JPS59107984A - Metal bonding ceramic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to ceramic parts for metal bonding.

[Prior art and its problems] Recently, new ceramics called new ceramics or fine ceramics have been attracting attention. These products have excellent customization capabilities that break the traditional concept of "pottery" and are expected to enter the fields of structural materials and electronic component materials. However, even if a material has excellent properties, it is desired that all mechanical parts be used in conjunction with metal parts, such that r'x <, when these ceramics can be replaced.

Bonding of ceramics and metals has been carried out for a long time.
A mechanical joining method and adhesives were used. Chemical junctions are used. The former method is effective for stable bonding of ceramics for which chemical bonding is difficult to expect, but it has drawbacks such as avoidance of stress concentration and difficulty in designing the joint shape, such as workability. The latter requires a chemical reaction, which limits the combinations of materials, and considering the matching of thermal expansion coefficients, there are only a few that are in practical use. Nearby Si3N
4°5ick is not enough.

[Purpose of the invention] The present invention) has been made in view of the above points.

The purpose of the present invention is to provide a ceramic component that can be easily and firmly bonded to metal and stably bonded even at high temperatures.

[Summary of the Invention] The present invention involves forming a thin layer of a mixture of metal and ceramic in advance on the part to be joined to metal during molding of the ceramic part, The bonding is performed through the metal contained in the metal.The forming of this thin layer is
For example, this can be carried out by filling a mold of a predetermined shape with ceramic powder, and then placing a mixed powder of ceramic powder and metal powder in the part that requires bonding with metal, and then compressing and sintering. An embodiment of the metal joint of the ceramic component according to the invention is shown in FIG. 9 as shown in FIG.

That is, numeral 11 denotes metal powder that was placed when molding the ceramic component of the present invention, and a portion of it is exposed on the surface. 12 is a ceramic material that is continuous with the main body and fixes the metal powder thereto. The amount of the exposed metal portion can be arbitrarily selected depending on the mixing ratio of the ceramic powder and the metal powder during molding.

[Effects of the Invention] Although the ceramic component of the present invention and the metal are bonded through exposed metal powder as described in (g) above, bonding can be performed by using a brazing material or by direct diffusion bonding. The form of the bond is a mesh because it is bonded to a metal part in a ceramic component. Therefore, the shear stress at the interface caused by the difference in thermal expansion coefficients can be easily alleviated, so that the residual stress at the time of bonding is extremely small, and it can withstand repeated use at high temperatures.

[Embodiment of the invention] 5L with an average particle size of 1 μm was placed in a round bar mold for ceramic parts.
After filling a predetermined amount of 3N4, the Si3N4 powder is covered with a mixed powder containing 50% by volume Pt-20%Rh powder with an average particle diameter of μm to a thickness of approximately 1.5 μm. Thereafter, it was press-molded at a pressure of 500 kg/d, and then sintered at 1750° OX lhr. By this method, a surface on which metal particles are dispersed as shown in FIG. 1 is obtained. Next, the tensile strength of the joined parts was examined using a tensile tester, and it was found that the tensile strength was 12 at room temperature.
Almost the same breaking strength was obtained even at ICg/d and 500°C.

The reason why Pt-2Q%Rh alloy is used in this method is that it has a melting point higher than the sintering temperature of ceramics and is difficult to oxidize. Therefore, if the atmosphere is made non-oxidizing, W, MO
, Ta, Hf, and other high melting point metals can be used.

[Other Examples] According to a method for obtaining the same effect as the present invention, a material that easily vaporizes at the sintering temperature of ceramics or a sintered material is used as a metal powder in the process of forming a ceramic/metal mixed layer of a joint part. Materials that can be eluted with post-acid, alkali, etc. (metals,
A conceivable method is to use non-metallic material (not limited to non-metals), make the surface porous when the part is completed, and then fill the core pores with bonding metal powder by high-temperature hot pressing.

[Brief explanation of the drawing]

FIG. 1 is an enlarged view of the joint portion of the ceramic component with metal according to the present invention.

Claims (1)

[Claims] A ceramic component for metal bonding, characterized in that the surface of the part that requires bonding to metal is composed of a mixture of ceramic and metal.