JPS59110460A - Joining method - Google Patents

Joining method

Info

Publication number
JPS59110460A
JPS59110460A JP21929582A JP21929582A JPS59110460A JP S59110460 A JPS59110460 A JP S59110460A JP 21929582 A JP21929582 A JP 21929582A JP 21929582 A JP21929582 A JP 21929582A JP S59110460 A JPS59110460 A JP S59110460A
Authority
JP
Japan
Prior art keywords
solder
tube
coating film
joining
pipe body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21929582A
Other languages
Japanese (ja)
Other versions
JPS6111711B2 (en
Inventor
Yoichiro Maehara
前原 洋一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21929582A priority Critical patent/JPS59110460A/en
Publication of JPS59110460A publication Critical patent/JPS59110460A/en
Publication of JPS6111711B2 publication Critical patent/JPS6111711B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/14Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B23K1/18Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To perform joining with improved joining efficiency by dipping the end of one pipe body to be fitted into the other pipe body by >=2 times in a molten solder bath to form a coating film having a collar-shaped thick walled part thereon then fitting the end to the end of the other pipe body. CONSTITUTION:The high pressure air introduced, via a guide pipe 16, into a pipe body 15 consisting of Al, etc. held by a holding body from its open end is ejected and in this state the joining end of the body 15 is dipped in molten solder 7. An ultrasonic oscillation is propagated, via an oscillation diaphragm 9, to the solder 7 to dislodge the oxide film from the outside circumferential surface on the above-described joining end and to stick the solder 7 on the fresh surface. The pipe body 15 formed with a primary solder film 18 on the joining end is removed upward from the solder 7 and is cooled. While compressed air is ejected from the above-described joining end, the body 15 is immersed in the solder 7 to form a secondary covering film 19 formed with a collar-shaped part 19a on the side opposite from the open end side of the body 15 on the film 18. The joining end of such body 15 upon cooling is fitted to a pipe body 20 consisting of, for example, copper, etc. and the joined part of both is heated to the solder melting temp. or above and is joined under application of an ultrasonic oscillation thereon.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、異種金属管体同志の接合に好適する接合方法
に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a joining method suitable for joining dissimilar metal pipe bodies.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

一般に、たとえば銅とアルミニウムなどの異種金属の管
体の融接は困難である。そこで、一対の異種金属管体を
はんだ付けすなわち軟ろう伺けにより接合することが行
われている。この場合、一対の異種金属管体のうちいず
れか一方をはんだ浴に浸漬し、第1図に示すように、管
体(1)の接合端部外周面にはんだコーテイング膜(2
)を被着させる。
In general, fusion welding of tubes made of dissimilar metals, such as copper and aluminum, is difficult. Therefore, a pair of dissimilar metal tube bodies are joined by soldering, that is, by soft soldering. In this case, one of the pair of dissimilar metal tubes is immersed in a solder bath, and a solder coating film (2
).

しかして、他方の管体(3)に管体(1)の接合端部を
嵌合させた後、はんだの融点以上に加熱することにだ量
は不充分であるので、第2図に示すように、接合部のわ
ずかな間隙近傍にはんだ棒(4)を巻装して接合に要す
るはんだ量の不足分を補充している。
However, after fitting the joining end of the tube (1) to the other tube (3), the amount of solder is insufficient to heat it above the melting point of the solder, as shown in Figure 2. In this way, a solder rod (4) is wrapped around a small gap between the joints to replenish the amount of solder required for joining.

このようなはんだ# (4)の接合部への装着は、とり
わけ管体が小さい場合、すこぶる熟練を要する作業とな
る。のみならず、はんだ棒(4)を接合される管体に適
合した寸法に加工せねばならない不便もある。したがっ
て、これらの問題は、管体のはんだ付は接合の自動化の
障害となっていた。
Attaching such solder # (4) to the joint requires a great deal of skill, especially when the tube is small. In addition, there is also the inconvenience of having to process the solder rod (4) to a size that matches the pipe body to be joined. Therefore, these problems have been an obstacle to automating soldering of pipes.

〔発明の目的〕[Purpose of the invention]

本発明は、上記事情を参酌してなされたもので、はんだ
棒によるはんだの補充を必要としない接合方法を提供す
ることを目的とする。
The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a joining method that does not require replenishment of solder using a solder rod.

〔発明の概要〕[Summary of the invention]

一方の管体の端部が他方の管体の端部に嵌合された一対
の管体の嵌合部位のはんだ付は接合において、他方の管
体に嵌入される一方の管体の端部を溶融はんだ浴に少な
くとも2回以上浸漬させることにより鍔状の厚肉部分を
有するはんだコーテイング膜を形成し、このはんだコー
テイング膜を利用して上記一対の管体をはんだ付けによ
り接合するようにしたものである。
Soldering of the mating parts of a pair of tubes, where the end of one tube is fitted into the end of the other tube, is done when the end of one tube is fitted into the other tube. was immersed in a molten solder bath at least twice to form a solder coating film having a thick flange-like part, and this solder coating film was used to join the pair of tube bodies by soldering. It is something.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を図面を参照して、実施例に基づいて詳述
する。
Hereinafter, the present invention will be described in detail based on examples with reference to the drawings.

第3図は、本発明の接合方法の一実施例に用いられるは
んだコーティング装置を示している。はんだ槽(5)は
、電熱ヒータ(6)によシはんだ(力を溶融するように
なっている。このはんだ槽(5)に隣接して超音波を発
生する超音波ホーン(8)が設置されている。この超音
波ホーン(8)には振動板(9)が取付けられている。
FIG. 3 shows a solder coating device used in one embodiment of the bonding method of the present invention. The solder bath (5) is designed to melt the solder (power) by an electric heater (6). An ultrasonic horn (8) that generates ultrasonic waves is installed adjacent to this solder bath (5). A diaphragm (9) is attached to this ultrasonic horn (8).

この振動板(9)の先端部分は、はんだ槽(5)内部に
まで延在し、溶融したはんだ(7)に超音波振動を伝播
させるように寿っている。一方、はんだ槽(5)上方に
は固定板α0)が配設されている。この固定板QO)に
は空気圧シリンダ(11)が載設されている。この空気
圧シリンダaυのピストンロッド(1つは、はんだ槽(
5)に対して矢印(13a)、 (13b)方向に進退
するようになっている。上記ピストンロッド幅の先端に
は管体状の保持体αaが螺着されている。この保持体I
は、接合対象である管体(15)を嵌脱自在に保持する
ものである。そうして、この保持体Iの一端部は閉止さ
れ、他端部は可撓性の案内管用を介して図示せぬ圧縮空
気源に接続され、保持体α荀に嵌着された管体(Iつに
圧縮空気を案内するようになっている。さらに、管体u
!i1をはさんだ左右対称位置には、一対の冷却ノズル
(17) 、 (17)が、それらの開口端部を管体(
X5)に対向させて配設されている。
The tip of the diaphragm (9) extends into the solder bath (5) and is designed to propagate ultrasonic vibrations to the molten solder (7). On the other hand, a fixing plate α0) is provided above the solder bath (5). A pneumatic cylinder (11) is mounted on this fixed plate QO). The piston rod of this pneumatic cylinder aυ (one is the solder bath (
5), it moves forward and backward in the directions of arrows (13a) and (13b). A tubular holder αa is screwed onto the tip of the width of the piston rod. This holder I
is for holding the pipe body (15) to be joined in a detachable manner. Then, one end of this holder I is closed, and the other end is connected to a compressed air source (not shown) through a flexible guide tube, and the tube ( The compressed air is guided through the pipe body U.
! At symmetrical positions across i1, a pair of cooling nozzles (17), (17) have their open ends connected to the tube body (
X5).

これら冷却ノズル(17)、αηは、図示せぬ冷却空気
源に接続されている。
These cooling nozzles (17) and αη are connected to a cooling air source (not shown).

つぎに、上記構成のはんだコーティング装置を用いた本
実施例の接合方法について述べる。まず、空気圧シリン
ダqυを駆動してピストンロッド(12)を矢印(13
b)方向に上昇させ、保持体(IJ ’c l限位置で
停止させる。しかして、たとえばアルミニウムからなる
管体α9を保持体0滲に嵌合・保持させる。
Next, the bonding method of this embodiment using the solder coating apparatus having the above configuration will be described. First, drive the pneumatic cylinder qυ to move the piston rod (12) in the direction of the arrow (13).
b) direction and stopped at the holding body (IJ'cl limit position).Thus, the tubular body α9 made of, for example, aluminum is fitted and held in the holding body 0.

そして、圧縮空気源から案内管(16)及び保持体Iを
介して圧縮空気を管体住9に案内し、この管体0均の開
口から高圧空気を噴出させる。つぎに、ピストンロッド
(1ツを矢印(13a)方向に下降させ、管体αつの接
合端部をはんだ槽(5)内の溶融した400〜420℃
のはんだ(力に浸漬させる。そして超音波ホーン(8)
を作動させて、振動板(9)を介して、超音波振動を溶
融したはんだ(力に伝播させる。すると、管体CIQの
接合端部外周面の酸化皮膜が剥落し、溶融したはんだ(
力と管体05)の酸化を受けていたい新生面とが接触し
はんだ(7)は管体(1ツに密着する。このとき、管体
叫の開口部からは高圧空気が噴出されているので、管体
(151内部には、はんだ(力は付着することなく、か
つ管体05)の開口部が閉塞されることはない。しかし
て、2〜3秒後、イストンロッド0々をって冷却空気を
唄射し、管体(lωを200’O以下に冷却する。その
結果、管体住5)の接合端部には、均一な厚さの一次は
んだコーティング膜端が形成される(第4図参照)。こ
の−次はんだコーティング膜α樽の′はんだ量は、接合
には不十分である。そこで、再度、管体Q51を開口端
部から圧縮空気を噴出させながら、溶融したはんだ(力
に0.5〜3秒間浸漬する。
Then, compressed air is guided from the compressed air source to the pipe body 9 through the guide pipe (16) and the holder I, and high pressure air is blown out from the opening of this pipe body. Next, the piston rod (one rod) is lowered in the direction of the arrow (13a), and the joint end of the tube body α is heated to a temperature of 400 to 420° C. in the molten solder bath (5).
solder (force immersion) and ultrasonic horn (8)
is activated, and the ultrasonic vibration is propagated to the molten solder (force) through the diaphragm (9).Then, the oxide film on the outer peripheral surface of the joint end of the tube body CIQ peels off, and the molten solder (
The solder (7) comes into close contact with the newly oxidized surface of the tube (05), and the solder (7) comes into close contact with the tube (1).At this time, high pressure air is blown out from the opening of the tube. There is no solder (no force is applied inside the tube 151, and the opening of the tube 05) is not blocked.After 2 to 3 seconds, the iston rod 0 is removed. Cooling air is blown to cool the tube body (lω to 200'O or less. As a result, a primary solder coating film edge with a uniform thickness is formed at the joint end of the tube body 5). (See Figure 4).The amount of solder in this next solder coating α barrel is insufficient for bonding. Therefore, while blowing out compressed air from the open end of the tube Q51, melt the molten solder. (Immerse in the force for 0.5-3 seconds.

このとき、超音波ホーン(8)は作動させない。すると
、−次コーティング膜賭の大部分は溶融する。
At this time, the ultrasonic horn (8) is not activated. Then, most of the second coating film is melted.

しかし、はんだ(力液面付近の一次コーティング膜軸は
、外気の影響により完全に溶融せず、逆に寸わシのはん
だが追加されはんだがぼた付は状態となって、鍔状に累
積される。しかして、−次はんだコーテイング膜と同様
にして、管体(1■を引上げ、かつ冷却させると、第5
図に示すような二°次はんだコーティング膜餞が形成さ
れる。この二次はんだコーティング膜翰は、大部分は均
一な膜厚となっているが、管体a9開口側とは反対側部
分は、鍔状部分(19a)となっている。そして、との
鍔状部分(19a)が、前記はんだ棒(4)と同種に、
接合のだめのはんだ供給源となっている。しかして、こ
の二次はんだコーティング膜α鋳が被着された管体(1
5)の接合端部を、たとえば銅などからなる管体−に嵌
合させる。ついで、両者の接合部分をたとえばガスバー
ナなどによりはんだ溶融温度以上に加熱するとともに、
図示せぬ超音波ホーンにより超音波振動を付与する。す
ると、管体([句と管体f21のわずかな空隙に、溶融
した鍔状部分(i9a)のはんだが毛細管作用により侵
入し、空隙は溶融はんだによシ充填される。ついで、管
体(1暖と管体(2■を常温にまで冷却すると、両者は
完全にはんだ付は接合される。このように、本実施例の
接合方法によれば、一対の管体のはんだ付は接合に際し
て、接合に必要ガはんだをはんだ棒を巻装させたりする
ことなく供給することができるので、極めて能率的かつ
自動化に適合したものとなる。さらに、はんだコーティ
ングに際して圧縮空気を管体より噴出させることによυ
管体開口の閉塞を防止するようにしているので、管体開
口部にシール材を着脱させる工程を省略できる。
However, the axis of the primary coating film near the solder surface did not melt completely due to the influence of the outside air, and on the contrary, small slivers of solder were added, resulting in a blob-like accumulation of solder. Then, in the same way as the second solder coating film, when the tube (1) is pulled up and cooled, the fifth
A secondary solder coating film as shown in the figure is formed. This secondary solder coating film has a uniform thickness for the most part, but the part opposite to the opening of the tube a9 has a flange-like part (19a). And the flange-shaped part (19a) is the same as the solder rod (4),
It serves as a source of solder for bonding. However, the tube body (1
The joint end of step 5) is fitted into a tube body made of copper or the like. Next, the joint between the two is heated to a temperature higher than the solder melting temperature using, for example, a gas burner, and
Ultrasonic vibrations are applied by an ultrasonic horn (not shown). Then, the molten solder in the brim-shaped portion (i9a) enters the small gap between the tube body (F21) by capillary action, and the gap is filled with the molten solder. When 1 and the tube body (2) are cooled to room temperature, they are completely soldered and joined together.In this way, according to the joining method of this embodiment, the soldering of a pair of tube bodies is as easy as when joining. Since the solder necessary for bonding can be supplied without wrapping the solder rod, it is extremely efficient and suitable for automation.Furthermore, compressed air can be jetted out from the tube during solder coating. yoυ
Since the tube opening is prevented from being blocked, the step of attaching and removing the sealing material to the tube opening can be omitted.

なお、上記実施例においては、圧縮空気を噴出させるこ
と岐よシ、管体の開口端部の閉塞を防止しているが、と
くにこのようにしなくても、管体の溶融はんだに浸漬し
ていない他方の端部を閉止すれば、内部に滞留している
空気が膨張するので、この空気の膨張を利用して開口端
部の閉塞を防止するようにしてもよい。さらに、上記実
施例においては、アルミニウムと銅との異種金属間の接
合を例示しているが、同種金属間の接合にも適用できる
ことはもちろんである。さらにまた、管体の溶融はんだ
への浸漬は、はんだコーティング層のはんだ量が少ない
場合は、2回に限ることなく、適宜、浸漬回数を増加し
てもよい。また、上記実施例においてははんだ付けに際
して超音波を付加しているが、これに制約されることな
く、フラックスを利用してはんだ付けするようにしても
よい。
In the above embodiment, the opening end of the tube body is prevented from being blocked by blowing out compressed air. If the other end is closed, the air remaining inside expands, and the expansion of this air may be used to prevent the open end from being blocked. Further, in the above embodiments, bonding between dissimilar metals such as aluminum and copper is exemplified, but it goes without saying that the present invention can also be applied to bonding between similar metals. Furthermore, if the amount of solder in the solder coating layer is small, the number of times the tube is dipped into the molten solder is not limited to two times, but may be increased as appropriate. Further, in the above embodiment, ultrasonic waves are applied during soldering, but soldering may be performed using flux without being limited to this.

さらに、場合によっては、冷却ノズル(l’v 、α7
)を省略して、自然空冷により冷却してもよい。
Furthermore, in some cases, cooling nozzles (l'v, α7
) may be omitted and cooling may be performed by natural air cooling.

〔発明の効果〕〔Effect of the invention〕

本発明は、一方の管体の端部が他方の管体の端部に嵌合
された一対の管体の嵌合部位のはんだ付は接合において
、他方の管体に嵌入される一方の管体の端部を溶融はん
だ浴に少なくとも2回以上浸漬させることにより鍔状の
厚肉部分を有するはんだコーテイング膜を形成するよう
にしだもので、はんだ付は接合ごとにはんた棒を接合部
近傍に巻装して逐一はんだを供給する不便がなくなる。
The present invention provides a method for soldering a fitting portion of a pair of tubes, in which an end of one tube is fitted to an end of the other tube, when one tube is fitted into the other tube. The end of the body is immersed in a molten solder bath at least twice to form a solder coating film with a thick flange-like part. This eliminates the inconvenience of winding the solder nearby and supplying the solder one by one.

その結果、接合能小が向上し、接合作業が自動化に極め
て適合したものと力る。
As a result, we believe that welding performance has improved and welding work is highly suitable for automation.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は従来のはんだ利は接合を説明するた
めの要部断面図、第3図は本発明の一実施例の接合方法
に用いられるはんだコーティング装置の要部説明図、第
4図及び第5図は本発明の一実施例の接合方法において
形成されたはんだコーテイング膜を示す要部断面図であ
る。 (5):はんだ槽、      (8) :超音波ホー
ン。 (L51=管体(一方の)。 α81ニ一次はんだコーテイング膜。 (11:二次はんだゝ−ティング膜・(201:管体(
他方の)。
1 and 2 are cross-sectional views of the main parts for explaining conventional solder joints, and FIG. 4 and 5 are sectional views of essential parts showing a solder coating film formed in a bonding method according to an embodiment of the present invention. (5): Solder bath, (8): Ultrasonic horn. (L51 = Tube (one side). α81 primary solder coating film. (11: Secondary soldering film, (201: Tube (
the other).

Claims (3)

【特許請求の範囲】[Claims] (1)一対の管体のうち一方の管体の端部を他方の管体
の端部に嵌合したのち嵌合部位をはんだ付けにより接合
する接合方法において、上記一方の管体の端部を溶融は
んだ浴に浸漬したのち引上げて上記一方の管体の端部外
周面に一次はんだコーテイング膜を被着させる工程と、
上記−次はんだコーテイング膜が被着された上記一方の
管体の端部を再度上記溶融はんだ浴に浸漬したのち引上
げて上記−次はんだコーテイング膜の上記一方の管体の
開口側とは反対側部分に鍔状の厚肉部分を有する二次は
んだコーテイング膜を上記−次はんだコーテイング膜上
に形成する工程と、上記一方の管体の上記二次はんだコ
ーテイング膜が形成された端部を上記他方の管体に嵌合
させたのち加熱して上記一対の管体をはんだ付けによシ
接合する工程とを具備することを特徴とする接合方法。
(1) In a joining method in which the end of one of a pair of tubes is fitted to the end of the other tube and the fitted portions are joined by soldering, the end of the one tube is immersing the tube in a molten solder bath and then pulling it up to deposit a primary solder coating film on the outer peripheral surface of the end of the one tube;
The end of the above-mentioned one tube on which the above-mentioned -next solder coating film has been applied is immersed again in the above-mentioned molten solder bath, and then pulled up to the side opposite to the opening side of the above-mentioned one of the above-mentioned pipe bodies with the above-mentioned -next solder coating film applied. forming a secondary solder coating film having a brim-like thick portion on the secondary solder coating film; A joining method comprising the steps of: fitting the pair of tube bodies together, and then heating and joining the pair of tube bodies by soldering.
(2)−次はんだコーテイング膜を形成するために−X
管体を溶融はんだ浴に浸漬−しているときに上記一方の
管体に超音波振動を付与することを特徴とする特許請求
の範囲第1項記載の接合方法。
(2) - To form the next solder coating film -X
2. The joining method according to claim 1, wherein ultrasonic vibrations are applied to said one tube while the tube is immersed in a molten solder bath.
(3)−次はんだコーテイング膜及び二次はんだコーテ
イング膜の形成のために溶融はんだ浴に一方の管体を浸
漬している間において上記一方の管体の開口端部よシ気
体を噴出させ上記開口端部の閉塞を防止することを特徴
とする特許請求の範囲第1項又は第2項記載の接合方法
(3)-While one tube is immersed in a molten solder bath to form the next solder coating film and the second solder coating film, gas is blown out from the open end of the one tube. The joining method according to claim 1 or 2, characterized in that the opening end is prevented from being blocked.
JP21929582A 1982-12-16 1982-12-16 Joining method Granted JPS59110460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21929582A JPS59110460A (en) 1982-12-16 1982-12-16 Joining method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21929582A JPS59110460A (en) 1982-12-16 1982-12-16 Joining method

Publications (2)

Publication Number Publication Date
JPS59110460A true JPS59110460A (en) 1984-06-26
JPS6111711B2 JPS6111711B2 (en) 1986-04-04

Family

ID=16733255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21929582A Granted JPS59110460A (en) 1982-12-16 1982-12-16 Joining method

Country Status (1)

Country Link
JP (1) JPS59110460A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226364A (en) * 1985-07-25 1987-02-04 Aisin Seiki Co Ltd Manufacture of automobile surge tank
US6864294B2 (en) 1999-05-14 2005-03-08 Canon Kabushiki Kaisha Recycled plastic material, electronic apparatus having the recycled plastic material, method of manufacturing plastic part, method of manufacturing the recycled plastic material, and method of reusing plastic material
CN108031937A (en) * 2017-12-06 2018-05-15 昆山万洲特种焊接有限公司 Medical hot pin low pressure assist type brazing device and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH047610U (en) * 1990-04-27 1992-01-23

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226364A (en) * 1985-07-25 1987-02-04 Aisin Seiki Co Ltd Manufacture of automobile surge tank
US6864294B2 (en) 1999-05-14 2005-03-08 Canon Kabushiki Kaisha Recycled plastic material, electronic apparatus having the recycled plastic material, method of manufacturing plastic part, method of manufacturing the recycled plastic material, and method of reusing plastic material
US7452918B2 (en) 1999-05-14 2008-11-18 Canon Kabushiki Kaisha Recycled plastic material, electronic apparatus having the recycled plastic material, method of manufacturing plastic part, method of manufacturing the recycled plastic material, and method of reusing plastic material
CN108031937A (en) * 2017-12-06 2018-05-15 昆山万洲特种焊接有限公司 Medical hot pin low pressure assist type brazing device and method

Also Published As

Publication number Publication date
JPS6111711B2 (en) 1986-04-04

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