JPS5887337U - 半導体樹脂封入成形用金型装置 - Google Patents

半導体樹脂封入成形用金型装置

Info

Publication number
JPS5887337U
JPS5887337U JP10187282U JP10187282U JPS5887337U JP S5887337 U JPS5887337 U JP S5887337U JP 10187282 U JP10187282 U JP 10187282U JP 10187282 U JP10187282 U JP 10187282U JP S5887337 U JPS5887337 U JP S5887337U
Authority
JP
Japan
Prior art keywords
mold
resin encapsulation
plungers
resin material
semiconductor resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10187282U
Other languages
English (en)
Japanese (ja)
Other versions
JPS635227Y2 (h
Inventor
坂東　一雄
Original Assignee
有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 有限会社ティ・アンド・ケイ・インターナショナル研究所 filed Critical 有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority to JP10187282U priority Critical patent/JPS5887337U/ja
Publication of JPS5887337U publication Critical patent/JPS5887337U/ja
Application granted granted Critical
Publication of JPS635227Y2 publication Critical patent/JPS635227Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10187282U 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置 Granted JPS5887337U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10187282U JPS5887337U (ja) 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10187282U JPS5887337U (ja) 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置

Publications (2)

Publication Number Publication Date
JPS5887337U true JPS5887337U (ja) 1983-06-14
JPS635227Y2 JPS635227Y2 (h) 1988-02-12

Family

ID=29896530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10187282U Granted JPS5887337U (ja) 1982-07-05 1982-07-05 半導体樹脂封入成形用金型装置

Country Status (1)

Country Link
JP (1) JPS5887337U (h)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5630841A (en) * 1979-08-24 1981-03-28 Towa Seimitsu Kogyo Kk Plastic molding method and metallic mold therefor
JPS57123222U (h) * 1981-01-26 1982-07-31

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5630841A (en) * 1979-08-24 1981-03-28 Towa Seimitsu Kogyo Kk Plastic molding method and metallic mold therefor
JPS57123222U (h) * 1981-01-26 1982-07-31

Also Published As

Publication number Publication date
JPS635227Y2 (h) 1988-02-12

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