JPS59103470U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS59103470U JPS59103470U JP19582982U JP19582982U JPS59103470U JP S59103470 U JPS59103470 U JP S59103470U JP 19582982 U JP19582982 U JP 19582982U JP 19582982 U JP19582982 U JP 19582982U JP S59103470 U JPS59103470 U JP S59103470U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- lead wire
- connection
- connection hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のプリント配線基板の接続状態を示す斜視
図、第2図は第1図に示すプリント配線基板の接続部分
の詳細を示す斜視図、第3図は本考案の一実施例に係る
プリント配線基板の接続状態を示す斜視図、第4図は第
3図のプリント配線基板が半田付にて接続された状態を
示す斜視図、第5図は本考案の他の実施例に係るプリン
ト配線基板の接続状態を示す斜視図である。
1・・・・・・回路基板支持枠、2・・・・・・シール
ド板、3・・・・・・第1のプリント配線基板、4・・
・・・・第2のプリント配線基板、3a、 4a・・・
・・・接続孔、3b、 4b −・・・・・・
絶縁レジスト皮膜、3c、 4c・・・・・・回路配
線パターン露出部、5・・・・・・コの字状接続リード
線、6・・・・・・半田。
第2 図
粂3 図Fig. 1 is a perspective view showing the connection state of a conventional printed wiring board, Fig. 2 is a perspective view showing details of the connection part of the printed wiring board shown in Fig. 1, and Fig. 3 is an embodiment of the present invention. FIG. 4 is a perspective view showing a state in which the printed wiring board of FIG. 3 is connected by soldering; FIG. 5 is a perspective view showing a state in which the printed wiring board of FIG. 3 is connected by soldering; FIG. FIG. 3 is a perspective view showing a connected state of a printed wiring board. DESCRIPTION OF SYMBOLS 1... Circuit board support frame, 2... Shield plate, 3... First printed wiring board, 4...
...Second printed wiring board, 3a, 4a...
...Connection hole, 3b, 4b -...
Insulating resist film, 3c, 4c... Exposed portion of circuit wiring pattern, 5... U-shaped connection lead wire, 6... Solder. Figure 2 Figure 3
Claims (1)
た回路配線パターンが電気的に接続されるプリント配線
基板に於て、接続リード線が挿入される接続孔を設ける
と共に、この接続孔と分離且つ隣接して、接続リード線
が半田付される回路線パターン露出部を設けたことを特
徴とするプリント配線基板。In the printed wiring board to which the circuit wiring pattern provided on each printed wiring board is electrically connected via the connection lead wire, a connection hole into which the connection lead wire is inserted is provided, and a connection hole is separated from the connection hole. A printed wiring board characterized in that an exposed circuit line pattern portion to which a connection lead wire is soldered is provided adjacent to the printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19582982U JPS59103470U (en) | 1982-12-28 | 1982-12-28 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19582982U JPS59103470U (en) | 1982-12-28 | 1982-12-28 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59103470U true JPS59103470U (en) | 1984-07-12 |
Family
ID=30420414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19582982U Pending JPS59103470U (en) | 1982-12-28 | 1982-12-28 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59103470U (en) |
-
1982
- 1982-12-28 JP JP19582982U patent/JPS59103470U/en active Pending
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