JPS5896740A - テ−ブル移動機構ユニツト - Google Patents

テ−ブル移動機構ユニツト

Info

Publication number
JPS5896740A
JPS5896740A JP19491181A JP19491181A JPS5896740A JP S5896740 A JPS5896740 A JP S5896740A JP 19491181 A JP19491181 A JP 19491181A JP 19491181 A JP19491181 A JP 19491181A JP S5896740 A JPS5896740 A JP S5896740A
Authority
JP
Japan
Prior art keywords
block
cylinder
rams
ram
cylinders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19491181A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0260463B2 (enrdf_load_stackoverflow
Inventor
Masashi Takada
高田　正志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19491181A priority Critical patent/JPS5896740A/ja
Publication of JPS5896740A publication Critical patent/JPS5896740A/ja
Publication of JPH0260463B2 publication Critical patent/JPH0260463B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Machine Tool Positioning Apparatuses (AREA)
  • Machine Tool Units (AREA)
  • Reciprocating Conveyors (AREA)
JP19491181A 1981-12-03 1981-12-03 テ−ブル移動機構ユニツト Granted JPS5896740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19491181A JPS5896740A (ja) 1981-12-03 1981-12-03 テ−ブル移動機構ユニツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19491181A JPS5896740A (ja) 1981-12-03 1981-12-03 テ−ブル移動機構ユニツト

Publications (2)

Publication Number Publication Date
JPS5896740A true JPS5896740A (ja) 1983-06-08
JPH0260463B2 JPH0260463B2 (enrdf_load_stackoverflow) 1990-12-17

Family

ID=16332384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19491181A Granted JPS5896740A (ja) 1981-12-03 1981-12-03 テ−ブル移動機構ユニツト

Country Status (1)

Country Link
JP (1) JPS5896740A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7100515B2 (en) * 2001-03-16 2006-09-05 Rohwedder Microtech Gmbh & Co. Kg Device for positioning a tool within a predetermined working area
JP2011105446A (ja) * 2009-11-17 2011-06-02 Miura:Kk 搬送装置
CN106239176A (zh) * 2016-08-29 2016-12-21 天津市华天世纪机械有限公司 一种车铣复合滑枕装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7100515B2 (en) * 2001-03-16 2006-09-05 Rohwedder Microtech Gmbh & Co. Kg Device for positioning a tool within a predetermined working area
JP2011105446A (ja) * 2009-11-17 2011-06-02 Miura:Kk 搬送装置
CN106239176A (zh) * 2016-08-29 2016-12-21 天津市华天世纪机械有限公司 一种车铣复合滑枕装置

Also Published As

Publication number Publication date
JPH0260463B2 (enrdf_load_stackoverflow) 1990-12-17

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