JPS59100555A - 気密端子およびその製造方法 - Google Patents

気密端子およびその製造方法

Info

Publication number
JPS59100555A
JPS59100555A JP21022482A JP21022482A JPS59100555A JP S59100555 A JPS59100555 A JP S59100555A JP 21022482 A JP21022482 A JP 21022482A JP 21022482 A JP21022482 A JP 21022482A JP S59100555 A JPS59100555 A JP S59100555A
Authority
JP
Japan
Prior art keywords
glass
iron
lead wire
sealing glass
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21022482A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0380351B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tadayoshi Ando
安藤　忠義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Denka Inc
Original Assignee
Fuji Denka Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Denka Inc filed Critical Fuji Denka Inc
Priority to JP21022482A priority Critical patent/JPS59100555A/ja
Publication of JPS59100555A publication Critical patent/JPS59100555A/ja
Publication of JPH0380351B2 publication Critical patent/JPH0380351B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21022482A 1982-11-30 1982-11-30 気密端子およびその製造方法 Granted JPS59100555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21022482A JPS59100555A (ja) 1982-11-30 1982-11-30 気密端子およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21022482A JPS59100555A (ja) 1982-11-30 1982-11-30 気密端子およびその製造方法

Publications (2)

Publication Number Publication Date
JPS59100555A true JPS59100555A (ja) 1984-06-09
JPH0380351B2 JPH0380351B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-12-24

Family

ID=16585838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21022482A Granted JPS59100555A (ja) 1982-11-30 1982-11-30 気密端子およびその製造方法

Country Status (1)

Country Link
JP (1) JPS59100555A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186349A (ja) * 1983-04-06 1984-10-23 Shinko Electric Ind Co Ltd 気密封止用ステム
CN110950549A (zh) * 2019-12-31 2020-04-03 西安赛尔电子材料科技有限公司 一种用于储能焊接的可伐合金-玻璃封接工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186349A (ja) * 1983-04-06 1984-10-23 Shinko Electric Ind Co Ltd 気密封止用ステム
CN110950549A (zh) * 2019-12-31 2020-04-03 西安赛尔电子材料科技有限公司 一种用于储能焊接的可伐合金-玻璃封接工艺

Also Published As

Publication number Publication date
JPH0380351B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-12-24

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