JPS59103289A - 電気端子接点を金属化する方法 - Google Patents

電気端子接点を金属化する方法

Info

Publication number
JPS59103289A
JPS59103289A JP58216414A JP21641483A JPS59103289A JP S59103289 A JPS59103289 A JP S59103289A JP 58216414 A JP58216414 A JP 58216414A JP 21641483 A JP21641483 A JP 21641483A JP S59103289 A JPS59103289 A JP S59103289A
Authority
JP
Japan
Prior art keywords
metal
noble metal
gold
composition
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58216414A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6120116B2 (enExample
Inventor
ジヨゼフ・アントン・オズワルド・ジユニア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPS59103289A publication Critical patent/JPS59103289A/ja
Publication of JPS6120116B2 publication Critical patent/JPS6120116B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550°C
    • B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550°C a Pt-group metal as principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacture Of Switches (AREA)
  • Contacts (AREA)
  • Non-Insulated Conductors (AREA)
JP58216414A 1982-11-19 1983-11-18 電気端子接点を金属化する方法 Granted JPS59103289A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/442,956 US4461785A (en) 1982-11-19 1982-11-19 Process for electrical terminal contact metallization
US442956 1989-11-29

Publications (2)

Publication Number Publication Date
JPS59103289A true JPS59103289A (ja) 1984-06-14
JPS6120116B2 JPS6120116B2 (enExample) 1986-05-20

Family

ID=23758864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58216414A Granted JPS59103289A (ja) 1982-11-19 1983-11-18 電気端子接点を金属化する方法

Country Status (6)

Country Link
US (1) US4461785A (enExample)
EP (1) EP0110641A1 (enExample)
JP (1) JPS59103289A (enExample)
KR (1) KR840006681A (enExample)
BR (1) BR8306272A (enExample)
CA (1) CA1211998A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69030520T2 (de) * 1989-01-24 1997-08-07 Fujitsu Ltd Verfahren zur Herstellung einer supraleitenden Schicht
US5281176A (en) * 1991-07-22 1994-01-25 Daido Tokushuko Kabushiki Kaisha Contact member with composite sintered metal paste strip having 1-5 wt % carbon diffusion bonded therein
CN1539028A (zh) * 2001-06-04 2004-10-20 ���ڵٿ����޹�˾ 形成图案的方法
CN102365909B (zh) * 2009-03-27 2016-05-18 皇家飞利浦电子股份有限公司 用于制造集成电路的设备和方法
DE102019205289B4 (de) * 2019-04-12 2021-02-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anlage zur Herstellung elektrischer Kontaktelemente mit selektiv veredelten elektrischen Kontaktflächen

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE543253A (enExample) * 1954-12-01
US3702780A (en) * 1969-02-11 1972-11-14 Gen Technologies Corp Process of plating by pyrolytic deposition
US3645774A (en) * 1969-09-15 1972-02-29 Amp Inc Gold coating by salt decomposition
US4146957A (en) * 1977-01-17 1979-04-03 Engelhard Minerals & Chemicals Corporation Thick film resistance thermometer
US4219448A (en) * 1978-06-08 1980-08-26 Bernd Ross Screenable contact structure and method for semiconductor devices
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
US4235944A (en) * 1979-10-29 1980-11-25 E. I. Du Pont De Nemours And Company Process for producing gold conductors
DE3107079A1 (de) * 1981-02-25 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Partielle beschichtung von kontaktbauteilen mit edelmetallen

Also Published As

Publication number Publication date
CA1211998A (en) 1986-09-30
KR840006681A (ko) 1984-12-01
JPS6120116B2 (enExample) 1986-05-20
US4461785A (en) 1984-07-24
EP0110641A1 (en) 1984-06-13
BR8306272A (pt) 1984-07-03

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