JPS6127246U - semiconductor element - Google Patents

semiconductor element

Info

Publication number
JPS6127246U
JPS6127246U JP11034484U JP11034484U JPS6127246U JP S6127246 U JPS6127246 U JP S6127246U JP 11034484 U JP11034484 U JP 11034484U JP 11034484 U JP11034484 U JP 11034484U JP S6127246 U JPS6127246 U JP S6127246U
Authority
JP
Japan
Prior art keywords
semiconductor element
recess
screw
diameter
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11034484U
Other languages
Japanese (ja)
Inventor
芳紀 高嶋
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP11034484U priority Critical patent/JPS6127246U/en
Publication of JPS6127246U publication Critical patent/JPS6127246U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例における半導体素子の取り付け状態の断
面図、第２図は従来例における半導体素子の取り付けを
タップビスで行った状態の断面図、第３図は本考案の一
実施例における半導体素子の取り付け状態の断面図であ
る。 １０・・・・・・半導体素子、１０ａ・川・一挿通孔、
１１・・・・・・タツプビス、１２・・・・・・取付板
、１４・・・・・・凹部。Fig. 1 is a sectional view of a conventional example in which a semiconductor element is attached, Fig. 2 is a sectional view of a conventional example in which a semiconductor element is attached with tap screws, and Fig. 3 is a semiconductor element in an embodiment of the present invention. FIG. 3 is a sectional view of the attached state. 10... Semiconductor element, 10a・river・1 insertion hole,
11...Tap screw, 12...Mounting plate, 14...Recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] タツプビスを挿通ずる孔を設け、取付板と接する面側の
上記孔の周囲に、上記タツプビス締め付け時のハリを逃
がすための凹部を、その径が上記タツプビスのビス頭の
直径以内となるように形成した半導体素子。A hole is provided through which the tap screw is inserted, and a recess is formed around the hole on the side that contacts the mounting plate to release the tension when tightening the tap screw, so that the diameter of the recess is within the diameter of the screw head of the tap screw. semiconductor device.
JP11034484U 1984-07-20 1984-07-20 semiconductor element Pending JPS6127246U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11034484U JPS6127246U (en) 1984-07-20 1984-07-20 semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11034484U JPS6127246U (en) 1984-07-20 1984-07-20 semiconductor element

Publications (1)

Publication Number Publication Date
JPS6127246U true JPS6127246U (en) 1986-02-18

Family

ID=30669471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11034484U Pending JPS6127246U (en) 1984-07-20 1984-07-20 semiconductor element

Country Status (1)

Country Link
JP (1) JPS6127246U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008093302A (en) * 2006-10-13 2008-04-24 Kyoraku Sangyo Kk Decoration component, game board unit and pachinko game machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008093302A (en) * 2006-10-13 2008-04-24 Kyoraku Sangyo Kk Decoration component, game board unit and pachinko game machine

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