JPS5895652U - semiconductor stack - Google Patents

semiconductor stack

Info

Publication number
JPS5895652U
JPS5895652U JP19192581U JP19192581U JPS5895652U JP S5895652 U JPS5895652 U JP S5895652U JP 19192581 U JP19192581 U JP 19192581U JP 19192581 U JP19192581 U JP 19192581U JP S5895652 U JPS5895652 U JP S5895652U
Authority
JP
Japan
Prior art keywords
flat
semiconductor stack
stack
semiconductor
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19192581U
Other languages
Japanese (ja)
Inventor
研二 木島
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP19192581U priority Critical patent/JPS5895652U/en
Publication of JPS5895652U publication Critical patent/JPS5895652U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は、それぞれ風冷式及び自冷式の従来
の半導体スタックの説明図。第3図はこの考案の一実施
例を示す要部の断面図、第4図及び第5図はそれぞれ異
なる変形例の要部断面図である。 1・・・平型半導体素子、2・・・冷却フィン、11・
・・カバー。
FIG. 1 and FIG. 2 are explanatory diagrams of conventional semiconductor stacks of an air-cooled type and a self-cooled type, respectively. FIG. 3 is a sectional view of a main part showing one embodiment of this invention, and FIGS. 4 and 5 are sectional views of main parts of different modifications. DESCRIPTION OF SYMBOLS 1... Flat semiconductor element, 2... Cooling fin, 11.
··cover.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平型半導体素子の両側を冷却ラインで挾んで加圧保持し
た半導体スタックにおいて、可撓性、絶縁性及び耐熱性
を有する材料からなるベロー形のカバーを、上記平型素
子の外周を包囲する状態でその両側冷却フィン相互間に
上記平型素子と共に加圧保持して設けたことを特徴とす
る半導体スタック。
In a semiconductor stack in which a flat semiconductor element is held under pressure by sandwiching both sides of the flat semiconductor element between cooling lines, a bellows-shaped cover made of a flexible, insulating, and heat-resistant material surrounds the outer periphery of the flat element. What is claimed is: 1. A semiconductor stack, characterized in that the above-mentioned flat element is held under pressure between cooling fins on both sides of the stack.
JP19192581U 1981-12-23 1981-12-23 semiconductor stack Pending JPS5895652U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19192581U JPS5895652U (en) 1981-12-23 1981-12-23 semiconductor stack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19192581U JPS5895652U (en) 1981-12-23 1981-12-23 semiconductor stack

Publications (1)

Publication Number Publication Date
JPS5895652U true JPS5895652U (en) 1983-06-29

Family

ID=30105362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19192581U Pending JPS5895652U (en) 1981-12-23 1981-12-23 semiconductor stack

Country Status (1)

Country Link
JP (1) JPS5895652U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5311963B2 (en) * 1972-05-04 1978-04-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5311963B2 (en) * 1972-05-04 1978-04-26

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