JPS588944U - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPS588944U
JPS588944U JP10210681U JP10210681U JPS588944U JP S588944 U JPS588944 U JP S588944U JP 10210681 U JP10210681 U JP 10210681U JP 10210681 U JP10210681 U JP 10210681U JP S588944 U JPS588944 U JP S588944U
Authority
JP
Japan
Prior art keywords
wheel
pellet
semiconductor manufacturing
semiconductor
manufacturing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10210681U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317249Y2 (en:Method
Inventor
堀尾　金春
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP10210681U priority Critical patent/JPS588944U/ja
Publication of JPS588944U publication Critical patent/JPS588944U/ja
Application granted granted Critical
Publication of JPS6317249Y2 publication Critical patent/JPS6317249Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP10210681U 1981-07-08 1981-07-08 半導体製造装置 Granted JPS588944U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10210681U JPS588944U (ja) 1981-07-08 1981-07-08 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10210681U JPS588944U (ja) 1981-07-08 1981-07-08 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS588944U true JPS588944U (ja) 1983-01-20
JPS6317249Y2 JPS6317249Y2 (en:Method) 1988-05-16

Family

ID=29896758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10210681U Granted JPS588944U (ja) 1981-07-08 1981-07-08 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS588944U (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229826A (ja) * 1983-05-31 1984-12-24 Rohm Co Ltd リ−ドフレ−ムに対する半導体ペレツトの供給装置
JPS60213036A (ja) * 1984-04-09 1985-10-25 Shinkawa Ltd チツプボンデイング装置
JPS63158586U (en:Method) * 1987-04-06 1988-10-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229826A (ja) * 1983-05-31 1984-12-24 Rohm Co Ltd リ−ドフレ−ムに対する半導体ペレツトの供給装置
JPS60213036A (ja) * 1984-04-09 1985-10-25 Shinkawa Ltd チツプボンデイング装置
JPS63158586U (en:Method) * 1987-04-06 1988-10-18

Also Published As

Publication number Publication date
JPS6317249Y2 (en:Method) 1988-05-16

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