JPS5887959A - 給電ブリツジの形成方法 - Google Patents

給電ブリツジの形成方法

Info

Publication number
JPS5887959A
JPS5887959A JP18809482A JP18809482A JPS5887959A JP S5887959 A JPS5887959 A JP S5887959A JP 18809482 A JP18809482 A JP 18809482A JP 18809482 A JP18809482 A JP 18809482A JP S5887959 A JPS5887959 A JP S5887959A
Authority
JP
Japan
Prior art keywords
insulating support
resistors
power supply
forming
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18809482A
Other languages
English (en)
Japanese (ja)
Inventor
アライン・フオレステイ−ア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telecommunications Radioelectriques et Telephoniques SA TRT
Original Assignee
Telecommunications Radioelectriques et Telephoniques SA TRT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telecommunications Radioelectriques et Telephoniques SA TRT filed Critical Telecommunications Radioelectriques et Telephoniques SA TRT
Publication of JPS5887959A publication Critical patent/JPS5887959A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermistors And Varistors (AREA)
  • Devices For Supply Of Signal Current (AREA)
JP18809482A 1981-10-28 1982-10-26 給電ブリツジの形成方法 Pending JPS5887959A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8120239 1981-10-28
FR8120239A FR2515445A1 (fr) 1981-10-28 1981-10-28 Procede de realisation d'un pont d'alimentation soumis a des surcharges importantes et pont d'alimentation realise suivant ce procede

Publications (1)

Publication Number Publication Date
JPS5887959A true JPS5887959A (ja) 1983-05-25

Family

ID=9263487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18809482A Pending JPS5887959A (ja) 1981-10-28 1982-10-26 給電ブリツジの形成方法

Country Status (5)

Country Link
EP (1) EP0078089B1 (Direct)
JP (1) JPS5887959A (Direct)
CA (1) CA1193756A (Direct)
DE (1) DE3269092D1 (Direct)
FR (1) FR2515445A1 (Direct)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2557732B1 (fr) * 1983-12-28 1986-04-11 Lefevre Rene Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede
JPH0311789A (ja) * 1989-06-09 1991-01-21 Toshiba Lighting & Technol Corp 厚膜混成回路基板とその製造方法
DE9115786U1 (de) * 1991-12-19 1992-02-27 Murata Europe Management GmbH, 8500 Nürnberg Trimmbarer, hochenergiefester Widerstand in Dickschichttechnik
JPH08241802A (ja) 1995-03-03 1996-09-17 Murata Mfg Co Ltd サーミスタ装置及びその製造方法
DE102018115205A1 (de) 2018-06-25 2020-01-02 Vishay Electronic Gmbh Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336662A (en) * 1976-09-17 1978-04-05 Hitachi Ltd Bridge sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036686C2 (de) * 1980-09-29 1983-12-01 Siemens AG, 1000 Berlin und 8000 München Teilnehmeranschlußschaltung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336662A (en) * 1976-09-17 1978-04-05 Hitachi Ltd Bridge sensor

Also Published As

Publication number Publication date
DE3269092D1 (en) 1986-03-27
FR2515445A1 (fr) 1983-04-29
FR2515445B1 (Direct) 1984-12-28
EP0078089A1 (fr) 1983-05-04
CA1193756A (en) 1985-09-17
EP0078089B1 (fr) 1986-02-12

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