JPS588975U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS588975U JPS588975U JP10358481U JP10358481U JPS588975U JP S588975 U JPS588975 U JP S588975U JP 10358481 U JP10358481 U JP 10358481U JP 10358481 U JP10358481 U JP 10358481U JP S588975 U JPS588975 U JP S588975U
- Authority
- JP
- Japan
- Prior art keywords
- metal conductive
- circuit board
- printed circuit
- disconnection
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案に係るプリント基板の要部平面図、第
２図は第１図における■−Ｖ線断面図、第３図は同プリ
ント基板に半田層をディッピングした状態における要部
断面図である。
１・・・プリント基板、２・・・金属導電部、３・・・
断線用細溝、４・・・レジスト層、６・・・半田層。Fig. 1 is a plan view of the main parts of the printed circuit board according to this invention, Fig. 2 is a sectional view taken along the line ■-V in Fig. 1, and Fig. 3 is a sectional view of the main parts of the printed circuit board in a state where a solder layer is dipped. It is. 1... Printed circuit board, 2... Metal conductive part, 3...
Narrow groove for disconnection, 4... resist layer, 6... solder layer.
Claims (1)
幅方向を横切る略Ω状の断線用細溝を形成するとともに
、その上部に上記金属導電部の幅に等しい直径の円盤状
のレジスト層を積層し、かつ半田ディッピング時には該
レジスト層上に半１）。 層が架橋されて上記細溝によって断線された金属導電部
同士が導通されるようになしたことを特徴とするプリン
ト基板。[Claims for Utility Model Registration] In a strip-shaped metal conductive part formed on a printed circuit board, a thin groove for disconnection in the shape of approximately Ω is formed across the width direction of the strip, and at the top thereof, a thin groove for disconnection is formed in the width direction of the metal conductive part. A disk-shaped resist layer of equal diameter is laminated, and half 1) is placed on the resist layer during solder dipping. 1. A printed circuit board characterized in that the layers are cross-linked so that the metal conductive parts disconnected by the narrow grooves are electrically connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10358481U JPS588975U (en) | 1981-07-13 | 1981-07-13 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10358481U JPS588975U (en) | 1981-07-13 | 1981-07-13 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS588975U true JPS588975U (en) | 1983-01-20 |
Family
ID=29898194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10358481U Pending JPS588975U (en) | 1981-07-13 | 1981-07-13 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS588975U (en) |
-
1981
- 1981-07-13 JP JP10358481U patent/JPS588975U/en active Pending
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