JPS5888845A - Production of coated information recording board - Google Patents
Production of coated information recording boardInfo
- Publication number
- JPS5888845A JPS5888845A JP18686881A JP18686881A JPS5888845A JP S5888845 A JPS5888845 A JP S5888845A JP 18686881 A JP18686881 A JP 18686881A JP 18686881 A JP18686881 A JP 18686881A JP S5888845 A JPS5888845 A JP S5888845A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- board
- recording
- conductor layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 7
- 239000004793 Polystyrene Substances 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 5
- 229920002223 polystyrene Polymers 0.000 abstract description 5
- 239000010408 film Substances 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 229920001342 Bakelite® Polymers 0.000 abstract description 2
- 239000004637 bakelite Substances 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000004299 exfoliation Methods 0.000 abstract 1
- 230000000379 polymerizing effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 13
- 239000003989 dielectric material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- UKUVVAMSXXBMRX-UHFFFAOYSA-N 2,4,5-trithia-1,3-diarsabicyclo[1.1.1]pentane Chemical compound S1[As]2S[As]1S2 UKUVVAMSXXBMRX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 102200006424 rs104894097 Human genes 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0057—Intermediate mediums, i.e. mediums provided with an information structure not specific to the method of reproducing or duplication such as matrixes for mechanical pressing of an information structure ; record carriers having a relief information structure provided with or included in layers not specific for a single reproducing method; apparatus or processes specially adapted for their manufacture
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
■発明の属する技術分野
本褪−は、ビデオ、オーディオ等の信号が記録され九被
覆!10容量変換璽情報記鎌盤の製造方法に関す為。DETAILED DESCRIPTION OF THE INVENTION ■Technical field to which the invention pertains This recording covers nine areas where signals such as video and audio are recorded! 10 Regarding the manufacturing method of the capacity conversion seal information recorder.
■従来接衝
ll!東、被覆IIO容量変換蓋情報記鍮記録製造すゐ
場合%オず表11mK凹凸春状で情報が配録された鎗を
用意し、この盤をもとにして第1の原盤であるマスタを
得、このマスタをもとに第2の原盤であるマザーを得、
このマザーをもとに第3の原盤のスタンパを得る。そし
て、このスタンパにょっ記録盤を製造していた。■Conventional contact! East, coated IIO capacitance conversion lid information record Brass record manufacturing case % OZ table 11 mK uneven spring shape with information recorded on it, prepare a spear, and based on this disk, create the first master disk. Based on this master, we obtained the second master, Mother.
A third master stamper is obtained based on this mother. And they were manufacturing this stamper recorder.
tトレジスト(2)をスピンコートシ、記録すべき情m
tv−ザービーム(よ抄7#)レジス)+2)上に刻ん
でいく、その緒果、フォトレジスト(2)は、レーザー
ビーム(よ抄露光され九部分とそうでない部分(分けら
れ、情報汐1凹凸形(3)で記録される。Spin coat the resist (2) and record the details.
The result, the photoresist (2), is carved on the laser beam (Yosho 7# Regis) + 2), and the photoresist (2) is divided into 9 parts exposed to the laser beam (Yosho 7#) and the non-exposed parts (divided, Information Shio 1 It is recorded in a concave and convex shape (3).
(第1図(a))
次に、ガラス基盤(1)ならびにフォトレジスト(2)
上に鎖をi元析出させて、鋼薄@(4)を形成する゛。(Figure 1(a)) Next, the glass substrate (1) and the photoresist (2)
A steel thin @(4) is formed by precipitating i elements of chains on top.
こうしてガラス基盤(1)上に導電性をも九せ、ニッケ
ルを所定の厚さメッキして、金属層(5)を形成する。In this way, conductivity is increased on the glass substrate (1), and nickel is plated to a predetermined thickness to form a metal layer (5).
(第1図(bン)
ガラス基盤(1)よシ金属1t5)を剥鳴する。剥離は
。(Figure 1 (b) Glass substrate (1) and metal 1t5) are peeled off. Peeling is.
銀薄膜(4)と7オトレジスト(2)ならびにガラス基
盤(1)との境界面で行われる。その結果、凹凸形(3
)が転写された凸凹形(6)を有するマスク(7)を得
る。This is done at the interface between the silver thin film (4) and the 7-photoresist (2) as well as the glass substrate (1). As a result, the uneven shape (3
) is transferred to obtain a mask (7) having an uneven shape (6).
妻噛比士金属喝(8)を形成する。この金属1g +8
)は、ニッケルを所定の厚さ電気メ、ツキして形成する
。Form the Tsumamihishi metal racket (8). 1g of this metal +8
) is formed by electroplating nickel to a predetermined thickness.
(第1図cd))
金属11 +8)をマスク(7)よ抄剥離する。剥離す
るこ、と(よ#)、金属111(8)の表面には、最初
にガラス基盤(1)上に設けられた凹凸形(3)と同様
の凹凸形(9)が再現される。ここまでの工程によシ、
第2の原盤であるマザー員を得ることができる。(第1
図(e))マザーα〔の表面を酸化し、剥離促進処理を
施す。(Figure 1c)) Peel off the metal 11+8) using the mask (7). When the metal 111 (8) is peeled off, the surface of the metal 111 (8) reproduces an uneven pattern (9) similar to the uneven pattern (3) initially provided on the glass substrate (1). Due to the process up to this point,
You can obtain the second master, the mother member. (1st
Figure (e)) The surface of mother α is oxidized to promote peeling.
その後、金属層aυを電気メッキする。金属11口υと
しては今重でと同じく例えばニッケルが用いられる。(
第1図(f))
金属11Qυをマザー傾より剥離し、凹凸形(9)が転
写され九表面にクロムメッキを施し、表面金属1働を形
成する。こうして、凸凹形Iを有するスタスタンパ04
を得た後は、このスタンノ((14を用いて、記録盤0
9を熱圧縮成型する。記録盤a9の材料としては、通常
のレコード盤と同じく、塩化ビニール系の樹脂等が用い
ら、れる、この記録盤09は、スタンパti4)の凸凹
形(I湯に対応すゐ、凹凸形αeが形成される。(第1
図(h))
記録盤a!9の表面には、導電体1111f9が形成さ
れる。Thereafter, a metal layer aυ is electroplated. For example, nickel is used as the metal 11 holes υ, as in the case of Imajyu. (
(FIG. 1(f)) The metal 11Qυ is peeled off from the mother plate, the concavo-convex pattern (9) is transferred, and chrome plating is applied to the nine surfaces to form a surface metal layer. In this way, the star stamper 04 having the uneven shape I
After obtaining this Stanno ((14), record board 0
9 is heat compression molded. As for the material of record board a9, vinyl chloride resin etc. are used like normal records. is formed (first
Figure (h)) Record board a! A conductor 1111f9 is formed on the surface of 9.
導電体111(I・は、例えばアルミニウムを蒸着、ス
ノくツタリング等の手段により役ける。(第1図(I)
)導電体−αlを形成後、引き続きその表面に誘電体4
tlnを形成する。誘電体−qηとしては、例えばポリ
スチレンが選ばれる。以上の工程により情報が凹凸形U
として刻まれた被覆型の容量変換型情報記録盤(I嘩が
製造される。(第11図(j))■従来技術の欠点
上述してきたように、従来の被覆型の容量変換櫃情報記
録盤の製造方法は、工程が多く、複雑で69、転写回数
が多い、その九め、記録盤OIに刻まれている凹凸形a
陽とガラス基盤(1)上に設けられる凹凸形(3)とは
、真に同一なものとは言えず、紀1Ikq#性の低下を
招いていた。したがって、配録特性を一定の水準に保持
しておくため、転写回数の少ない簡便な製造方法が望ま
れていえ。The conductor 111 (I) is formed by, for example, vapor-depositing aluminum, slatting, etc. (Fig. 1 (I)
) After forming the conductor -αl, a dielectric 4 is subsequently formed on its surface.
form tln. For example, polystyrene is selected as the dielectric material -qη. Through the above process, the information becomes uneven U
A covered type capacitance converting type information recording disk (I) is manufactured. (Fig. 11 (j)) ■Disadvantages of the conventional technology As mentioned above, the conventional covered type capacitance converting type information recording disk (I) is manufactured. The manufacturing method for discs is complex with many steps, and the number of transfers is large.
The surface and the concave-convex shape (3) provided on the glass base (1) cannot be said to be truly the same, leading to a decrease in the quality. Therefore, in order to maintain the recording characteristics at a certain level, a simple manufacturing method that requires fewer transfers is desired.
■発明の目的
本発明の目的は、転写回数を抑えた簡便な被覆型の容量
変換型情報記母盤の製造方法を提供することKある。(1) Purpose of the Invention An object of the present invention is to provide a simple method for manufacturing a capacitance conversion type information recording motherboard of a covered type that suppresses the number of transfers.
■発明の構成
上記の目的を達成するため1本発明では従来の製造方法
と同様にして例えばニッケルを用いてマスタを作成し、
凹凸形が転写されているマスクの表面にニッケル等の金
属層を形成する。そして。■Structure of the Invention In order to achieve the above-mentioned objects, in the present invention, a master is created using, for example, nickel in the same manner as the conventional manufacturing method,
A metal layer such as nickel is formed on the surface of the mask onto which the uneven pattern has been transferred. and.
この金属層をマスクより剥離し、会g−自身を導電体層
として、他の基盤に接着するのである。以後、導電体層
の表面に誘電体層を形成し、記録盤を完成する。This metal layer is peeled off from the mask and bonded to another substrate using the metal layer itself as a conductive layer. Thereafter, a dielectric layer is formed on the surface of the conductive layer to complete the recording disc.
■実施例
以下、第2図を用いて、本発明の製造方法を詳細に説明
する。なお、第2図(a) 、 (bl 、 (C)は
、第113ili(1) 、 (b) a (C)を再
掲したものである。同一部分には同一番号を付してあ炒
、第2図fa) 、 fb) 、 (C)の説明は省略
する。①Example The manufacturing method of the present invention will be explained in detail below with reference to FIG. In addition, Figure 2 (a), (bl, and (C)) are reprints of No. 113ili (1), (b) a (C). Identical parts are given the same numbers and are referred to as Explanation of FIG. 2 fa), fb), and (C) will be omitted.
従来と同様の方法で、マスク(7)を得九後(第1図(
c) ) 、凸凹形(6)が設けられている表面に剥離
促進処理を施す。剥離促進処理は、マスj(7)の表面
を重クロム酸カリウム溶液(5重1its)に浸して行
われる。剥離促進処理の後に、ニッケルメッキが行われ
る。ニッケルメッキは、ワット浴(硫酸巨ツケル3zo
g/l−塩化ニッケル45 g/l 、硼酸40g/j
)中にマスク(7)の表面を一浸漬し、9H4,0温度
52°C1電王9■、電流密If4.3A/atの条件
の下で行われる。111%ニッケルメッキの結果、厚さ
0.3111mのニッケル![(7)が形成される。(
第1図(d))次に、ニッケルVs(イ)をマスク(7
)の表面上に剥離する。剥離され九ニッケル模(2)は
、マスク(7)の^凹杉(6)が転写され、表面に凹凸
形(21)が形成される。After obtaining the mask (7) in the same manner as before (Fig. 1 (
c)) A peel-promoting treatment is applied to the surface on which the irregularities (6) are provided. The peeling promotion treatment is performed by immersing the surface of mass j (7) in a potassium dichromate solution (5 times 1 it). Nickel plating is performed after the peel promotion treatment. Nickel plating is done in a Watts bath (sulfuric acid)
g/l - Nickel chloride 45 g/l, boric acid 40 g/j
) The surface of the mask (7) is immersed in 9H4.0 temperature 52°C1 Deno 9■ and current density If4.3A/at. The result of 111% nickel plating is 0.3111m thick nickel! [(7) is formed. (
Figure 1 (d)) Next, apply nickel Vs (a) to the mask (7).
) peels off on the surface. The peeled nine nickel pattern (2) has the concave cedar (6) of the mask (7) transferred thereto, and a concavo-convex shape (21) is formed on the surface.
剥離を終えた後に、裏面四の研磨を行う、研磨は例えば
1000番のサンドベーパを用い、裏面が平滑になるよ
うに行う。研磨することによ抄、均二な厚さのニッケル
膜を得、これを導電体1(至)とする、(第1図(句)
引き続いて、上記の工程で得られた導電体4(至)を、
記録基盤(財)に接着する。記録基盤@としては、例え
ばベークライト板が用いられる。導電体11(至)の接
着方法は、例えば記録基盤r24Q表面に、嫌気性の紫
外線硬化型接着剤(至)をスピンコードし、導−電体層
(至)を接着する。接着(際しては、導電体1崗と記録
基盤[有]間に気泡が入らないように注意する。接着し
、紫外線を照射することによ染、接着剤(至)は固化し
、導電体層(至)と記録基盤I24とけ一体となる。(
第1図げ))
最後の工程は、誘電体PII(至)を形成することであ
る。導電体M(至)上に誘電体層(至)を形成する一例
としては、グッズマ重合によるものが考えられる。After completing the peeling, the back surface 4 is polished using, for example, a No. 1000 sand vapor to make the back surface smooth. By polishing, a nickel film with a uniform thickness is obtained, and this is used as conductor 1 (Fig. 1). to),
Glue to the record base (goods). For example, a Bakelite plate is used as the recording substrate. The method of adhering the conductor 11 is, for example, by spin-coding an anaerobic ultraviolet curable adhesive onto the surface of the recording substrate R24Q and adhering the conductor layer. Adhesion (When adhering, be careful not to introduce air bubbles between the conductive material and the recording substrate.) After adhesion and irradiation with ultraviolet rays, the adhesive solidifies and becomes conductive. The body layer (to) and the recording base I24 become one. (
The last step is to form the dielectric PII. As an example of forming the dielectric layer on the conductor M, it is possible to use good polymerization.
誘電体としてはポリスチレンが選ばれ、プラスマ重゛合
(よp導電体#10表面上に誘電体4(至)としてポリ
スチレン被覆を形成する。誘電体111(至)の厚さは
5OOXK設定される0以上の工程を通じ、被覆IIO
容量変換薯情報紀銀盤(財)が得られる。(第1図(g
))な訃、記録盤(5)を完成する丸めには、後加工と
して中心穴を偏心が生じないように打ち抜くことが行わ
れ、記録盤((5)の全体の形状は、外径260φ打ち
抜かれた中心穴の大きさが38φ、厚さが2.1謡とな
る。Polystyrene is selected as the dielectric material, and a polystyrene coating is formed on the surface of the p conductor #10 as the dielectric material 4. The thickness of the dielectric material 111 is set to 5OOXK. Through 0 or more steps, coating IIO
Capacity conversion information Kiginban (goods) can be obtained. (Figure 1 (g
)) To complete the recording disc (5), a center hole is punched out as a post-process to prevent eccentricity, and the overall shape of the recording disc (5) has an outer diameter of 260φ. The size of the punched center hole is 38φ and the thickness is 2.1 mm.
■発明の効果
ここで、本発明の製造方法によって成形された記録盤と
従来の製造方法により得られる記録盤との性能比較を行
うこと(よ抄、本発明の効果を明らかにする。■Effects of the Invention Here, we will compare the performance of a recording disk molded by the manufacturing method of the present invention and a recording disk obtained by a conventional manufacturing method (Yosho, the effects of the present invention will be clarified).
従来の記録盤の、熱圧縮成形される基体(記録盤119
) Kは、塩ビ酢ピコ−ポリマーを用い丸、また、導
電体11111は、アルミニウムをスパッタリング(よ
!5500にの厚さで形成した。さらに誘電体層1ηは
1本発明の記録盤(5)と同様に5ooAの厚さでポリ
スチレンで形成した。The base body of a conventional record disc (record disc 119) which is molded by heat compression
) K is a circle using PVC vinegar pico-polymer, and the conductor 11111 is formed by sputtering aluminum (with a thickness of 5,500 mm).Furthermore, the dielectric layer 1η is 1 recording disk of the present invention (5) It was made of polystyrene with a thickness of 5ooA in the same manner as above.
従来の導電体1α・はアルミニウムであり、本発明の導
電体)1+21はニッケルであるが1両者は導電−性〈
殆んど差異がなく、性能を比較する(おいては問題はな
い。The conventional conductor 1α is aluminum, and the conductor of the present invention) 1+21 is nickel.
There is almost no difference, and there is no problem when comparing the performance.
従来および本発明の製造方法(よ抄得られた被覆型記録
盤の双方を再生機にかけ、得られたCN比(搬送波とノ
イズとの比)および出力を下表に示す。Both the coated recording disks obtained by the conventional manufacturing method and the present invention were subjected to a reproducing machine, and the obtained CN ratio (ratio of carrier wave to noise) and output are shown in the table below.
表よ抄明らかな如く1本発明による記録盤け、情報再生
性能を示すCN比、出力ともに従来のものに比べ優れて
いる。これは、従来の製造方法にKt!鎌盤(再現する
ことができ九ためである。As is clear from the table, the recording disk according to the present invention is superior to the conventional one in terms of both the CN ratio and the output, which indicate the information reproduction performance. This is Kt! compared to the conventional manufacturing method. Sickle board (9 pieces that can be reproduced).
以上述べてきたように、本発明の製造方法は、従来に比
較し工程が簡略化されてお抄、かつ再生性能の優れ九被
覆型記録盤を提供することができる。As described above, the manufacturing method of the present invention can provide a nine-cover type recording disk with simplified steps and excellent playback performance compared to the conventional method.
第1図は従来の、ま良路2図は本発明の被覆型情報記録
盤の1製造方法を示す工程図である。
16)・・・凸凹形、(7)・・・マスク、■・・・4
g体11%@・・・記録基盤、弼・・・誘電体+4.・
潤・・・情報記録盤。FIG. 1 is a process diagram showing a conventional manufacturing method, and FIG. 2 is a process diagram showing a manufacturing method of a covered information recording disc of the present invention. 16)...Uneven shape, (7)...Mask, ■...4
g body 11%@...recording base, ^...dielectric +4.・
Jun... Information record board.
Claims (1)
凸を転写する導電体層を形成する工程と。 前記導電体層を原盤より#離する工程と、#記剥噛され
良導電体層を紀碌基盤上に接着する工程と。 前記記最基盤上Km着された導電体層の表11KII電
体層を形成する工程とを具備する被覆型の情報記銀盤の
製、遣方法。[Scope of Claims] A step of forming a conductive layer that transfers the unevenness onto the surface of a master disc on which information is recorded in the form of unevenness. A step of separating the conductive layer from the master; and a step of adhering the peeled good conductive layer onto the solid base. A method for producing and using a coated information disc, comprising the step of forming a conductor layer Km of the conductor layer deposited on the uppermost substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18686881A JPS5888845A (en) | 1981-11-24 | 1981-11-24 | Production of coated information recording board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18686881A JPS5888845A (en) | 1981-11-24 | 1981-11-24 | Production of coated information recording board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5888845A true JPS5888845A (en) | 1983-05-27 |
Family
ID=16196072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18686881A Pending JPS5888845A (en) | 1981-11-24 | 1981-11-24 | Production of coated information recording board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5888845A (en) |
-
1981
- 1981-11-24 JP JP18686881A patent/JPS5888845A/en active Pending
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