the birefringence effect of quartz crystal is generally used to avoid the effect of lowering resolution in the horizontal direction.

[Bright effect 1] When the color solid-state resolution device of the present invention is placed inside the ceramic package (13), 1:l=J'? Since the optical image is the light that has passed through the optical [1-pass filter (17)], it is clear in the horizontal direction (and contains high frequency components) without causing any beat disturbance between it and the color filter array (15). B≧Color images can be obtained.Furthermore, compared to conventional devices in which the surface of the device is hermetically sealed with a glass plate, it has the advantage that color images are not damaged by dust such as dust. Hermetically sealed 11 with optical low pass filter (17)
Because of this, no matter how many small particles of dust are deposited on the surface of the device, it will be optically blurred and resolved in the horizontal direction, which will have a large effect on the color image obtained from COD. !It won't get wet.Furthermore, the optical low pass filter (17) usually has a thickness of about 1.2 to 1.5 mm.
When light enters from around the side of the optical low-pass filter (17), flare occurs in which the entire optical image is covered with light. This has the remarkable effect of increasing the sharpness of the image since the light is no longer reflected back.

[Other Examples of Explanation] In the above explanation, it has been explained that the light blocking section (18) is provided only on the side surface of the optical 1-1-pass filter (17), but The optical low-pass filter (17) is installed by covering the light blocking part (38) to the surface of the ceramic package (13).
) can also be covered with a light shielding part (38) if it is outside the effective angle of view.In this case, the light shielding part (38-
) It is also possible to omit the adhesive (16) by using an opaque adhesive (-). This has the advantage of further simplifying the process. Alternatively, the optical low-pass noilter (17) can be fixed and covered directly on the color filter array (15) via an adhesive (48).

It is said that the reflection of light on the surface of the J, color filter, and C filter array (15) and the reflection of light on the surface C of the optical L1-pass filter (17) can be eliminated, further improving the light efficiency. There are advantages. Furthermore, the thickness of the entire device can be reduced, and the color camera can be miniaturized as a whole.

Furthermore, as shown in Fig. 5, by filling the gap in the sea urchin package (13) with a light blocking part (58), it is possible to increase the light blocking efficiency and achieve airtight sealing at the same time. It is. In this case, it has the effect of making the product even more A゜).

It goes without saying that in cases where the surface of the color filter array (15) is mechanically weak, an optical low-pass filter (17) may be provided via a protective film.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a solid-state dance image device for color of the present invention;
Figure 2 (a schematic diagram showing the configuration of a color filter array);
FIGS. 3, 4, and 5 are sectional views showing other embodiments of the present invention. 11...CCI) chip, 13...Relamic package, 15...Color filter array 17...Optical Ll-pass filter, 18.38.58...Light Interception Department agent, patent attorney Kensuke Norichika (and 1 other person) 1st
Figure 2 Figure 3 Figure 7 /4 f3 // fl /3 Figure 4 Figure 5

Claims (2)

[Claims] (1) In a color solid-state imaging device in which an optical image is formed on the surface through a color filter array and a solid-state imaging element is housed in a package, 1. Optical with a light blocking part formed on the side [I-bus filter solids inside the package 111g! A solid-state imaging device for use in electronic cameras, characterized in that the element is hermetically sealed. (2) Optical low-pass filter is a color filter array