JPS63215372A - Method for refining solder - Google Patents
Method for refining solderInfo
- Publication number
- JPS63215372A JPS63215372A JP4905187A JP4905187A JPS63215372A JP S63215372 A JPS63215372 A JP S63215372A JP 4905187 A JP4905187 A JP 4905187A JP 4905187 A JP4905187 A JP 4905187A JP S63215372 A JPS63215372 A JP S63215372A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- alloy
- precious metal
- molten solder
- molten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims description 18
- 238000007670 refining Methods 0.000 title claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 31
- 239000010970 precious metal Substances 0.000 claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- 229910000510 noble metal Inorganic materials 0.000 claims description 16
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 15
- 239000002253 acid Substances 0.000 abstract description 8
- 238000011084 recovery Methods 0.000 abstract description 4
- 238000010992 reflux Methods 0.000 abstract description 4
- 238000003756 stirring Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 15
- 239000000047 product Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 230000005496 eutectics Effects 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000009528 severe injury Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明ははんだの精製方法に関し、特に半導体製品の製
造工程で用いられるはんだの精製及びはんだ中の貴金属
の回収に係る。[Detailed Description of the Invention] [Purpose of the Invention (Industrial Application Field) The present invention relates to a method for refining solder, and in particular to refining solder used in the manufacturing process of semiconductor products and recovering precious metals in the solder.
（従来の技術）
現在、半導体製品の製造工程では、例えばＡｇ、Ａｕ、
Ｃｕ等がめっきされたリードフレームやリードワイヤを
、例えば５ｎ−Ｐｂ系の共晶はんだ浴に浸漬（はんだデ
ィップ）して、はんだ付する工程が行われている。この
ため、長時間はんだディップに使用したはんだ浴中には
、上述したＡｇ％Ａｕ５Ｃｕ等の貴金属が多く含まれて
いる。(Prior Art) Currently, in the manufacturing process of semiconductor products, for example, Ag, Au,
A process is performed in which lead frames and lead wires plated with Cu or the like are dipped in a 5n-Pb eutectic solder bath (solder dip) and soldered. Therefore, the solder bath used for long-time soldering dip contains a large amount of noble metals such as the above-mentioned Ag%Au5Cu.
このような貴金属は、はんだの融点を上昇させたり、は
んだの接合界面で金属間化合物となり接合強度を低下さ
せる。このため、はんだ中の貴金属が多くなった場合に
は、従来ははんだの交換を行なっている。しかし、この
はんだの交換作業は、はんだ槽から溶融はんだを外へ出
し、新しい溶融はんだを入れるという作業であるため、
手間がかかるうえに危険を伴い、しかもはんだの使用量
が多くなることからコストの上昇を招いている。Such noble metals increase the melting point of the solder or form intermetallic compounds at the solder joint interface, reducing the joint strength. For this reason, when the amount of precious metal in the solder increases, conventionally the solder is replaced. However, this solder replacement work involves taking the molten solder out of the solder bath and putting in new molten solder.
This process is time-consuming and dangerous, and requires a large amount of solder, leading to an increase in costs.
また、上記のような貴金属ははんだ中の含有量が少ない
ものの、高価なものであるため、その回収が行なわれて
いる。従来、この回収は、貴金属含有率が高くなったは
んだを酸（例えば王水等）で溶解した後、貴金属のみを
沈澱分離、イオン交換等によって濃縮して粗食金属とし
、更に湿式又は乾式の電解等により精製して純金属とす
るという方法で行なわれている。同様に不良品のスクラ
ップについても、上記と同じような回収方法がとられて
いる。例えば、Ａｇめっき部分を含む半導体製品のスク
ラップからＡｇを回収する場合、スクラップを粉砕して
Ａｇ屑とし、ＨＮＯ，を用いて溶解した後、ろ過してそ
のろ液にＨＣノを加えてＡｇＣノとして沈澱させ、更に
Ｎａ２ＣＯ３を用いて還元することにより粗銀を得た後
、電解により高純度のＡｇを得ている。しかし、このよ
うな方法では、回収工程のプロセスが多く、時間及びコ
ストがかかるという問題がある。また、回収したい貴金
属とともにその他の不要な金属も全て溶解させるため、
大量の酸を必要とし、廃液の処理等も聞届となる。また
、回収したい貴金属がごく微量にしか含まれないため、
高度の濃縮技術及び設備を必要とする。しかも、スクラ
ップから貴金属を回収する場合には、スクラップの運搬
、切断、削り取り等の機械的作業を必要とする。Further, although the content of the above-mentioned noble metals in solder is small, they are expensive and are therefore being recovered. Conventionally, this recovery has been accomplished by dissolving solder with a high precious metal content in acid (e.g., aqua regia), concentrating only the precious metal through precipitation separation, ion exchange, etc. to obtain coarse metals, and then using wet or dry electrolysis. This is done by refining the metal to make it a pure metal. Similarly, the same collection method as above is used for scrap of defective products. For example, when recovering Ag from the scrap of semiconductor products that include Ag-plated parts, the scrap is crushed to form Ag waste, dissolved using HNO, filtered, and HC added to the filtrate to form AgC. Crude silver is obtained by precipitation and further reduction using Na2CO3, and then highly pure Ag is obtained by electrolysis. However, this method has a problem in that the recovery process involves many processes and is time-consuming and costly. In addition, in order to dissolve all other unnecessary metals along with the precious metals you want to recover,
A large amount of acid is required, and disposal of waste liquid is also required. In addition, since the precious metals that we want to recover are contained in only trace amounts,
Requires advanced concentration technology and equipment. Moreover, when recovering precious metals from scrap, mechanical operations such as transporting, cutting, and scraping the scrap are required.
（発明が解決しようとする問題点）
本発明は上記問題点を解決するためになされたものであ
り、はんだの精製及びはんだ中の貴金属の回収における
作業能率を向上し、かつはんだ、酸の使用量を減少させ
特別な設備を不要とすることによりコストの低減を図る
ことができる方法を提供することを目的とする。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned problems, and it improves work efficiency in refining solder and recovering precious metals in solder, and eliminates the use of solder and acids. The purpose is to provide a method that can reduce costs by reducing the amount and eliminating the need for special equipment.
［発明の構成］
（問題点を解決するための手段）
本発明のはんだの精製一方法は、貴金属を含む溶融はん
だにＡｌ！又はＡｌ合金を接触させ、上記Ａｌもしくは
Ａｌ合金又は溶融はんだに超音波を印加し、上記Ａ、１
７又はＡｌ合金の表面に貴金属含有率の高いはんだを付
着させることを特徴とするものである。[Structure of the Invention] (Means for Solving the Problems) One method for refining solder of the present invention is to add Al! to molten solder containing a noble metal! Or, by contacting the Al alloy and applying ultrasonic waves to the above Al or Al alloy or molten solder, the above A, 1.
This method is characterized by attaching solder with a high noble metal content to the surface of No. 7 or Al alloy.
また、本発明においては、Ａｌ又はＡｌ合金の表面に付
着した貴金属含有率の高いはんだから、貴金属を回収し
てもよい。Further, in the present invention, noble metals may be recovered from solder with a high noble metal content adhering to the surface of Al or Al alloy.
（作用）
上述したような本発明方法において、貴金属を含む溶融
はんだにＡ、ｆｆ又はＡｌ合金を接触させ、Ａｌもしく
はＡｌ合金又は溶融はんだに超音波を印加すると、Ａｌ
又はＡｌ合金が電極として作用するためＡｌ又はＡｌ合
金近傍の貴金属含有率が高くなり、しかも超音波を印加
した際のキャビテーション効果によりＡｌ又はＡｌ合金
と貴金属とで金属間化合物が生成する。したがって、Ａ
、１７又はＡｌ合金の表面には貴金属含有率の高いはん
だが付着し、はんだ中の貴金属含有率が減少するので、
はんだを精製することができる。(Function) In the method of the present invention as described above, when A, ff or Al alloy is brought into contact with molten solder containing a noble metal and ultrasonic waves are applied to Al or Al alloy or molten solder, Al
Alternatively, since the Al alloy acts as an electrode, the noble metal content in the vicinity of Al or the Al alloy increases, and intermetallic compounds are generated between the Al or Al alloy and the noble metal due to the cavitation effect when ultrasonic waves are applied. Therefore, A
, 17 or because solder with a high precious metal content adheres to the surface of the Al alloy, and the noble metal content in the solder decreases.
Solder can be refined.
なお、本発明において、溶融はんだの温度は２００〜３
５０℃が望ましい。これは、２００℃以下でははんだ付
の速度（Ａ）又はＡｌ合金表面の酸化膜が除去される速
度）が遅く、一方３５０℃を超えるとキャビテーション
の効果によるＡ、ｆｆ表面の破壊が激しく、溶融はんだ
中へのＡ、ｉ１’の流出が多くなるためである。ただし
、溶融はんだ中に流出したＡｌは溶融はんだ表面にスラ
グとなって浮遊するので、これを取り除けばよい。また
、超音波はんだ付の際、溶融はんだを攪拌すれば、はん
だ槽の下部に偏在している貴金属もＡ、ｉ７又はＡｌ合
金表面に付着させることができるので、より一層はんだ
を精製することができる。In addition, in the present invention, the temperature of the molten solder is 200 to 3
50°C is desirable. This is because below 200°C, the soldering speed (A) or the speed at which the oxide film on the Al alloy surface is removed) is slow, while above 350°C, the cavitation effect causes severe damage to the A and ff surfaces, causing melting. This is because more A and i1' leak into the solder. However, since the Al that has flowed into the molten solder floats as slag on the surface of the molten solder, it is sufficient to remove this. In addition, by stirring the molten solder during ultrasonic soldering, the precious metals that are unevenly distributed at the bottom of the solder bath can also be attached to the A, i7 or Al alloy surface, making it possible to further refine the solder. can.
また、上記のようにして貴金属含有率の高いはんだが付
着したＡｌ又はＡｌ合金については、Ａｌとはんだとの
界面において大気中でも数日で腐食が起こる。そして、
これを再び溶融はんだに浸漬すると、融点の差によりＡ
ｌ表面に付着していたはんだは溶は込み、Ａｌ！表面に
はＡｌと貴金属との金属間化合物が残る。こうして残っ
た金属間化合物は機械的又は化学的な方法により簡単に
除去することができ、また貴金属含有率の高い金属間化
合物から高純度の貴金属を回収することになるので、従
来よりもはるかに単純な回収プロセスでよい。Further, regarding Al or Al alloy to which solder with a high noble metal content is attached as described above, corrosion occurs in the atmosphere at the interface between Al and solder in a few days. and,
When this is immersed in molten solder again, it becomes A due to the difference in melting point.
l The solder adhering to the surface melts and melts into the Al! An intermetallic compound of Al and noble metal remains on the surface. The remaining intermetallic compounds can be easily removed by mechanical or chemical methods, and high-purity precious metals can be recovered from intermetallic compounds with a high precious metal content, making it much easier than before. A simple collection process is sufficient.
なお、スクラップの表面にめっきされた貴金属を回収す
るには、溶融はんだ中でスクラップの表面に超音波を印
加し、キャビテーション効果によりめっき部分のみを溶
融はんだ中に混入させ、その後上記方法で回収すればよ
い。In addition, in order to recover the precious metal plated on the surface of the scrap, apply ultrasonic waves to the surface of the scrap in molten solder to mix only the plated part into the molten solder due to the cavitation effect, and then recover it using the above method. Bye.
以上のように本発明方法によれば、超音波振動子のよう
な簡単な装置を用意するだけで、はんだの精製及びはん
だ中の貴金属の回収を行なうことができ、作業能率を向
上し、かつはんだ、酸の使用量を減少させ特別な設備を
不要とすることによりコストの低減を図ることができる
。As described above, according to the method of the present invention, it is possible to purify solder and recover precious metals in solder by simply preparing a simple device such as an ultrasonic vibrator, thereby improving work efficiency and Costs can be reduced by reducing the amount of solder and acid used and eliminating the need for special equipment.
（実施例） 以下、本発明の実施例を図面を参照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明方法を実施するための装置を示す断面図
である。第１図において、はんだ槽１内にははんだの還
流路２が形成され、溶融はんだ３が収容されている。溶
融はんだ３は図示しないモータにより回転される撹拌棒
４により還流路２内を通って液面より上に噴出して還流
する。Ａｌ又はＡ、ｆｆ合金５は溶融はんだの噴出部に
垂直に浸漬される。そして、Ａｌ又はＡ、ｆ合金５の近
傍の溶融はんだ３中に超音波振動子６が挿入され、溶融
はんだ３に超音波が印加される。FIG. 1 is a sectional view showing an apparatus for carrying out the method of the invention. In FIG. 1, a solder flow path 2 is formed in a solder bath 1, and molten solder 3 is accommodated therein. The molten solder 3 is spouted above the liquid level through the reflux path 2 by a stirring rod 4 rotated by a motor (not shown) and refluxed. Al or A, ff alloy 5 is immersed vertically into the molten solder spout. Then, an ultrasonic vibrator 6 is inserted into the molten solder 3 near the Al, A, or f alloy 5, and ultrasonic waves are applied to the molten solder 3.
実施例１〜３
上記装置を用い、溶融はんだ３（温度２８０℃）に２０
ｗｘ Ｘ ５０ ｒｒｔｘのＡｌ合金５を浸漬し、超
音波振動子６から溶融はんだ３に周波数２０ｔＨｚの超
音波を印加し、Ａｌ合金５表面に貴金属濃度の高いはん
だを付着させる操作を、１００枚のＡｌ合金５について
行なった。Examples 1 to 3 Using the above device, molten solder 3 (temperature 280°C) was
An operation of immersing an Al alloy 5 of wx The test was conducted for Al alloy 5.
ここで用いた溶融はんだは、Ａｕめっき品のはんだ付に
使用していた５ｎ−Ｐｂ共晶はんだ（実施例１） 、Ａ
ｇめっき品のはんだ付に使用していた５ｎ−Ｐｂ共晶は
んだ（一実施例２）及びＣｕめっき品のはんだ付に使用
していた５ｎ−Ｐｂ共晶はんだ（実施例３）の３種であ
る。各溶融はんだについて、上記操作による超音波はん
だ付操作の前後における、はんだ中の成分の分析結果を
それぞれ第１表〜第３表に示す。なお、各表中の数値は
いずれも重量％である。The molten solder used here was the 5n-Pb eutectic solder (Example 1) used for soldering Au plated products, A
Three types of 5n-Pb eutectic solder (Example 2) used for soldering G-plated products and 5n-Pb eutectic solder (Example 3) used for soldering Cu-plated products were used. be. For each molten solder, the analysis results of the components in the solder before and after the ultrasonic soldering operation according to the above operation are shown in Tables 1 to 3, respectively. In addition, all the numerical values in each table are weight %.
第１表
第２表
第３表
上記各表からも明らかなように、はんだ行操作後には、
実施例１でははんだ中のＡｕ含有率、実施例２でははん
だ中のＡｇ含ａ率、実施例３でははんだ中のＣｕ含有率
がそれぞれ大幅に減少しており、効率的にはんだの精製
を行なうことができた。Table 1 Table 2 Table 3 As is clear from the above tables, after the solder line operation,
The Au content in the solder in Example 1, the Ag content in the solder in Example 2, and the Cu content in the solder in Example 3 are significantly reduced, and the solder can be purified efficiently. I was able to do that.
実施例４
Ａｕめっき品のはんだ付に長期間使用し、融点が上昇し
た５ｎ−Ｐｂ共晶はんだの組成を調べたところ、約２％
のＡｕを含んでいた。このはんだを用い、第１図に示す
装置で純Ａｌ５を浸漬し、超音波はんだ付を行なった。Example 4 The composition of 5n-Pb eutectic solder whose melting point increased after being used for a long period of time to solder Au-plated products was found to be approximately 2%.
of Au. Using this solder, pure Al5 was immersed in the apparatus shown in FIG. 1, and ultrasonic soldering was performed.
はんだ付がなされたＡｌ！を多湿の腐食（電食）雰囲気
中に５時間放置した後、再び溶融はんだに浸漬したとこ
ろ、Ａｌ表面のはんだは溶は込み、Ａｌ表面には金属間
化合物が残存した。この金属間化合物を機械的又は化学
的手段により、収集し、その組成を調べたところ、Ａｕ
含有率は約５０重量％であった。この金属間化合物を酸
処理して、Ａ、ｉ７及び微量に存在するＳｎ、Ｐｂを除
去することにより、高純度のＡｕを得ることができた。Al soldered! When it was left in a humid corrosive (electrolytic corrosion) atmosphere for 5 hours and then immersed in molten solder again, the solder on the Al surface melted and intermetallic compounds remained on the Al surface. When this intermetallic compound was collected by mechanical or chemical means and its composition was investigated, it was found that Au
The content was approximately 50% by weight. By treating this intermetallic compound with acid to remove A, i7, and trace amounts of Sn and Pb, highly pure Au could be obtained.
実施例５
まず、第１図に示す装置を用い、Ａｇめっきを施したＦ
ｅ基製品を５ｎ−Ｐｂ共晶はんだ中に浸漬し、超音波を
印加してキャビテーション効果により表面のＡｇをはん
だ中に溶かした。Example 5 First, using the apparatus shown in FIG.
The e-based product was immersed in 5n-Pb eutectic solder, and ultrasonic waves were applied to dissolve Ag on the surface into the solder due to the cavitation effect.
次に、第１図に示す装置を用い、Ａｌ合金を浸漬して超
音波はんだ付を行なった。このＡｌ！合金を自然放置し
、２日後の再び溶融はんだに浸漬したところ、Ａｌ表面
のはんだは溶は込み、Ａｌ表面には金属間化合物が残存
した。この金属間化合物を機械的に収集し、その組成を
調べたところ、Ａｇ含有率は約８０重責％であった。こ
の金属間化合物を酸処理して、Ａｌ及び微量に存在する
Ｓｎ、Ｐｂを除去することにより、高純度のＡｇを得る
ことができた。Next, using the apparatus shown in FIG. 1, the Al alloy was immersed and ultrasonic soldering was performed. This Al! When the alloy was left to stand and immersed in molten solder again two days later, the solder on the Al surface melted and intermetallic compounds remained on the Al surface. When this intermetallic compound was collected mechanically and its composition was investigated, the Ag content was approximately 80%. By treating this intermetallic compound with acid to remove Al and trace amounts of Sn and Pb, highly pure Ag could be obtained.
実施例６
まず、実施例５と同様に、Ａｇめっきを施したＦｅ基製
品を５ｎ−Ｐｂ共晶はんだ中に浸漬し、超音波を印加し
てキャビテーション効果により表面のＡｇをはんだ中に
溶かした。Example 6 First, in the same manner as in Example 5, an Ag-plated Fe-based product was immersed in 5n-Pb eutectic solder, and ultrasonic waves were applied to dissolve the Ag on the surface into the solder due to the cavitation effect. .
次に、表面に３０ｘのＡｌをコーティングした超音波振
動子を、２８０℃の５ｎ−Ｐｂ共晶はんだに浸漬し、２
０ｋＨｚの超音波を３〜５秒間印加した後、超音波振動
子を引き上げ、その表面にはんだを付着させた。この超
音波振動子をそのままエツチング液に浸漬し、超音波を
印加することにより、Ａｌ、Ｓｎ及びｐｂを溶解し、高
純度のＡｇを得ることができた。Next, the ultrasonic vibrator whose surface was coated with 30x Al was immersed in 5n-Pb eutectic solder at 280°C, and
After applying 0 kHz ultrasonic waves for 3 to 5 seconds, the ultrasonic vibrator was pulled up and solder was attached to its surface. By immersing this ultrasonic vibrator in an etching solution and applying ultrasonic waves, it was possible to dissolve Al, Sn, and PB, and obtain highly pure Ag.
なお、上記実施例では、第１図に示す超音波はんだ付装
置、又は先端部にＡｌをコーティングした超音波振動子
を用いた力ぐ、第２図に示すような超音波はんだ付装置
を用いてもよい。第２図において、はんだ槽１１内には
複数の噴出口を有する隔離板１２が設けられ、溶融はん
だ１３が収容されている。溶融はんだ１３は攪拌機１４
により隔離板１２の噴出口から噴出して還流する。Ａｌ
又はＡｌ合金１５の下面は溶融はんだ１３の表面に水平
に浸漬される。そして、Ａｌ又はＡｌ合金１５の上面に
超音波振動子１６が当接され、Ａｌ又はＡ、ｆ７合金１
５に超音波が印加される。この際、Ａｌ又はＡｌ合金１
５は水平方向に振動させる。In the above embodiments, the ultrasonic soldering device shown in FIG. 1, or the ultrasonic soldering device shown in FIG. It's okay. In FIG. 2, a separator plate 12 having a plurality of spouting ports is provided in a solder bath 11, and molten solder 13 is accommodated therein. The molten solder 13 is stirred by a stirrer 14
As a result, the water is ejected from the ejection port of the separator plate 12 and refluxed. Al
Alternatively, the lower surface of the Al alloy 15 is horizontally immersed in the surface of the molten solder 13. Then, the ultrasonic vibrator 16 is brought into contact with the upper surface of the Al or Al alloy 15, and the Al or A, f7 alloy 1
Ultrasonic waves are applied to 5. At this time, Al or Al alloy 1
5 vibrates in the horizontal direction.
このような超音波はんだ付装置でも上記実施例と同様な
効果を得ることができる。また、第１図図示の超音波は
んだ付装置では、金属間化合物の付着量を多くしようと
すると、板状の°Ａｉ又はＡｌ合金を溶融はんだに浸漬
し、超音波を浸漬する操作を多数回繰返すことになるが
、金属間化合物の付着量はＡｌ又はＡｌ合金の面積と相
関しているので、第２図において、より長尺のＡ、１７
又はＡｌ合金１５を用いてこれを移動させれば、作業を
より一層効率化することができる。Even with such an ultrasonic soldering device, the same effects as in the above embodiment can be obtained. In addition, in the ultrasonic soldering apparatus shown in Fig. 1, in order to increase the amount of intermetallic compounds deposited, the plate-shaped °Ai or Al alloy is immersed in molten solder and immersed in ultrasonic waves many times. Again, since the amount of intermetallic compound deposited is correlated with the area of Al or Al alloy, in Fig. 2, the longer A, 17
Alternatively, if the Al alloy 15 is used to move this, the work can be made even more efficient.
［発明の効果］
以上詳述したように本発明によれば、超音波振動子のよ
うな簡単な装置を用意するだけで、はんだの精製及びは
んだ中の貴金属の回収を行なうことができ、作業能率を
向上し、かつはんだ、酸の使用量を減少させ特別な設備
を不要とすることによりコストの低減を図ることができ
る等工業上顕著な効果を奏するものである。[Effects of the Invention] As detailed above, according to the present invention, by simply preparing a simple device such as an ultrasonic vibrator, solder can be purified and precious metals in the solder can be recovered. It has remarkable industrial effects, such as improving efficiency, reducing the amount of solder and acid used, and eliminating the need for special equipment, thereby reducing costs.
第１図は本発明の実施例において用いられた超音波はん
だ付装置の断面図、第２図は本発明の他の実施例におけ
る超音波はんだ付装置の断面図である。
１・・・はんだ槽、２・・・還流路、３・・・溶融はん
だ、４・・・撹拌棒、５・・・Ａｌ又はＡｊ？合金、６
・・・超音波振動子、１１・・・はんだ槽、１２・・・
隔離板、１３・・・溶融はんだ、１４・・・攪拌機、１
５・・・Ａｌ又はＡｌ合金、１６・・・超音波振動子。FIG. 1 is a cross-sectional view of an ultrasonic soldering device used in an embodiment of the present invention, and FIG. 2 is a cross-sectional view of an ultrasonic soldering device in another embodiment of the present invention. 1... Solder bath, 2... Reflux path, 3... Molten solder, 4... Stirring bar, 5... Al or Aj? Alloy, 6
...Ultrasonic vibrator, 11...Solder bath, 12...
Separator, 13... Molten solder, 14... Stirrer, 1
5... Al or Al alloy, 16... Ultrasonic vibrator.
Claims (2)
触させ、上記ＡｌもしくはＡｌ合金又は溶融はんだに超
音波を印加し、上記Ａｌ又はＡｌ合金の表面に貴金属含
有率の高いはんだを付着させることを特徴とするはんだ
の精製方法。(1) Bringing Al or an Al alloy into contact with molten solder containing a noble metal, applying ultrasonic waves to the Al or Al alloy, or the molten solder, and attaching the solder with a high noble metal content to the surface of the Al or Al alloy. A solder refining method characterized by:
の高いはんだから、貴金属を回収することを特徴とする
特許請求の範囲第１項記載のはんだの精製方法。(2) A method for refining solder according to claim 1, characterized in that precious metals are recovered from solder with a high noble metal content adhering to the surface of Al or an Al alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4905187A JPS63215372A (en) | 1987-03-04 | 1987-03-04 | Method for refining solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4905187A JPS63215372A (en) | 1987-03-04 | 1987-03-04 | Method for refining solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63215372A true JPS63215372A (en) | 1988-09-07 |
Family
ID=12820283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4905187A Pending JPS63215372A (en) | 1987-03-04 | 1987-03-04 | Method for refining solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63215372A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006181636A (en) * | 2004-12-03 | 2006-07-13 | Tamura Seisakusho Co Ltd | Tool for reducing erosion of solder bath, and soldering device having the same |
| US20140191019A1 (en) * | 2011-12-15 | 2014-07-10 | Advanced Technology Materials, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
-
1987
- 1987-03-04 JP JP4905187A patent/JPS63215372A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006181636A (en) * | 2004-12-03 | 2006-07-13 | Tamura Seisakusho Co Ltd | Tool for reducing erosion of solder bath, and soldering device having the same |
| US20140191019A1 (en) * | 2011-12-15 | 2014-07-10 | Advanced Technology Materials, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
| US9221114B2 (en) * | 2011-12-15 | 2015-12-29 | Advanced Technology Materials, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
| US9649712B2 (en) | 2011-12-15 | 2017-05-16 | Entegris, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
| US9731368B2 (en) | 2011-12-15 | 2017-08-15 | Entegris, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
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