JPS588957U - Connection mechanism for power semiconductor devices - Google Patents

Connection mechanism for power semiconductor devices

Info

Publication number
JPS588957U
JPS588957U JP10265481U JP10265481U JPS588957U JP S588957 U JPS588957 U JP S588957U JP 10265481 U JP10265481 U JP 10265481U JP 10265481 U JP10265481 U JP 10265481U JP S588957 U JPS588957 U JP S588957U
Authority
JP
Japan
Prior art keywords
power semiconductor
connection mechanism
adapter
conductor
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10265481U
Other languages
Japanese (ja)
Other versions
JPS6240437Y2 (en
Inventor
山地　宏
岡本　逸雄
山形　俊男
尚 佐藤
勉 高橋
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP10265481U priority Critical patent/JPS588957U/en
Publication of JPS588957U publication Critical patent/JPS588957U/en
Application granted granted Critical
Publication of JPS6240437Y2 publication Critical patent/JPS6240437Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は電力用半導体素子を示す斜視図、第２図の４９
０図は従来の接続機構を示す上面図イ、及び正面−口、
第３図の４９０図は本考案の一実施例であるアダプタを
示す斜視図イ及び接続機構を示す正面図口、第４図の４
１０図は本考案の他の実施例である導体の斜視図イ及び
接続機構を示す正面図口である。図において１は電力用
半導体素子、２は端子、３はスタッド、４．２１は放熱
器、５は貫通孔、６は座ぐり、７はスプリングワッシャ
、８はナツト、９，１０．２３は導体、１１はアダプタ
、ｌｌａ、ＩＩＣはねじ溝、ｌｌｂは端面、ｌｌｄは平
行端面、２２はスタッド挿入溝、３１はリング状の導体
、３１ａ、３２ａはＲ部、３２は締付金具、１は端面深
さを示す。 （ロ） １１　　　　、 　ｆFigure 1 is a perspective view showing a power semiconductor element, and 49 in Figure 2.
Figure 0 is a top view showing a conventional connection mechanism, and a front view of the opening.
Figure 490 in Figure 3 is a perspective view showing an adapter that is an embodiment of the present invention, a front view showing the connection mechanism, and 490 in Figure 4.
FIG. 10 is a perspective view of a conductor according to another embodiment of the present invention and a front view showing a connection mechanism. In the figure, 1 is a power semiconductor element, 2 is a terminal, 3 is a stud, 4.21 is a heat sink, 5 is a through hole, 6 is a counterbore, 7 is a spring washer, 8 is a nut, 9, 10.23 are conductors , 11 is an adapter, lla, IIC are thread grooves, llb is an end face, lld is a parallel end face, 22 is a stud insertion groove, 31 is a ring-shaped conductor, 31a, 32a are R parts, 32 is a tightening metal fitting, 1 is an end face Indicates depth. (b) 11, f

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）電力用半導体素子の端子接続において、該半導体
素子の軸方向に平行せる端子取付面及び該軸の回転可能
な導体接続手段を有するアダプタを設け、該アダプタを
介して該導体に接続するようにしたことを特徴とする電
力用半導体素子の接続機構。(1) In the terminal connection of a power semiconductor element, an adapter having a terminal mounting surface parallel to the axial direction of the semiconductor element and a rotatable conductor connecting means for the axis is provided, and the adapter is connected to the conductor via the adapter. A connection mechanism for power semiconductor elements, characterized in that: （２）　　前記導体接続手段が該端子取付面と直交する
端面に形成されたねじ溝であることを特徴とする実用新
案登録請求の範囲第１項に記載の電力用半導体素子の接
続機構。(2) The power semiconductor device connection mechanism according to claim 1, wherein the conductor connection means is a screw groove formed on an end surface perpendicular to the terminal mounting surface. （３）　　前記導体接続手段が実質的に円周面であるこ
とを特徴とする実用新案登録請求の範囲第１項に記載の
電力用半導体素子の接続機構。(3) The power semiconductor device connection mechanism according to claim 1, wherein the conductor connection means is substantially a circumferential surface.
JP10265481U 1981-07-10 1981-07-10 Connection mechanism for power semiconductor devices Granted JPS588957U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10265481U JPS588957U (en) 1981-07-10 1981-07-10 Connection mechanism for power semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10265481U JPS588957U (en) 1981-07-10 1981-07-10 Connection mechanism for power semiconductor devices

Publications (2)

Publication Number Publication Date
JPS588957U true JPS588957U (en) 1983-01-20
JPS6240437Y2 JPS6240437Y2 (en) 1987-10-16

Family

ID=29897293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10265481U Granted JPS588957U (en) 1981-07-10 1981-07-10 Connection mechanism for power semiconductor devices

Country Status (1)

Country Link
JP (1) JPS588957U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6061562U (en) * 1983-10-03 1985-04-30 大豊工業株式会社 mechanical seal
JPS61101697U (en) * 1984-12-11 1986-06-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145770U (en) * 1976-04-27 1977-11-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145770U (en) * 1976-04-27 1977-11-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6061562U (en) * 1983-10-03 1985-04-30 大豊工業株式会社 mechanical seal
JPS61101697U (en) * 1984-12-11 1986-06-28

Also Published As

Publication number Publication date
JPS6240437Y2 (en) 1987-10-16

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