JPS60155661A - Method for plating solder to metallic pipe - Google Patents

Method for plating solder to metallic pipe

Info

Publication number
JPS60155661A
JPS60155661A JP1082184A JP1082184A JPS60155661A JP S60155661 A JPS60155661 A JP S60155661A JP 1082184 A JP1082184 A JP 1082184A JP 1082184 A JP1082184 A JP 1082184A JP S60155661 A JPS60155661 A JP S60155661A
Authority
JP
Japan
Prior art keywords
solder
pipe
tube
molten solder
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1082184A
Other languages
Japanese (ja)
Inventor
Fumio Ando
安藤 文雄
Seiichi Koizumi
小泉 清市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1082184A priority Critical patent/JPS60155661A/en
Publication of JPS60155661A publication Critical patent/JPS60155661A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18Removing excess of molten coatings from elongated material
    • C23C2/185Tubes; Wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To prevent remaining of solder as a flash at the end of a metallic pipe by dipping the metallic pipe into the molten solder to plate the solder thereon and pulling upward the pipe from the molten solder then passing air into the metallic pipe and blowing off the air from the end of the pipe. CONSTITUTION:The end of an Al pipe 2 is dipped into the molten solder in a solder bath vessel 4 provided with a heater 3 and an ultrasonic wave is impressed to the solder by an ultrasonic oscillator 5 and an oscillating diaphragm 6 to form a uniform plating layer to the pipe 2. The pipe 2 is thereafter pulled upward from the molten solder and a large amt. of air is supplied from an air compressor 11 via a reducing valve 10, solenoid valve 9 and a joint 13, etc. into the pipe 2 and is blown off from the end. The solder sagging from the end is thus blown off and is prevented from solidifying to form a flash.

Description

【発明の詳細な説明】 〔発明の技ルトi分野〕 本発明は金属管を溶融はんだ中に浸漬してはんだめっき
する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of solder plating a metal tube by immersing it in molten solder.

〔発明の技術的背景〕[Technical background of the invention]

例えば金属管どうしを嵌合しはんだによって接合する場
合、その前工程で両金属管の内面及び外面にはんだを付
着させることが行われる。このはんだの付着は一般に金
属管を溶融はんだ中に浸漬してはんだめっきすることに
よって行われる。
For example, when fitting metal tubes together and joining them with solder, solder is applied to the inner and outer surfaces of both metal tubes in a pre-process. This solder attachment is generally performed by dipping the metal tube into molten solder and plating it with solder.

〔背饋技術の問題点〕[Problems with back-feeding technology]

しかしながら、上記のはんだめつぎ方法では、金属管を
溶融はんだから引上げると、はんだが金属管の下端から
垂下がり且つ急速に冷却されるため、金属管下端にはん
だがパリとなって残り、これが接合の支障になるという
問題があった。
However, in the above-mentioned solder joining method, when the metal tube is pulled up from the molten solder, the solder hangs down from the bottom end of the metal tube and is rapidly cooled. There was a problem in that this hindered bonding.

(発明の目的) 本発明は上記の事情に鑑みてなされたもので、その目的
は、金属管の末端にはんだがパリとなって残ることのな
い金属管のはんだめっき方法を提供するにある。
(Object of the Invention) The present invention has been made in view of the above-mentioned circumstances, and its object is to provide a method for solder plating a metal tube in which solder does not remain in the form of flakes at the end of the metal tube.

〔弁明の概要〕[Summary of defense]

本発明は、金属管を溶融はんだから引上げた後、空気を
金属管内に通してその末端から吹出させるようにし、金
属管の末端から垂下がるはんだを空気により吹飛ばそう
としたものである。
In the present invention, after the metal tube is pulled up from molten solder, air is passed through the metal tube and blown out from the end of the metal tube, and the solder hanging down from the end of the metal tube is blown away by the air.

〔発明の実施例〕[Embodiments of the invention]

以下本発明の一実施例を図面に基づいて説明する。 An embodiment of the present invention will be described below based on the drawings.

本実施例は冷凍サイクルの配管において、鋼管とアルミ
ニウム製冷却器の冷媒管とを嵌合してはんだにより接合
する場合に、その両管の端部に番よんだめっきを施す超
音波はんだめっき装置に適用したものである。
This example is an ultrasonic solder plating device that applies numbered plating to the ends of the steel pipes and the refrigerant pipes of an aluminum cooler when they are fitted and joined by solder in the piping of a refrigeration cycle. It was applied to

まず第1図および第2図は互に接続される銅管1とアル
ミニウム管2(冷却器の冷媒管)とを示す。この銅管1
の先端部は漸次径小となるよう【こテーパ状に絞込まれ
ている。他方アルミニウム管2の端部は拡径され且つそ
の拡径部2aの先端部が漸次径大となるようにテーバ状
に拡げられて(Xる。この場合、拡径部2aの内径寸法
Atま銅管1・の外径寸法Bと同等もしくはこれよりも
僅hl Lこ小さく設定しており、本実施例ではへ寸法
はB1法より約0.05〜0.11小さく設定している
First, FIGS. 1 and 2 show a copper tube 1 and an aluminum tube 2 (refrigerant tubes of a cooler) that are connected to each other. This copper pipe 1
The tip is tapered so that the diameter gradually decreases. On the other hand, the end of the aluminum tube 2 is expanded in diameter, and the tip of the expanded diameter portion 2a is expanded into a tapered shape so that the diameter gradually increases (X).In this case, the inner diameter dimension At of the expanded diameter portion 2a is The outer diameter dimension B of the copper tube 1 is set to be equal to or slightly smaller than this, and in this embodiment, the outer diameter dimension is set to be about 0.05 to 0.11 smaller than the B1 method.

これはアルミニウム管2の内周面に後述する所謂超音波
はIυだめつきを行なう際にアルミニウム管2がその超
音波により浸食されるため、その浸食厚さ分(約0.0
5〜0.1m’m)を見込んで、その分小さく設定しI
こものである。又、拡径部2aの長さ寸法Cは、銅管1
とアルミニウム管2とを後述のようにして嵌合したとき
のその嵌合長さ寸法D(第9図参照)よりもやや短く設
定している。
This is because the aluminum tube 2 is eroded by the ultrasonic wave when the so-called ultrasonic wave, which will be described later, is applied to the inner peripheral surface of the aluminum tube 2 by the ultrasonic wave.
5 to 0.1m'm) and set it smaller accordingly.
It's a small thing. Moreover, the length dimension C of the enlarged diameter portion 2a is the same as that of the copper pipe 1.
The fitting length D (see FIG. 9) is set to be slightly shorter than the fitting length D (see FIG. 9) when the aluminum tube 2 and the aluminum tube 2 are fitted as described below.

次に第3図及び第4図は夫々銅管1及びアルミニウム管
2にはんだを付着させるための超音波はんだめつぎ装置
を示すもので、ヒータ3を備えたはんだの浴槽4内には
超音波振動子5に連結された振動板6が設けられている
。又、浴槽4内の溶融はんだ7に浸漬される銅管1.ア
ルミニウム管2は夫々ソレノイドバルブ8.9及び減圧
弁10゜10を介してエアコンプレッサ11に連結され
た継手12.13に接続するようになっている。そして
、銅管1側についてはソレノイドバルブ8と並列に減圧
弁14.流量制御弁15及びソレノイドバルブ16を直
列に接続して構成したバイパス管路17が設りられてい
る。又、アルミニウム管2側の管路のうち継手13とソ
レノイドバルブ9との間の管18はソレノイドバルブ9
が断電状態にあるとき、そのボート9aを介して大気中
に開放されている。ちなみに、はんだ7としてはZ、1
95%、A15%のアルミニウム用はんだを使用し、は
んだ7の加熱温度は銅管1側で約415℃。
Next, FIGS. 3 and 4 show an ultrasonic soldering device for attaching solder to a copper tube 1 and an aluminum tube 2, respectively. A diaphragm 6 connected to the sonic vibrator 5 is provided. Also, the copper tube 1 immersed in the molten solder 7 in the bath 4 . The aluminum pipes 2 are connected to joints 12, 13 which are connected to the air compressor 11 via solenoid valves 8, 9 and pressure reducing valves 10, 10, respectively. On the copper pipe 1 side, a pressure reducing valve 14 is connected in parallel with the solenoid valve 8. A bypass conduit 17 is provided in which a flow control valve 15 and a solenoid valve 16 are connected in series. Also, among the pipes on the aluminum pipe 2 side, the pipe 18 between the joint 13 and the solenoid valve 9 is connected to the solenoid valve 9.
When the power is cut off, the boat 9a is opened to the atmosphere. By the way, the solder 7 is Z, 1
Use 95% aluminum solder and 15% A solder, and the heating temperature of the solder 7 on the copper tube 1 side is approximately 415°C.

アルミニウム管2側で約440°Cを維持するように調
節される。而して、第5図は管接続装置を示すもので、
アルミニウム管2を保持するホルダー19の上方に銅管
1を保持する加圧治具20が上下動可能に設けられ、更
にこの加圧治具20の上部に超音波振動子21が設けら
れている。又、これらホルダー19と加圧治具20との
間には銅管1及びアルミニウム管2の端部を加熱するた
めのガスバーナ22.23が上下二段に夫々複数本ずつ
段けられている。
The temperature is adjusted to maintain approximately 440°C on the aluminum tube 2 side. Therefore, Fig. 5 shows the pipe connection device,
A pressure jig 20 for holding the copper tube 1 is provided above the holder 19 for holding the aluminum tube 2 so as to be movable up and down, and an ultrasonic vibrator 21 is further provided above the pressure jig 20. . Further, between the holder 19 and the pressurizing jig 20, a plurality of gas burners 22 and 23 for heating the ends of the copper tube 1 and the aluminum tube 2 are arranged in two upper and lower stages.

次に銅管1とアルミニウム管2とを接続J−る手順につ
き説明する。それには、まず両管1,2の端部には/V
だを付着させるわけであるが、これは銅管1及びアルミ
ニウム管2を夫々継手12及び13に接続し、そしてソ
レノイドバルブ16に通電し他のソレノイドバルブ8,
9を断電した状態で且つ超音波振動子5を駆動した状態
で第3図及び第4図に示す如く両管1及び2の端部を溶
融tj、んだ7中に浸漬することによって行う。すると
、銅管1内にtよバイパス管路17を通じて減圧弁14
により減圧された低圧の圧縮空気が供給されているため
、銅管1の内圧が高まってその内部に溶融はんだ7が浸
入づることはなく、他方アルミニウム管2内の空気は管
18を通じてソレノイドバルブ9のボー1−98から大
気中に逃出るため、溶融(よんだ7がアルミニウム管2
の内部に浸入することとなり、結局、銅管1は端部の外
周面だ【゛)に溶融はんだ7がN’!し、アルミニウム
管2については端部の内A両周面共に溶融はんだ7が付
着することどなる。このとき溶融はんだ7には振動板6
により超音波(18K l−I Z程度)が印h口され
ている!こめ、所謂キャビテーションを起して溶融はん
だ7中に無数の小さな真空の核が生じ、この核が消滅す
る際の瞬間的な力により銅管1及びアルミニウム管2の
表面の汚れや酸化皮膜が除去され、均一なめつき層を形
成すると共に、超音波により溶II(’liはんだ7の
流動性が高まり、ぬれを促進してめっき性を向上する。
Next, the procedure for connecting the copper tube 1 and the aluminum tube 2 will be explained. To do this, first, at the ends of both pipes 1 and 2, /V
This involves connecting the copper pipe 1 and the aluminum pipe 2 to the joints 12 and 13, respectively, and then energizing the solenoid valve 16 to connect the other solenoid valves 8,
This is done by immersing the ends of both tubes 1 and 2 in molten solder 7, as shown in FIGS. . Then, the pressure reducing valve 14 is inserted into the copper pipe 1 through the bypass pipe line 17.
Since low-pressure compressed air is supplied, the internal pressure of the copper tube 1 will not increase and the molten solder 7 will not infiltrate into the interior of the copper tube 1. On the other hand, the air inside the aluminum tube 2 passes through the tube 18 to the solenoid valve 9. In order to escape from the tube 1-98 into the atmosphere, the melted (read 7)
As a result, the molten solder 7 penetrates into the inside of the copper tube 1, and the molten solder 7 ends up on the outer peripheral surface of the end of the copper tube 1. However, as for the aluminum tube 2, the molten solder 7 adheres to both inner peripheral surfaces A of the end portion. At this time, the vibration plate 6 is attached to the molten solder 7.
Ultrasonic waves (approximately 18 Kl-IZ) are recorded by this method! As a result, so-called cavitation occurs and countless small vacuum nuclei are generated in the molten solder 7, and when these nuclei disappear, the instantaneous force removes dirt and oxide films on the surfaces of the copper tube 1 and aluminum tube 2. In addition to forming a uniform plating layer, the ultrasonic waves increase the fluidity of the molten II ('li) solder 7, promoting wetting and improving plating properties.

そして、この浸漬後、両管1及び2を溶融はんだ7中か
ら引上げ、この引上げの直後にソレノイドバルブ8.9
に通電する。
After this immersion, both pipes 1 and 2 are pulled up from the molten solder 7, and immediately after this pulling up, the solenoid valve 8.
energize.

すると、多量の圧縮空気がソレノイドバルブ8゜9を通
じて両管1.2内に供給され、その空気は銅管1.アル
ミニウム管2内を流通してその末端から吹出る。これに
より、両管1,2の末端から「しずく」のように垂下が
るはんだを圧縮空気により吹飛ばし、はんだが[しずく
」状に固化しパリとなって残ることを防止する。尚、銅
管1については接合に必要なはんだ但を確保するために
上述の溶Illはんだ7中への浸漬を更にもう一度行い
(二度めの浸漬深さは一度目よりやや浅くする。)、ア
ルミニウム管2については内周面のはんだ付着厚を均一
化するために上述の空気吹出しを二度行うと良い。
Then, a large amount of compressed air is supplied into both pipes 1.2 through the solenoid valve 8°9, and the air is supplied to the copper pipes 1.2. It flows through the aluminum tube 2 and blows out from its end. As a result, the solder hanging down like "drops" from the ends of both tubes 1 and 2 is blown away by the compressed air, and the solder is prevented from solidifying into "drops" and remaining as flakes. In addition, in order to secure the solder necessary for joining, the copper tube 1 is dipped into the molten solder 7 described above once again (the second immersion depth is slightly shallower than the first time). Regarding the aluminum tube 2, it is preferable to perform the above-mentioned air blowing twice in order to equalize the thickness of solder adhesion on the inner circumferential surface.

さて、以上のようにして端部に薄いはんだ層24及び2
5が付着された銅管1及びアルミニウム管2を第5図に
示ずように夫々加圧冶具20及びボルダ−19に保持し
て上下に対向させ、そして加圧冶具20を降下させて第
6図に示ず如く銅管1の下端をアルミニウム管2の上端
に弱い加圧力でもって突合わせる。次いでこの突合わせ
状態の下で第7図の如くガスバーナ22及び23により
両管1及び2の端部を加熱しそのは/υだ層24及び2
5を溶融せしめる。尚、このとき銅tR1に加える圧力
が大きすぎると、一方のはんだ層24又は25が溶融し
た段階で銅管1がアルミニウム管2内に押込まれてしま
い、良好なる結合状態が得られなくなるので、その加圧
力は極く弱いものどじている。そして、両はんだ層24
及び25が溶融したところで、超音波振動子21を駆動
しつつ加圧冶具20により銅管1を強い加圧力で押下げ
C該銅管1のう::部を第8図のようにアルミニウム管
2の端部内側に嵌込む。このときの銅管1の押下げ聞は
アルミニウム管2の拡径部2aの長さ寸法Cよりもやや
大きクシ、これにてアルミニウムよりも強度の大なる銅
管1にJ:ってアルミニウム管2の拡径部2aの下方部
を押広げるようにづ−る。
Now, as described above, the thin solder layers 24 and 2 are applied to the ends.
As shown in FIG. 5, the copper tube 1 and the aluminum tube 2 to which No. 5 is attached are held in a pressure jig 20 and a boulder 19, respectively, so as to face each other vertically, and then the pressure jig 20 is lowered to form the sixth As shown in the figure, the lower end of the copper tube 1 is butted against the upper end of the aluminum tube 2 with a weak pressure. Next, in this abutted state, the ends of both tubes 1 and 2 are heated by gas burners 22 and 23 as shown in FIG.
5 is melted. Note that if the pressure applied to the copper tR1 at this time is too large, the copper tube 1 will be pushed into the aluminum tube 2 when one of the solder layers 24 or 25 is melted, and a good bonding state will not be obtained. The pressure is extremely weak, but it's still bothering me. Then, both solder layers 24
When the copper tube 1 and 25 are melted, the pressure jig 20 is used to press down the copper tube 1 with strong pressure while driving the ultrasonic vibrator 21. Fit it inside the end of 2. At this time, the pressing distance of the copper tube 1 is slightly larger than the length C of the enlarged diameter part 2a of the aluminum tube 2. 2 by pushing out the lower part of the enlarged diameter part 2a.

そして、この銅管1によるアルミニウム管2の拡径によ
り、両管1及び2が強く接触し、このこととアルミニウ
ム管2の拡径部2aの内径が銅管1の外径よりも予め小
さく設定されていて、超音波はんだめっき時にアルミニ
ウム管2が侵食されても両管1及び2は極く微小なりリ
アランスで密に嵌合されることによって、超音波振動子
21から銅管1に印加される超音波振動がアルミニウム
管2にも有効に伝わり、そしてこの超音波振動により両
はんだ層24及び25の溶融はんだのぬれ性が高まり、
両管1及び2間のクリアランス全体に完全に充填される
。この後、超音波振動の印加及びガスバーナ24,25
による加熱を停止し、自然冷却にJ:りはんだを固化さ
せ、これにて第9図に示すように銅管1とアルミニウム
管2とが接合される。
The expansion of the diameter of the aluminum tube 2 by the copper tube 1 brings the two tubes 1 and 2 into strong contact. Even if the aluminum tube 2 is eroded during ultrasonic solder plating, the tubes 1 and 2 are tightly fitted with an extremely small clearance, so that the ultrasonic wave is not applied from the ultrasonic vibrator 21 to the copper tube 1. The ultrasonic vibrations are effectively transmitted to the aluminum tube 2, and this ultrasonic vibration increases the wettability of the molten solder on both solder layers 24 and 25.
The entire clearance between both tubes 1 and 2 is completely filled. After this, application of ultrasonic vibration and gas burner 24, 25
The heating is stopped, and the solder is allowed to cool naturally to solidify, thereby joining the copper tube 1 and the aluminum tube 2 as shown in FIG.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は、金属管を溶融はんだか
ら引上げた後、空気を金属管内に通してその末端から吹
出させるようにしたので、金属管の末端から垂下がるは
んだは空気によって吹飛ばされるようになり、はんだが
パリとなって残る虞れがないという優れた効果を奏する
ものである。
As explained above, in the present invention, after the metal tube is pulled up from the molten solder, air is passed through the metal tube and blown out from the end thereof, so that the solder hanging down from the end of the metal tube is not blown away by the air. This has an excellent effect in that there is no risk of the solder becoming flaky and remaining.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示寸もので、第1図は鋼管及
びアルミニウム管の正面図、第2図は同端部の拡大縦断
面図、第3図及び第4図は夫々超音波はんだめっき装置
のv1%面図、第5図は管接続装置の縦断面図、第6図
乃至第9図は接続工程を順に示す縦断面図である。 図中、1は鋼管、2はアルミニウム管、4ははんだの浴
槽、5は超音波振動子、7は溶融はんだ、11はニアコ
ンプレッサである。 出願人 東京芝浦電気株式会社 第1 口 第2 図 第3 図 第4図 陥5回 一一/− 第7 M 第9図
The drawings show one embodiment of the present invention, in which Fig. 1 is a front view of a steel pipe and an aluminum pipe, Fig. 2 is an enlarged longitudinal cross-sectional view of the same end, and Figs. 3 and 4 are ultrasonic waves. FIG. 5 is a vertical cross-sectional view of the pipe connecting device, and FIGS. 6 to 9 are vertical cross-sectional views sequentially showing the connection process. In the figure, 1 is a steel pipe, 2 is an aluminum pipe, 4 is a solder bath, 5 is an ultrasonic vibrator, 7 is molten solder, and 11 is a near compressor. Applicant Tokyo Shibaura Electric Co., Ltd. No. 1 No. 2 Fig. 3 Fig. 4 5 times 11/- No. 7 M Fig. 9

Claims (1)

【特許請求の範囲】[Claims] 1、金属管を溶融はlυだ中に浸漬してはんだめっきす
る方法において、金属管を溶融はんだから引上げた後、
空気を金属管内に通してその末端から吹出させるように
したことを特徴とする金属管のはんだめっき方法。
1. In the method of solder plating by immersing a metal tube in a molten solder, after pulling the metal tube out of the molten solder,
A method for solder plating a metal tube, characterized in that air is passed through the metal tube and blown out from the end thereof.
JP1082184A 1984-01-24 1984-01-24 Method for plating solder to metallic pipe Pending JPS60155661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1082184A JPS60155661A (en) 1984-01-24 1984-01-24 Method for plating solder to metallic pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1082184A JPS60155661A (en) 1984-01-24 1984-01-24 Method for plating solder to metallic pipe

Publications (1)

Publication Number Publication Date
JPS60155661A true JPS60155661A (en) 1985-08-15

Family

ID=11761018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1082184A Pending JPS60155661A (en) 1984-01-24 1984-01-24 Method for plating solder to metallic pipe

Country Status (1)

Country Link
JP (1) JPS60155661A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0787557A3 (en) * 1996-01-30 1998-07-22 Suzuki Motor Corporation Method of bonding aluminum members

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942228A (en) * 1972-08-18 1974-04-20
JPS52122231A (en) * 1976-02-27 1977-10-14 Gen Electric Portable supersonic wave metal coating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942228A (en) * 1972-08-18 1974-04-20
JPS52122231A (en) * 1976-02-27 1977-10-14 Gen Electric Portable supersonic wave metal coating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0787557A3 (en) * 1996-01-30 1998-07-22 Suzuki Motor Corporation Method of bonding aluminum members
US6148515A (en) * 1996-01-30 2000-11-21 Suzuki Motor Corporation Method of bonding aluminum members

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