JPS58173247U - semiconductor conversion equipment - Google Patents
semiconductor conversion equipmentInfo
- Publication number
- JPS58173247U JPS58173247U JP6965382U JP6965382U JPS58173247U JP S58173247 U JPS58173247 U JP S58173247U JP 6965382 U JP6965382 U JP 6965382U JP 6965382 U JP6965382 U JP 6965382U JP S58173247 U JPS58173247 U JP S58173247U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor conversion
- conversion equipment
- cooling
- electrically
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体変換装置のスタックの斜視図、第
２図は本考案の実実施例による半導体変、 検装置のス
タックの斜視図、第３図はそのＡ−Ａ視断面図、第４図
はその絶縁フランジの斜視図ぞある。
１・・・・・・半導体素子、２・・・・・・冷却体、３
・・・・・・風胴板、４・・・・・・風胴、５・・・・
・・冷却ファン、６・・・・・・絶縁フランジ、７・・
・・・・絶縁ボルト。1 is a perspective view of a stack of a conventional semiconductor conversion device, FIG. 2 is a perspective view of a stack of a semiconductor conversion and inspection device according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line A-A. Figure 4 is a perspective view of the insulating flange. 1... Semiconductor element, 2... Cooling body, 3
...Wind body plate, 4...Wind body, 5...
...Cooling fan, 6...Insulation flange, 7...
...Insulation bolt.
Claims (1)
体の一端にその冷却フィンに直角方向に当接する電気的
、熱的絶縁材でかつ耐熱性のある絶縁フランジを介して
冷却ファンを取付けるよう、 にしたことを特徴とする
半導体変換装置。The semiconductor device is electrically and thermally attached to a cooling body, and a cooling fan is connected to one end of the cooling body through an insulating flange made of electrically and thermally insulating material and heat resistant that abuts the cooling fins in a direction perpendicular to the cooling fins. A semiconductor conversion device characterized in that it is configured so that it can be attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6965382U JPS58173247U (en) | 1982-05-13 | 1982-05-13 | semiconductor conversion equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6965382U JPS58173247U (en) | 1982-05-13 | 1982-05-13 | semiconductor conversion equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58173247U true JPS58173247U (en) | 1983-11-19 |
Family
ID=30079367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6965382U Pending JPS58173247U (en) | 1982-05-13 | 1982-05-13 | semiconductor conversion equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58173247U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6282793U (en) * | 1985-11-12 | 1987-05-27 |
-
1982
- 1982-05-13 JP JP6965382U patent/JPS58173247U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6282793U (en) * | 1985-11-12 | 1987-05-27 |
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