JP2006181636A - Tool for reducing erosion of solder bath, and soldering device having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool for reducing the erosion of a solder bath caused by arsenic contained in lead-free solder. <P>SOLUTION: The erosion reducing tool 12 for reducing the erosion of the solder bath 11 due to the arsenic contained in the solder is arranged in the bath of molten solder S. The erosion reducing tool is a plate having a chrome plated film 122 formed on the surface of iron 121. Because the chrome plated film 122 is made of pure chrome, the chrome plated film 122 can collect the arsenic more than the stainless steel of the solder bath 11 containing few chrome. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention particularly relates to an erosion reducing tool for reducing erosion of a solder bath caused by lead-free solder.

  In recent years, lead-free solders are rapidly spreading from the viewpoint of preventing environmental contamination of lead. While this lead-free solder is useful for environmental protection, it also has problems such as a higher melting point and inferior solder wettability than conventional tin-lead eutectic solder.

  On the other hand, with the use of lead-free solder, there has also been a situation where the solder bath containing molten solder is eroded violently. The reason for this is that the use of lead-free solder increases the percentage of tin, increases the temperature of the molten solder, and uses a strong flux, resulting in the progress of erosion of stainless steel. It has been.

  The solder tank which prevents the erosion accompanying the use of such lead-free solder is disclosed in Patent Documents 1 and 2 below. This solder bath covers all stainless steel surfaces in contact with the molten solder with titanium or nitride.

JP 2002-28778 A JP 2004-141914 A

  However, the techniques disclosed in Patent Documents 1 and 2 have the following problems. First, since the stainless steel surface is only temporarily moved away from the molten solder, the solder bath is eroded when there is no titanium or nitride. In other words, since the true cause has not been investigated, it is not a fundamental solution. Second, it is difficult to apply to existing solder baths. This is because the solder bath must be manufactured using stainless steel whose surface is previously covered with titanium or nitride.

  Accordingly, an object of the present invention is to provide a solution corresponding to the true cause of erosion of a solder bath, and to provide an erosion mitigation tool that can be applied to an existing solder bath, and a soldering apparatus including the same. is there.

  As a result of repeated studies on solder bath erosion by lead-free solder, the present inventor has found that arsenic contained in lead-free solder is involved. That is, arsenic contained in lead-free solder reacts with at least one of chromium and iron (hereinafter referred to as “chromium or iron”) contained in stainless steel. This is probably because chromium or iron has a strong affinity for arsenic. Specifically, for some reason, the oxide film on the stainless steel surface is destroyed, and arsenic collects and reacts with chromium or iron to form a compound, which prevents the oxide film on the stainless steel surface from being repaired. It is thought that the exposed stainless steel is eroded by tin. That is, the erosion of stainless steel by tin is accelerated by arsenic. This became clear as a result of two-dimensional elemental analysis of the eroded section of stainless steel by energy dispersive X-ray spectroscopy (EDS).

  Arsenic contained in the lead-free solder is supplied from the printed wiring board in the process of soldering the printed wiring board in the solder bath. In the production process of a printed wiring board, a copper plating solution to which arsenic is added in order to enhance the adhesion between the substrate and the copper foil is generally used. For this reason, arsenic remains on the surface of the printed wiring board, and this arsenic is washed away with molten solder during soldering and supplied into the molten solder. Therefore, the amount of arsenic contained in the lead-free solder is almost zero in a new product, but increases as a recycled product.

  The reason why erosion of the solder bath by arsenic did not become a problem in conventional tin-lead eutectic solder has not been clarified at present. Presumably, as described above, the ratio of tin was low, the temperature of the molten solder was low, and the action of the flux was weak.

  The present invention has been made based on such knowledge. That is, the erosion mitigation tool according to the present invention reduces the erosion caused by arsenic contained in the molten solder with respect to the solder bath in which the molten solder is accommodated and the stainless steel is used for the portion in contact with the molten solder. Is. The erosion mitigation tool according to the present invention is provided in molten solder, and at least the surface thereof is made of a material that collects arsenic more easily than the stainless steel in the solder bath (claim 1).

  As described above, the erosion of the solder bath is significantly accelerated by the reaction of arsenic contained in the molten solder with chromium or iron contained in the stainless steel. Here, when the erosion reducing tool is provided in the molten solder, arsenic contained in the molten solder is collected more in the erosion reducing tool than the stainless steel in the solder bath. Therefore, since arsenic involved in the erosion of the solder bath is reduced as compared with the conventional case, the erosion of the solder bath is reduced. Since this erosion mitigation tool may be provided in the molten solder, it can also be applied to an existing solder bath.

  The material of the erosion reducing tool includes, for example, chromium, a chromium alloy or a chromium compound (Claim 2), or at least one of chromium, a chromium alloy and a chromium compound (Claim 3).

  The erosion mitigation tool may be any material that collects arsenic more easily than the stainless steel in the solder bath. The material that collects arsenic more easily than the stainless steel in the solder bath is, for example, a material containing more chromium than the stainless steel in the solder bath. Thus, such materials include pure chromium, because stainless steel contains only a small amount of chromium. Pure chromium is obtained, for example, by a chromium plating film.

  Of course, it is not limited to pure chromium, but may be a chromium alloy or a chromium compound. The chromium alloy is, for example, stainless steel having a higher chromium content than the stainless steel in the solder bath (Claim 5). Generally, SUS304 or SUS316 is used as the stainless steel for the solder bath. As for the composition of SUS304, Cr is 18 to 20 wt%, Ni is 8 to 10.5 wt%, and the rest is Fe. The composition of SUS316 is 16 to 18 wt% Cr, 10 to 14 wt% Ni, 2.5 wt% Mo, and the rest Fe. Therefore, stainless steel with a higher chromium content than these is used as the material for the erosion mitigation tool.

  Examples of chromium compounds include chromium halides (chromium chloride, chromium fluoride, etc.), chromium oxides, chromium hydroxides, chromium sulfides, chromium carbides, chromium nitrides, etc., or chromium halides (chlorides, Fluoride, etc.), oxide, hydroxide, sulfide, carbide, nitride and the like. More specifically, it is blended in the material of the erosion reducing tool as chromate such as ammonium chromate or potassium chromate, or dichromate or anhydrous chromate. The content or composition of the materials described so far may be determined experimentally, for example, by comparing the erosion states of the solder bath and the erosion mitigation tool under the same conditions.

  Other materials for the erosion mitigation tool include, for example, iron, alloy steel or iron compound (Claim 6), or at least one of iron, alloy steel and iron compound (Claim 7).

  The erosion mitigation tool may be any material that collects arsenic more easily than the stainless steel in the solder bath. The material that collects arsenic more easily than the stainless steel in the solder bath is, for example, a material containing more iron than the stainless steel in the solder bath. Therefore, pure iron is an example of such a material. Pure iron is obtained, for example, by an iron plating film.

  Of course, it is not limited to pure iron, but may be alloy steel or iron compound. The alloy steel is, for example, manganese steel or stainless steel having a higher iron content than the stainless steel in the solder bath (claim 9). Generally, SUS304 or SUS316 is used as the stainless steel for the solder bath. As for the composition of SUS304, Cr is 18 to 20 wt%, Ni is 8 to 10.5 wt%, and the rest is Fe. The composition of SUS316 is 16-18 wt% Cr, 10-14 wt% Ni, 2.5 wt% Mo, and the rest Fe. Therefore, stainless steel with a higher iron content than these is used as the material for the erosion mitigation tool.

  Examples of the iron compound include cementite. Examples of other iron compounds include iron halides (iron chloride, iron fluoride, etc.), iron oxides, iron hydroxides, iron sulfides, iron carbides, iron nitrides, etc., or iron halides (chlorides). Oxides, hydroxides, sulfides, carbides, nitrides, and the like. The content or composition of the materials described so far may be determined experimentally, for example, by comparing the erosion states of the solder bath and the erosion mitigation tool under the same conditions.

  As in the case of chromium or iron, examples of the material having high affinity with arsenic include gallium and molybdenum (claims 10 and 11). In particular, gallium tends to react with arsenic to become a gallium arsenide compound.

  Further, when the molten solder is lead-free solder, the solder bath is markedly eroded, so that it is the most effective (claim 12). Examples of the lead-free solder include Sn-Ag, Sn-Ag-Bi, Sn-Ag-Cu, Sn-Zn, and Sn-Zn-Bi.

  A soldering apparatus according to the present invention includes a solder bath in which stainless steel is used in a portion that contacts molten solder while containing molten solder, and an erosion mitigation tool according to the present invention. 13). This erosion mitigation tool may be put into molten solder (Claim 14), or may replace an existing replaceable component of the solder bath (Claim 15).

  According to the erosion mitigation tool of the present invention, arsenic that reacts with the stainless steel in the solder bath is reduced by preferentially collecting arsenic over the stainless steel in the solder bath, so that the erosion of the solder bath can be reduced. That is, since the true cause of the erosion of the solder bath was determined to be arsenic contained in the molten solder, an accurate solution can be achieved. Moreover, since the erosion reduction tool should just be provided in molten solder, it can be applied also to the existing solder tank. Furthermore, when the surface of the erosion mitigation tool is made of a chrome plating film, the existing replaceable components of the solder bath can be easily changed to the erosion mitigation tool.

  According to the soldering apparatus according to the present invention, by including the erosion mitigation tool according to the present invention, erosion of an existing solder bath can be easily reduced.

  FIG. 1 shows a first embodiment of a soldering apparatus according to the present invention, FIG. 1 [1] is an overall schematic sectional view, and FIG. 1 [2] is an enlarged sectional view of an erosion reducing tool. Hereinafter, description will be given based on this drawing.

  The soldering apparatus 10 of the present embodiment is an immersion type provided with a solder bath 11 and an erosion reducing tool 12. The solder tank 11 contains the molten solder S and is entirely made of stainless steel including a portion that contacts the molten solder S. The solder bath 11 includes an erosion reduction tool 12 and a heater 13. That is, the surface of the heater 13 is also made of stainless steel. Note that the soldering apparatus 10 is provided with a transport mechanism for the printed wiring board P (not shown). The molten solder S is a lead-free solder.

The erosion reduction tool 12 is for reducing erosion of the solder bath 11 caused by arsenic contained in the molten solder S, and is a plate in which a chromium plating film 122 is formed on the surface of the iron 121. Since the chromium plating film 122 is made of pure chromium, it is a material that collects arsenic more easily than the stainless steel of the solder bath 11 containing only a small amount of chromium. The chromium plating method may be a general method using electrolysis in a small amount of chromic acid (CrO ₄ ²⁻ ) solution. The type of chrome plating may be hard chrome plating, but may be porous chrome plating in order to increase the contact area with the molten solder S. In porous chrome plating, the surface of a base material is roughened and chromium plating is performed in advance, or the surface is made porous by etching after plating.

  Next, the operation of the erosion reduction tool 12 will be described. The lead-free solder is heated to a melting point or higher by the heater 13 in the solder bath 11 to become a molten solder S. Here, the printed wiring board P is soldered by immersing the back side of the printed wiring board P on which the electronic component is placed in the molten solder S. At this time, arsenic remaining on the surface of the printed wiring board P is washed away by the molten solder S and accumulated in the molten solder S. Conventionally, this arsenic reacts with chromium or iron contained in the stainless steel of the solder bath 11 to produce a compound, so that the erosion of the solder bath 11 is remarkably accelerated. Specifically, for some reason, the oxide film on the stainless steel surface is destroyed, and arsenic collects and reacts with chromium or iron to form a compound, which prevents the oxide film on the stainless steel surface from being repaired. It is thought that the exposed stainless steel was eroded by tin.

  On the other hand, in this embodiment, the erosion reducing tool 12 is provided in the molten solder S. Therefore, more arsenic contained in the molten solder S is collected in the erosion reducing tool 12 than in the stainless steel in the solder bath 11. Therefore, since arsenic reacting with the stainless steel in the solder bath 11 is reduced as compared with the conventional case, erosion of the solder bath 11 is reduced. Since the erosion reducing tool 11 may be provided in the molten solder S, it can be applied to an existing solder bath.

  The shape of the erosion reducing tool 11 may be provided with a large number of through holes in the plate in order to increase the contact area with the molten solder S, or may have a net shape, a rod shape, etc. You may put in a container with a hole. The quantity of the erosion reduction tool 11 may be increased as necessary. Moreover, since arsenic generally tends to accumulate at the bottom of the solder bath 11, it is more effective if the position of the erosion reducing tool 11 is also at the bottom of the solder bath 11.

  FIG. 2 shows a second embodiment of the soldering apparatus according to the present invention, FIG. 2 [1] is a schematic sectional view of the whole, and FIG. 2 [2] is an enlarged sectional view of an erosion reducing tool. Hereinafter, description will be given based on this drawing. However, the description of the same parts as those in the first embodiment is omitted or simplified.

  The soldering apparatus 20 according to the present embodiment is a jet type equipped with a solder bath 21 and an erosion reduction tool 22. The solder tank 21 contains the molten solder S and is entirely made of stainless steel including a portion that contacts the molten solder S. Further, the solder bath 21 includes erosion reduction tools 22a and 22b, a heater 23, a shaft 24, fins 25, a duct 26, a nozzle 27, and the like. That is, the surface of the heater 23, the shaft 24, the fin 25, the duct 26, and the nozzle 27 are also made of stainless steel. In addition, although not shown in figure, the soldering apparatus 20 is provided with the conveyance mechanism of the printed wiring board P. FIG. The molten solder S is a lead-free solder.

  The erosion reducing tools 22a and 22b are for reducing erosion of the solder bath 21 caused by arsenic contained in the molten solder S, and also serve as a rectifying perforated plate that is an existing replaceable component. That is, the erosion reducing tools 22a and 22b are formed by forming a chromium plating film 222 on the surface of an iron 221 plate provided with a large number of through holes. The rectifying perforated plate functions to make the flow of the molten solder S uniform and send it to the nozzle 27.

  Next, the operation of the erosion reduction tool 22 will be described. The lead-free solder is heated to the melting point or higher by the heater 23 in the solder bath 21 to become a molten solder S. The shaft 24 rotates the stirring fins 25 by transmitting power from a motor (not shown). The molten solder S sent into the duct 26 by the fins 25 passes through the erosion mitigation tools 22a and 22b that also serve as a rectifying perforated plate, and is ejected from the nozzle 27. Here, the printed wiring board P is soldered by bringing the back side of the printed wiring board P on which the electronic component is placed into contact with the molten solder S ejected. At this time, arsenic remaining on the surface of the printed wiring board P is washed away by the molten solder S and accumulated in the molten solder S. Conventionally, this arsenic reacts with chromium or iron contained in the stainless steel of the solder bath 21 to produce a compound, thereby eroding the solder bath 21. In the jet-type soldering apparatus 20, the molten solder S is forcibly agitated by the shaft 24, the fins 25, the duct 26, the rectifying perforated plate, the nozzle 27, and the like to which the molten solder S strikes violently.

  On the other hand, in this embodiment, the erosion reduction tools 22a and 22b are provided at locations where the molten solder S is struck violently. Therefore, arsenic contained in the molten solder S is collected more in the erosion mitigation tools 22a and 22b than in the stainless steel in the solder bath 21. Therefore, since arsenic reacting with the stainless steel in the solder bath 21 is reduced as compared with the conventional case, erosion of the solder bath 21 is reduced. Since the erosion reducing tools 22a and 22b may be provided in the molten solder S, they can be applied to existing solder baths. Further, since the erosion reducing tools 22a and 22b are provided at locations where the molten solder S is struck violently, it becomes easier to collect arsenic, thereby obtaining a greater effect.

  The shaft 24, the fin 25, the duct 26, the nozzle 27, etc. may be chrome-plated to make them erosion reducing tools.

  Needless to say, the present invention is not limited to the above embodiments. For example, the entire solder bath to which the present invention is applied need not be made of stainless steel, and it is sufficient that stainless steel is used even in a portion that contacts the molten solder. Moreover, iron may be used instead of chromium, and gallium or molybdenum may be used.

  In this example, the effect of As on the interfacial reaction between Sn-3.0Ag-0.5Cu solder and stainless steel will be described.

[1]. Sample and experimental method

  In this example, in order to examine the influence of As contained in the solder on the interfacial reaction, as shown in Table 1, the solder chemical composition defined in JISZ3182 corresponds to about 0.2 times the upper limit of As. Prepare and use Sn-3.0% Ag-0.5% Cu (composition is all mass%) solder (1), (2) containing 073% As and 0.006% As within the specified values. did.

Table 1. Chemical composition (mass%) of Sn-3.0% Ag-0.5% Cu solder used for dissolution test
Solder (1)
Solder (2)
Pb 0.016 Pb 0.027
Sb 0.009 Sb 0.008
Cu 0.50 Cu 0.50
Bi 0.01 Bi 0.003
Zn 0.0001 Zn 0.0001
Fe 0.003 Fe 0.002
Al 0.0001 Al 0.0001
As 0.073 As 0.006
Ag 3.10 Ag 3.00
Cd 0.0001 Cd 0.0001
Sn Bal. Sn Bal.

  Moreover, as a stainless steel sample, two types of SUS304 and SUS316 of 70 mm × 6 mm × 0.3 mm were used. Table 2 shows the composition of the stainless steel used.

Table 2. Chemical composition sample of stainless steel used for dissolution test (mass%)
SUS304 SUS316
C 0.04 C 0.04
Si 0.50 Si 0.50
Mn 1.00 Mn 1.00
Ni 9.5 Ni 12.0
Cr 19.0 Cr 17.0
Mo-Mo 2.50
P 0.02 P −
S 0.015 S −
Fe Bal. Fe Bal.

  Next, FIG. 3 shows an outline of an experimental apparatus for the stainless steel immersion experiment in this example. The experimental apparatus 30 includes an electric furnace 31 and a controller 32. Inside the electric furnace 31, the solder 33 is melted. The stainless steel samples 34 and 35 are suspended by the holders 36 and 37 in the molten solder 33. The temperature of the solder 33 is measured by a thermocouple 38 and controlled by the controller 32.

  Next, the experimental procedure will be briefly described. The stainless steel sample was ultrasonically cleaned, then immersed in flux (HCl), and immersed in a solder bath maintained at 400 ° C. perpendicular to the longitudinal direction. After immersion of the sample, the solder temperature was kept at a constant temperature of 400 ° C. until 24 h, and thereafter kept at 250 ° C. After 24 hours, 168h, 336h, and 672h have passed since the start of immersion at 400 ° C., the sample was pulled up, cut and polished, and then observed with an optical microscope and a scanning electron microscope (SEM), or an electron beam microanalyzer (EPMA). ) Was used for elemental analysis of the compound phase.

[2] Experimental results and discussion

  FIG. 4 [1] shows a cross-sectional photograph of the tip of the sample after the SUS316 plate is immersed in the solder (1) bath. In this experiment, it is understood that the solder is sufficiently wetted with the stainless steel after 24 hours because HCl is used as the flux. In the sample tip, etc., a rounded part is also seen, and it can be seen that the stainless steel is dissolved in the solder. FIG. 4 [2] shows an SEM photograph of the solder / stainless steel interface when SUS316 is immersed in the solder (1) bath for 336h and 672h. When these are seen, it turns out that the intermetallic compound is formed in the shape of a needle or a column in the solder near the interface. In the case of 672h, it can be seen that the surface of the stainless steel is dissolved non-uniformly.

  When the SUS304 plate was immersed, as in the case of SUS316, the sample tip portion was seen to be rounded, and it was found that the stainless steel was dissolved in the solder. It was also confirmed that columnar intermetallic compounds were formed in the vicinity of the interface. As a difference from SUS316, a phenomenon that the solder easily deviates from the sample surface when the sample is taken out from the solder bath, and a phenomenon that a gap is formed between the stainless steel plate and the solder were observed.

  Next, in order to examine the compound formed at the interface between the As-containing solder and stainless steel, elemental analysis by EPMA was performed on the compound phase formed when SUS316 was immersed in the solder (1) bath for 336 h. The result of elemental mapping near the solder / stainless steel interface is shown in FIG. Table 3 shows the results of quantitative analysis of the compound phase. FIG. 5 shows that the compound phase is formed of Fe, As, and Sn. From the results of Table 3, As and Fe accounted for about 45%, and As was concentrated in the compound phase, it was found that the compound phase was composed mainly of Fe and As.

Table 3. Quantitative analysis result 1 (at.%) By EPMA for the compound phase
As 48.06
Fe 42.73
Ni 0.10
Cr 0.07
Mo 0.00
Sn 9.04

  Next, the elemental analysis by EPMA was performed about the compound phase formed when SUS316 was immersed in a solder (1) bath for 672 h. The results of quantitative analysis of the compound phase are shown in Table 4. From the results in Table 4, Cr, Mo, and Fe are concentrated in the As-rich compound phase. That is, it can be seen that Cr, Mo, and Fe are likely to be associated with As.

Table 4. Quantitative analysis result 2 (at.%) By EPMA for the compound phase
As 45.54
Fe 16.64
Ni 0.11
Cr 28.60
Mo 1.60
Sn 7.61

  Next, elemental analysis by EPMA was performed on the compound phase formed when SUS314 was immersed in a solder (2) bath for 168 hours. The results of quantitative analysis of the compound phase are shown in Table 5. From the results in Table 5, Cr and Fe are concentrated in the compound phase rich in As. That is, it can be seen that Cr and Fe are likely to be associated with As.

Table 5. Quantitative analysis result 3 (at.%) By EPMA for the compound phase
As 35.33
Fe 11.52
Cr 31.27
Sn and others 21.88

[3] Conclusion

  The interfacial reaction between As-containing Sn-3.0Ag-0.5Cu solder and stainless steel was investigated. As a result, it became clear that a compound phase mainly composed of As, enriched Fe, Cr, Mo and As is formed in a columnar shape at the solder / stainless steel interface.

  From the above results, according to the flux according to the present invention, arsenic adhering to the printed wiring board or arsenic contained in the molten solder can be substantially removed by including Fe, Cr, Mo or the like in the component. Therefore, erosion of the solder bath can be prevented.

  From the above results, according to the erosion mitigation tool according to the present invention, by including Fe, Cr, Mo, etc. in the material, arsenic can be preferentially collected over stainless steel in the solder bath, thereby Since arsenic reacting with the stainless steel in the solder bath is reduced, erosion of the solder bath can be reduced.

1 shows a first embodiment of a soldering apparatus according to the present invention, FIG. 1 [1] is an overall schematic sectional view, and FIG. 1 [2] is an enlarged sectional view of an erosion reducing tool. 2 shows a second embodiment of a soldering apparatus according to the present invention, FIG. 2 [1] is a schematic sectional view of the whole, and FIG. 2 [2] is an enlarged sectional view of an erosion reducing tool. It is the schematic which shows the experimental apparatus in a stainless steel immersion experiment (Example 1). 4 is a photograph after SUS316 is immersed in a solder bath, FIG. 4 [1] is a cross-sectional photograph of the sample tip, and FIG. 4 [2] is a SEM photograph of the solder / stainless steel interface (Example 1). ). It is an EPMA photograph of the solder / stainless steel interface after SUS316 is immersed in a solder bath (Example 1).

Explanation of symbols

10 Soldering device (immersion type)
11 Solder bath (immersion type)
12 Erosion mitigation tool 20 Soldering device (jet type)
21 Solder bath (jet type)
22a, 22b Erosion reduction tool (rectifying perforated plate)
S Molten solder (lead-free solder)
P Printed wiring board

Claims (15)

An erosion reducing tool for reducing erosion caused by arsenic contained in the molten solder with respect to a solder bath in which stainless steel is used for a portion that contains the molten solder and is in contact with the molten solder,
Provided in the molten solder, at least the surface is made of a material that collects the arsenic more easily than the stainless steel,
Erosion mitigation tool characterized by that. The material is chromium, a chromium alloy or a chromium compound.
The erosion mitigation tool according to claim 1. The material includes at least one of chromium, a chromium alloy, and a chromium compound.
The erosion mitigation tool according to claim 1. The chromium is a chromium plating film,
The erosion reduction tool according to claim 2 or 3. The chromium alloy is stainless steel having a higher chromium content than the stainless steel in the solder bath.
The erosion reduction tool according to claim 2 or 3. The material is iron, alloy steel or iron compound,
The erosion mitigation tool according to claim 1. The material includes at least one of iron, alloy steel, and iron compound.
The erosion mitigation tool according to claim 1. The iron is an iron plating film,
The erosion mitigation tool according to claim 6 or 7. The alloy steel is stainless steel having a higher iron content than the stainless steel in the solder bath,
The erosion mitigation tool according to claim 6 or 7. The material is gallium, a gallium alloy or a gallium compound, or molybdenum, a molybdenum alloy or a molybdenum compound.
The erosion mitigation tool according to claim 1. The material includes at least one of gallium, a gallium alloy and a gallium compound, and molybdenum, a molybdenum alloy and a molybdenum compound.
The erosion mitigation tool according to claim 1. The molten solder is lead-free solder,
The erosion reduction tool according to claim 1.
A solder bath in which stainless steel is used in a portion that contains molten solder and contacts the molten solder;
The erosion reduction tool according to any one of claims 1 to 12,
Soldering device equipped with. The erosion mitigation tool is one that is put into the molten solder.
The soldering apparatus according to claim 13. The erosion mitigation tool replaces the replaceable existing components of the solder bath,
The soldering apparatus according to claim 13.

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