JPS588944U - semiconductor manufacturing equipment - Google Patents
semiconductor manufacturing equipmentInfo
- Publication number
- JPS588944U JPS588944U JP10210681U JP10210681U JPS588944U JP S588944 U JPS588944 U JP S588944U JP 10210681 U JP10210681 U JP 10210681U JP 10210681 U JP10210681 U JP 10210681U JP S588944 U JPS588944 U JP S588944U
- Authority
- JP
- Japan
- Prior art keywords
- wheel
- pellet
- semiconductor manufacturing
- semiconductor
- manufacturing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は一般的ベレットマウント装置の概略
側面図及び平面図、第３図は本考案の第１実施例を示す
一部断面概略側面図、第４図は第３図のホイールの斜視
図、第５図及び第６図は本考案の第２実施例を示す概略
側面図及びＩ−Ｉ線に沿う断面図、第７図は第５図の応
用例を説明するバッチ式ペレットマウント装置の概略斜
視図である。
１・・・・・−半導体ペレット、１１・・・・・・被ペ
レットマウント物、１３−−−−−−ホイール、１４．
１４’・・・・・・ペレット供給部、１５・・・・・・
凹溝。
０２
０３1 and 2 are a schematic side view and a plan view of a general bullet mount device, FIG. 3 is a partially cross-sectional schematic side view showing the first embodiment of the present invention, and FIG. 4 is a wheel shown in FIG. 3. 5 and 6 are a schematic side view and a sectional view taken along line I-I of the second embodiment of the present invention, and FIG. 7 is a batch-type pellet illustrating an example of application of FIG. 5. FIG. 2 is a schematic perspective view of a mounting device. 1... Semiconductor pellet, 11... Pellet mounting object, 13--- Wheel, 14.
14'... Pellet supply section, 15...
Concave groove. 02 03
Claims (1)
複数個有し、定位置で中心軸を中心に回転するホイール
と、ホイール上方からホイールの回転と同期して前記凹
溝に半導体ペレットを１個ずつ供給するペレット供給部
とを具備し、ホイール下方でホイールの回転と同期して
被ペレットマウント物を間歇送りすると共に、ホイール
下部の定ポジションで半導体ペレットをホイールから被
ペレットマウント物上に順次に供給してマウントするよ
うにしたことを特徴とする半導体製造装置。A wheel that has a plurality of grooves on its outer circumferential surface for appropriately positioning and adsorbing semiconductor pellets, and rotates around a central axis in a fixed position, and one semiconductor pellet is placed in the groove from above the wheel in synchronization with the rotation of the wheel. It is equipped with a pellet feeding section that feeds the pellet-mounted object intermittently below the wheel in synchronization with the rotation of the wheel, and sequentially feeds the semiconductor pellets from the wheel onto the pellet-mounted object at a fixed position below the wheel. A semiconductor manufacturing device characterized in that the semiconductor manufacturing device is supplied and mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210681U JPS588944U (en) | 1981-07-08 | 1981-07-08 | semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210681U JPS588944U (en) | 1981-07-08 | 1981-07-08 | semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS588944U true JPS588944U (en) | 1983-01-20 |
| JPS6317249Y2 JPS6317249Y2 (en) | 1988-05-16 |
Family
ID=29896758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10210681U Granted JPS588944U (en) | 1981-07-08 | 1981-07-08 | semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS588944U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59229826A (en) * | 1983-05-31 | 1984-12-24 | Rohm Co Ltd | Apparatus for supplying semiconductor pellet to lead frame |
| JPS60213036A (en) * | 1984-04-09 | 1985-10-25 | Shinkawa Ltd | Chip bonding device |
| JPS63158586U (en) * | 1987-04-06 | 1988-10-18 |
-
1981
- 1981-07-08 JP JP10210681U patent/JPS588944U/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59229826A (en) * | 1983-05-31 | 1984-12-24 | Rohm Co Ltd | Apparatus for supplying semiconductor pellet to lead frame |
| JPS60213036A (en) * | 1984-04-09 | 1985-10-25 | Shinkawa Ltd | Chip bonding device |
| JPS63158586U (en) * | 1987-04-06 | 1988-10-18 | ||
| JPH0444855Y2 (en) * | 1987-04-06 | 1992-10-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317249Y2 (en) | 1988-05-16 |
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