JPS6282793U - - Google Patents
Info
- Publication number
- JPS6282793U JPS6282793U JP17463585U JP17463585U JPS6282793U JP S6282793 U JPS6282793 U JP S6282793U JP 17463585 U JP17463585 U JP 17463585U JP 17463585 U JP17463585 U JP 17463585U JP S6282793 U JPS6282793 U JP S6282793U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- pair
- parts
- cooled part
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図aは本考案装置の一実施例の取付状態を
示す平面図、第1図bはこの一実施例の斜視図、
第2図はその他の実施例を示す平面図、第3図は
本考案装置のフアン取付部の他の例を示す斜視図
、第4図a,bはそれぞれ第3図のフアン取付部
を用いた本考案装置の取付状態を示す一部の平面
図である。
1……フアン取付部、2……小型フアン本体、
3……放熱用フイン、11a,11b……一対の
取付用脚。
FIG. 1a is a plan view showing an installed state of an embodiment of the device of the present invention, FIG. 1b is a perspective view of this embodiment,
Fig. 2 is a plan view showing another embodiment, Fig. 3 is a perspective view showing another example of the fan mounting part of the device of the present invention, and Figs. FIG. 3 is a partial plan view showing the installed state of the device of the present invention. 1...Fan mounting part, 2...Small fan body,
3... Heat dissipation fins, 11a, 11b... A pair of mounting legs.
Claims (1)
1a,11bを有するフアン取付部1に、小型フ
アン本体2を被冷却部に向けて取付け、この被冷
却部の放熱用フイン3に前記一対の取付用脚11
a,11bをそのバネ力を利用して脱着可能に取
付けてなるスポツト冷却装置。 Mounting leg 1 consisting of a pair of spring elastic bodies at the tip
The small fan main body 2 is attached to the fan attachment part 1 having the parts 1a and 11b facing the cooled part, and the pair of mounting legs 11 are attached to the heat dissipation fins 3 of the cooled part.
A spot cooling device in which parts a and 11b are removably attached using their spring force.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985174635U JPH0310700Y2 (en) | 1985-11-12 | 1985-11-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985174635U JPH0310700Y2 (en) | 1985-11-12 | 1985-11-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6282793U true JPS6282793U (en) | 1987-05-27 |
JPH0310700Y2 JPH0310700Y2 (en) | 1991-03-15 |
Family
ID=31113203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985174635U Expired JPH0310700Y2 (en) | 1985-11-12 | 1985-11-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0310700Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041661A (en) * | 1996-07-22 | 1998-02-13 | Nec Corp | Electronic apparatus cooling structure |
KR20180005444A (en) * | 2016-07-06 | 2018-01-16 | 한국기계연구원 | Ultrasonic cooling apparatus including heat sink fin and cooling fan |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324830U (en) * | 1976-08-11 | 1978-03-02 | ||
JPS54164008A (en) * | 1977-05-26 | 1979-12-27 | Rca Corp | Fan employing high polymer piezobimorph element |
JPS58173247U (en) * | 1982-05-13 | 1983-11-19 | 富士電機株式会社 | semiconductor conversion equipment |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324830B2 (en) * | 1974-03-23 | 1978-07-22 |
-
1985
- 1985-11-12 JP JP1985174635U patent/JPH0310700Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324830U (en) * | 1976-08-11 | 1978-03-02 | ||
JPS54164008A (en) * | 1977-05-26 | 1979-12-27 | Rca Corp | Fan employing high polymer piezobimorph element |
JPS58173247U (en) * | 1982-05-13 | 1983-11-19 | 富士電機株式会社 | semiconductor conversion equipment |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041661A (en) * | 1996-07-22 | 1998-02-13 | Nec Corp | Electronic apparatus cooling structure |
KR20180005444A (en) * | 2016-07-06 | 2018-01-16 | 한국기계연구원 | Ultrasonic cooling apparatus including heat sink fin and cooling fan |
Also Published As
Publication number | Publication date |
---|---|
JPH0310700Y2 (en) | 1991-03-15 |
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