JPS59107149U - Heat dissipation structure of numeric display IC - Google Patents
Heat dissipation structure of numeric display ICInfo
- Publication number
- JPS59107149U JPS59107149U JP159083U JP159083U JPS59107149U JP S59107149 U JPS59107149 U JP S59107149U JP 159083 U JP159083 U JP 159083U JP 159083 U JP159083 U JP 159083U JP S59107149 U JPS59107149 U JP S59107149U
- Authority
- JP
- Japan
- Prior art keywords
- numeric display
- dissipation structure
- heat dissipation
- heat sink
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、本考案の一実施例を示す横断面図、第2図は
、従来の放熱構造の横断面図、第3図は、従来の放熱構
造におけるICと放熱板との接触不良の状態を示す横断
面図、第4図は、第1図の詳細を示す分解図である。
1・・・放熱板、2・・・ホルダー、3・・・スプリン
グ、4・・・ネジ、5・・・長孔、6・・・プリント基
板、7・・・ソケット、訃・・数字表示用IC,9・・
・ガイド。FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional heat dissipation structure, and FIG. 3 is a cross-sectional view of a conventional heat dissipation structure showing poor contact between an IC and a heat sink. FIG. 4, which is a cross-sectional view showing the state, is an exploded view showing details of FIG. 1. 1... Heat sink, 2... Holder, 3... Spring, 4... Screw, 5... Long hole, 6... Printed circuit board, 7... Socket, End... Numerical display IC, 9...
·guide.
Claims (1)
えて数字表示用ICの熱を放熱させる放熱板とからなり
、該ホルダーに前記ICに向けて放熱板をスライドさせ
るガイドと、放熱板を前記ICに圧接させるスプリング
機構とを装備したことする数字表示用ICの放熱構造。It consists of a holder fixed to a printed circuit board, and a heat sink supported on the holder to dissipate the heat of the numeric display IC.The holder includes a guide for sliding the heat sink toward the IC, and a guide for sliding the heat sink toward the IC, and a guide for sliding the heat sink toward the IC. A heat dissipation structure for a numeric display IC equipped with a spring mechanism that presses into contact with the numeric display IC.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP159083U JPS59107149U (en) | 1983-01-10 | 1983-01-10 | Heat dissipation structure of numeric display IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP159083U JPS59107149U (en) | 1983-01-10 | 1983-01-10 | Heat dissipation structure of numeric display IC |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59107149U true JPS59107149U (en) | 1984-07-19 |
Family
ID=30133307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP159083U Pending JPS59107149U (en) | 1983-01-10 | 1983-01-10 | Heat dissipation structure of numeric display IC |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59107149U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61130983U (en) * | 1985-01-31 | 1986-08-15 |
-
1983
- 1983-01-10 JP JP159083U patent/JPS59107149U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61130983U (en) * | 1985-01-31 | 1986-08-15 |
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