JPS59110792A - Preventing method of easily soluble alloy for plating electrode from coming off - Google Patents
Preventing method of easily soluble alloy for plating electrode from coming offInfo
- Publication number
- JPS59110792A JPS59110792A JP22065482A JP22065482A JPS59110792A JP S59110792 A JPS59110792 A JP S59110792A JP 22065482 A JP22065482 A JP 22065482A JP 22065482 A JP22065482 A JP 22065482A JP S59110792 A JPS59110792 A JP S59110792A
- Authority
- JP
- Japan
- Prior art keywords
- easily soluble
- alloy
- soluble alloy
- contact
- contact member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
【発明の詳細な説明】 (a)発明の技術分野 本発明はめっき電極用易溶合金の離脱防止法に関する。[Detailed description of the invention] (a) Technical field of the invention The present invention relates to a method for preventing detachment of easily soluble alloys for plating electrodes.
(b)技術の背景
プレス成型等基本的成形が終った接触部材(例えばリー
ドスイッチのリード片等)は、接触の安定性能を得る為
、金、ロジウム等の貴金属めっきをして所定とする接点
機能を取得する。然し、めっき時、めっき電極と接触部
材との接続確実に行い接触部材に流れるめっき電流を均
一にすると共に、接触部材の電極取付けを簡易とするこ
とが望まれる。即ち、めっき厚バラツキの少ない均一な
る接点性能をを得すると共に、めっき加工の生産性を高
める為、易溶合金の電極治具を用いて接続が行なわれる
。(b) Background of the technology Contact members that have undergone basic forming such as press molding (for example, reed switch reed pieces) are plated with a precious metal such as gold or rhodium to ensure contact stability. Get features. However, during plating, it is desirable to ensure the connection between the plating electrode and the contact member, to make the plating current flowing through the contact member uniform, and to simplify the electrode attachment of the contact member. That is, in order to obtain uniform contact performance with little variation in plating thickness and to increase the productivity of plating, connection is performed using an electrode jig made of easily meltable alloy.
前記の接点めっきが了った接触部材は、スイッチ組立に
入るが、めっき電極との接続部分に付着の易溶合金を剥
離若しくは離脱するを要し、該離脱が不完全であると以
後の接触部材組立に支障となる。After the contact plating has been completed, the contact member is assembled into a switch, but it is necessary to peel off or remove the easily fusible alloy attached to the connection part with the plated electrode, and if this removal is incomplete, subsequent contact will be prevented. This will hinder the assembly of parts.
本発明は、前記の要請に基づき接触部材の表面に付着す
る易溶合金の剥離と該剥離後の表面固着をなす具体的手
段を提示したものである。The present invention proposes specific means for peeling off the easily soluble alloy adhering to the surface of a contact member and fixing the surface after the peeling based on the above-mentioned requirements.
(C)従来技術の問題点
前記接触部材の一例として、前記リードを取り上げこれ
をめっき治具に装着した側面図を第1図に示す。(C) Problems with the Prior Art As an example of the contact member, FIG. 1 shows a side view of the lead taken up and mounted on a plating jig.
図中、1はリード片、2は1を多数装着する平板状の易
溶合金で固めためっき電極、3は電解めっき浴、4はリ
ード片のガイド板、及び5は前記治具の脚である。又、
6はリード片の接点部、7は前記接点部6とは反対側の
リード片端子部でここはスイッチ組立機のチャック機構
に嵌入される。In the figure, 1 is a lead piece, 2 is a plated electrode hardened with a flat plate-shaped easily meltable alloy, 3 is an electrolytic plating bath, 4 is a guide plate for the lead piece, and 5 is a leg of the jig. be. or,
6 is a contact portion of the lead piece, and 7 is a lead piece terminal portion on the opposite side from the contact portion 6, which is fitted into a chuck mechanism of a switch assembly machine.
ところで、接点めっき済みのリード片端子表面に付着す
る易溶合金(第2図は組立前のリード片斜視図であり図
中斜線記入部分が対象部分)は遊離し易く、特にスイッ
チ組立時、端子表面から離脱しこれが微粒子状となって
スイッチ内に封入される訂念も生じ甚だ不都合である。By the way, the easily fusible alloy that adheres to the surface of the contact-plated lead piece terminal (Figure 2 is a perspective view of the lead piece before assembly, and the shaded area in the figure is the target area) is easily separated, especially when assembling the switch. This is a serious inconvenience as it separates from the surface and becomes particulates which become enclosed within the switch.
(d)発明の目的 本発明は前記の問題点を解消することである。(d) Purpose of the invention The present invention is to solve the above problems.
即ち、爾後の組立工程に於て支障となる接触部材表面の
易溶合金を安定に固着することである。That is, the purpose is to stably fix the easily soluble alloy on the surface of the contact member, which would be a hindrance in the subsequent assembly process.
(e)発明の構成
前記の目的は、温水浴に接触部材を浸漬して前記付着の
易溶合金を剥離し次いで蓚酸稀釈溶液中、超音波加振に
より接触部材表面に付着する易溶合金の固着を行うこと
により達成される。(e) Structure of the Invention The above object is to immerse the contact member in a hot water bath to peel off the adhering easily soluble alloy, and then remove the easily soluble alloy adhering to the surface of the contact member by ultrasonic vibration in a diluted oxalic acid solution. This is achieved by fixation.
(f”)発明の実施例
対象の易溶合金として、Pb−Zn−Tn絹成の70〜
80°Cで溶融する低熔融合金がある。(f'') As the easily soluble alloy for the embodiment of the invention, Pb-Zn-Tn silk 70~
There is a low melting alloy that melts at 80°C.
係るめっき電極接続用の易溶合金を除去するに際し1本
発明によれば1表面付着の合金体が低融点であることか
ら、少なくとも80℃の塩水中に接触部材を浸漬して端
子表面の合金体を遊δ11状態とし、且つこの時、脱脂
洗浄等に用いる紹音波励振器による振盪をして、端子部
付着の大半の合金体を水中に離脱する。所謂泣落しによ
る端子表面の平滑化を行う。According to the present invention, when removing the easily soluble alloy for connecting plated electrodes, the alloy on the terminal surface is removed by immersing the contact member in salt water of at least 80°C, since the alloy body attached to the surface has a low melting point. The body is brought to a free δ11 state, and at this time, it is shaken using a sonic exciter used for degreasing and cleaning, etc., to remove most of the alloy body attached to the terminal portion into the water. Smooth the terminal surface by so-called weeping.
次いで、前記により離脱しきらなかった表面の易溶合金
を前記温度の蓚酸稀釈溶液(重量比0.5〜10%程度
の稀釈溶液)中で前記同様の超音波加振による振盪を行
う。Next, the easily soluble alloy on the surface that has not been completely separated is shaken by ultrasonic vibration in the same manner as described above in a diluted oxalic acid solution (diluted solution with a weight ratio of about 0.5 to 10%) at the above temperature.
後者の蓚酸稀釈溶液中の加振は、接触部材の端子等の表
面に残留する半田を固着するに有効である。The latter vibration in the oxalic acid diluted solution is effective for fixing the solder remaining on the surface of the terminal etc. of the contact member.
前記処理を2例図(第2図)のリード片に施行すれば爾
後のり一ドスイソチ絹立が容易となり。If the above-mentioned treatment is applied to the reed pieces shown in the two examples (Fig. 2), it will be easier to later attach the reeds.
該組立時2問題とされた端子表面からの易溶合金粉が飛
散する等接点に有害な異物がスイッチ内に封入される様
なことはなくなる。This eliminates the possibility of harmful foreign matter being enclosed in the switch at the contact point where easily melted alloy powder is scattered from the terminal surface, which was the second problem during assembly.
然し、前記実施例は何もリードスイッチに限定されない
。同類の例えば接点機能を重視する且つ生産性を高める
接触部材の加工等に適用しても構わない。However, the embodiments described above are not limited to reed switches. The present invention may also be applied to processing of similar contact members, for example, where contact function is emphasized and productivity is increased.
(g)発明の詳細
な説明の本発明のめっき電極用易溶合金の離脱防11−
法は、前工程に於ける接点部めっき処理手段と併用して
行うことにより、この種部品の生産性を向上するに極め
て有効である。係る観点から本発明の実用的価値は大き
い。(g) Preventing detachment of easily meltable alloy for plating electrodes of the present invention in detailed description of the invention 11-
This method is extremely effective in improving the productivity of this type of parts when used in conjunction with contact plating treatment in the previous process. From this point of view, the present invention has great practical value.
第1図は本発明の対象とする易溶合金からなるめっき電
極体構成の簡略側面図である。第2図はめっき済み接触
部材の斜視図である。
図中、7は易溶合金の付着の端子部分である。
第 1 口FIG. 1 is a simplified side view of the structure of a plated electrode body made of an easily meltable alloy, which is the object of the present invention. FIG. 2 is a perspective view of a plated contact member. In the figure, 7 is the terminal portion to which the easily melted alloy is attached. 1st mouth
Claims (1)
易溶合金の離脱防止方法に於て、温水浴に接触部材を浸
漬して前記付着の易溶合金を剥離し次いで蓚酸稀釈溶液
中、超音波加振により接触部材表面に付着する易溶合金
の固着を行うことを特徴とするめっき電極用易溶合金の
離脱防止法。In a method for preventing detachment of the easily soluble alloy used as a contact plating electrode that adheres to the surface of a contact member, the attached easily soluble alloy is peeled off by immersing the contact member in a hot water bath, and then ultrasonically applied in a diluted oxalic acid solution. A method for preventing detachment of easily soluble alloys for plating electrodes, which is characterized by fixing easily soluble alloys adhering to the surface of contact members by vibration.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22065482A JPS59110792A (en) | 1982-12-16 | 1982-12-16 | Preventing method of easily soluble alloy for plating electrode from coming off |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22065482A JPS59110792A (en) | 1982-12-16 | 1982-12-16 | Preventing method of easily soluble alloy for plating electrode from coming off |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59110792A true JPS59110792A (en) | 1984-06-26 |
Family
ID=16754352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22065482A Pending JPS59110792A (en) | 1982-12-16 | 1982-12-16 | Preventing method of easily soluble alloy for plating electrode from coming off |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59110792A (en) |
-
1982
- 1982-12-16 JP JP22065482A patent/JPS59110792A/en active Pending
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