JP2515659B2 - Semiconductor element lead frame gripping jig - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element lead frame gripping jig for transporting a semiconductor element lead frame by sandwiching the upper end portion thereof and further performing solder plating on the semiconductor element lead frame while sandwiching it. is there.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, a method of applying solder plating to a lead frame having semiconductor elements mounted thereon is to install two to four (four in the figure) lead frames on a jig 41 called a rack. The lead frame was mounted, transferred, and then this lead frame together with the jig 41 was dipped in a solder plating tank to perform solder plating.

[0003]

However, in the above-mentioned conventional method, since the lead frame is soaked in the solder plating tank together with the jig 41, the jig 41 itself is large, and a large plating tank is required accordingly, and further plating is required. There was a problem that the amount of plating solution taken out from the tank was large.

The present invention has been made in view of the above points, and it is possible to perform a plating process by transporting a single semiconductor element lead frame while sandwiching the upper end portion thereof, and immersing the semiconductor device lead frame in the solder plating bath while sandwiching the semiconductor element lead frame. An object is to provide a small and compact semiconductor element lead frame gripping jig.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a pair of semiconductor element lead frame gripping jigs rotatably and oppositely supported by a lower end portion of a column via a support shaft. And a gripping jig for sandwiching the semiconductor lead frame between the lower ends of the pair of sandwiching members by elastically pushing the upper portions of the support shafts of the pair of sandwiching members in a direction away from each other by an elastic member. The current of the solder plating process can be applied by connecting the electrode to the horizontal bar fixed to the upper part of the support while the predetermined part of the holding member of the holding jig holding the semiconductor lead frame is immersed in the solder plating tank. It is characterized in that it is configured as follows.

Further, the gripping jig is provided with an open holding mechanism for holding the lower end portions of the pair of holding members in a state of being separated from each other.

[0007]

According to the present invention, by configuring the semiconductor element lead frame gripping jig as described above, the gripping jig becomes small and compact, and the semiconductor element lead frame can be sandwiched by itself and immersed in the solder plating tank. Therefore, each processing tank for plating processing can be made extremely small, and the amount of the solution taken out from each processing tank is small, and the processing solution can be saved.

Further, since the open holding mechanism for holding the lower end portions of the pair of holding members in a state of being separated from each other is provided,
As will be described later, it is possible to remove the solder plating on the facing surface of the lower end portion of the sandwiching member in a short time.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are views showing the structure of a semiconductor device lead frame gripping jig of the present invention, FIG. 1 is a side view, and FIG. 2 is a sectional view taken along the line AA of FIG.

Semiconductor device lead frame gripping jig 10
The pair of sandwiching members 15 and 16 are rotatably and oppositely supported by a support shaft 17 at the lower end of the pillar 12 made of a metal material. Two claw portions 15-1, 15-2, 16-1, 16-2 are provided at the lower portions of the sandwiching members 15, 16, respectively.
Is formed, and the upper portions 15a and 16a are substantially inverted U outwardly.
It is formed in a letter shape. The spring 1 is provided between the upper portions 15a and 16a of the holding members 15 and 16 and the column 12, respectively.
3, 14 are interposed, and the upper portions of the support members 15, 16 are pressed outward with the support shaft 17 as the center. Further, the horizontal bar 11 is fixed to the upper part of the column 12.

The upper part of the sandwiching members 15 and 16 is attached to the spring 1.
By pushing outward with 3, 14, the claws 15-1, 15-
2 and the claw portions 16-1 and 16-2 contact each other, and the upper end of the semiconductor element lead frame 19 is sandwiched between them. Horizontal bar 1
1 is gripped by another mechanism not shown and the gripping jig 10 is transferred. Further, when it is immersed in a solder plating tank and left there for a certain period of time, it is configured so that the electrode portions (cathode) of the solder plating tank come into contact with both ends 11a and 11b of the horizontal bar, and current is supplied from here. The lead frame 19 is subjected to solder plating.

When the semiconductor element lead frame 19 is removed, as shown in FIG. 3, the upper portions 15a and 16a formed in the inverted U shape on the upper portions of the sandwiching members 15 and 16 are indicated by arrows B and C by another mechanism (not shown). When pushed in the direction, clamping member 1
5, 16 claw portions 15-1, 15-2 and claw portions 16-1, 1
6-2 is separated and the lead frame 19 is opened.
A box-shaped frame plate 18 for holding the claw portions 15-1 and 15-2 and the claw portions 16-1 and 16-2 in an open state is provided outside the sandwiching members 15 and 16. By pushing 18 from the D position to the E position by another mechanism (not shown), even if the pushing force in the directions of arrows B and C of the upper portions 15a and 16a of the holding members 15 and 16 is released, the claw portions 15-1 and
15-2 and the claw portions 16-1 and 16-2 remain open.

The claw portions 15-1 and 15-2 for sandwiching the upper end portion of the lead frame 19 and the tip portions F and F of the claw portions 16-1 and 16-2 are solder-plated together while being dipped in a solder plating tank. However, in order to remove this solder plating, it is necessary to immerse the nail portions 15-1, 15-2, 16-1, 16-2 in the stripping solution for a certain period of time. In this case, it is difficult to completely peel off the solder plating in a short time when the opposing surfaces of the tip portions F and F are in close contact, but as described above, the frame plate 18 is moved from the D position to the E position. By pushing to the position,
Since the claw portions 15-1 and 15-2 and the claw portions 16-1 and 16-2 remain open, the effect is exhibited in the solder plating removal process.

[0014]

As described above, according to the present invention, the following excellent effects can be obtained. (1) Since the gripping jig is small and compact, and the semiconductor element lead frame can be sandwiched by itself and immersed in the solder plating tank, each tank for plating processing can be made extremely small and the amount of liquid taken out from each tank. It is possible to save processing liquid.

(2) Since the open holding mechanism for holding the lower ends of the pair of holding members in a state of being separated from each other is provided,
As will be described later, it is possible to remove the solder plating on the facing surface of the lower end portion of the sandwiching member in a short time.

[Brief description of drawings]

FIG. 1 is a side view showing a structure of a semiconductor element lead frame gripping jig of the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG. 1;

FIG. 3 is a side view showing a state in which the semiconductor element lead frame gripping jig of the present invention is opened.

FIG. 4 is a diagram showing an example of a conventional semiconductor element lead frame solder plating jig.

[Explanation of symbols]

 10 Grasping jig 11 Horizontal bar 12 Struts 13, 14 Spring 15, 16 Clamping member 17 Support shaft 18 Frame plate 19 Semiconductor element lead frame

Claims (2)

(57) [Claims] 1. A pair of sandwiching members rotatably and oppositely supported on a lower end portion of a support column via a support shaft, and an upper portion of the pair of sandwiching members above the support shafts is made of an elastic member. A grasping jig is configured to sandwich the semiconductor lead frame between the lower ends of the pair of sandwiching members by elastically ejecting in a separating direction, and a predetermined portion of the sandwiching member of the sandwiching jig sandwiching the semiconductor lead frame is soldered. A jig for holding a semiconductor device lead frame, characterized in that a current is applied to a solder plating process by connecting an electrode to a horizontal bar fixed to the upper part of the support while being immersed in a plating tank. 2. The semiconductor device lead frame gripping jig according to claim 1, wherein the gripping jig comprises an open holding mechanism for holding the lower ends of the pair of holding members in a state of being separated from each other. .