JPS588159B2 - Method for manufacturing multilayer printed wiring board - Google Patents
Method for manufacturing multilayer printed wiring boardInfo
- Publication number
- JPS588159B2 JPS588159B2 JP9385478A JP9385478A JPS588159B2 JP S588159 B2 JPS588159 B2 JP S588159B2 JP 9385478 A JP9385478 A JP 9385478A JP 9385478 A JP9385478 A JP 9385478A JP S588159 B2 JPS588159 B2 JP S588159B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- multilayer printed
- wiring board
- conductive path
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Organic Insulating Materials (AREA)
Description
【発明の詳細な説明】 本発明は、多層印刷配線板の製造方法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing a multilayer printed wiring board.
従来、多層印刷配線板の製造においては、絶縁基板上に
プリントされた所望の銅箔回路のパターン上に、絶縁性
樹脂塗料を印刷することにより絶縁層を形成し、この絶
縁層上に銀導体などで回路を印刷形成し多層化する方法
が用いられている。Conventionally, in the production of multilayer printed wiring boards, an insulating layer is formed by printing an insulating resin paint on a desired copper foil circuit pattern printed on an insulating substrate, and a silver conductor is placed on this insulating layer. Methods such as printing and forming circuits in multiple layers are used.
この際、上記絶縁性樹脂塗料として、メラニンーエポキ
シ系樹脂などの溶剤型塗料を用いたものは加熱硬化の際
溶剤が蒸発するので絶縁層にピンホールを生じやすく、
これがこの絶縁層の上下の導体の短絡を招く原因となり
、製品の信頼性を著しく低下させてしまう。At this time, when a solvent-based paint such as melanin-epoxy resin is used as the above-mentioned insulating resin paint, pinholes are likely to occur in the insulating layer because the solvent evaporates during heating and curing.
This causes a short circuit between the conductors above and below the insulating layer, significantly reducing the reliability of the product.
そのため、上記絶縁性樹脂料に溶剤を除去した無溶剤型
塗料としてポリブタジュン系塗料を用いたものがあるが
、耐熱性に欠点がある。For this reason, there are some solvent-free paints that are made by removing the solvent from the above-mentioned insulating resin material and use polybutadune paints, but they have a drawback in heat resistance.
そこで、耐熱性、可撓性および電気的特性などの高度の
要求を満たす絶縁層を形成する為に、無溶剤型エポキシ
樹脂が一般的に用いられている。Therefore, solvent-free epoxy resins are generally used to form insulating layers that meet high requirements such as heat resistance, flexibility, and electrical properties.
しかし、無溶剤型エポキシ樹脂の硬化方法として、硬化
剤に一級アミン、二級アミンを用いると遊離した活性水
素の悪影響により銀導体の抵抗値を著しく変化させるこ
とがあり好ましくなく、かつ、塗料粘度の経時変化が大
きく作業上も好ましくない。However, when using a primary amine or secondary amine as a curing agent for a solvent-free epoxy resin curing method, the resistance value of the silver conductor changes significantly due to the adverse effects of liberated active hydrogen, which is undesirable. The change over time is large, making it unfavorable for work.
また、他の硬化方法として硬化剤に有機酸を用いると塗
膜レベリングの状態、電気的特性および可撓性にすぐれ
ているが硬化時間を長く要し工数を必要とするなどの欠
点がある。Further, as another curing method, using an organic acid as a curing agent provides excellent coating film leveling, electrical properties, and flexibility, but has drawbacks such as requiring a long curing time and man-hours.
本発明は、絶縁基板上に重層形成される導電路間の絶縁
層をエポキシ樹脂一有機酸一三級アミン系の絶縁材料を
用いることにより、信頼性の高い多層印刷配線板の製造
方法を提供するものである。The present invention provides a method for manufacturing a highly reliable multilayer printed wiring board by using an insulating material of epoxy resin, organic acid, and tertiary amine as an insulating layer between conductive paths formed in layers on an insulating substrate. It is something to do.
次に、本発明の一実施例を図面に基き説明する。Next, one embodiment of the present invention will be described based on the drawings.
１は絶縁基板であり、この絶縁基板１の上には第１図お
よび第２図の如く第１の電極２を起点として第１の導電
路３が形成され、第２の電極４を起点として第２の導電
路５が形成され、この第１の導電路３をはさんでその両
側に第３の電極６および第４の電極７が形成されている
。1 is an insulating substrate, and on this insulating substrate 1, as shown in FIGS. 1 and 2, a first conductive path 3 is formed starting from a first electrode 2, and a first conducting path 3 starting from a second electrode 4. A second conductive path 5 is formed, and a third electrode 6 and a fourth electrode 7 are formed on both sides of the first conductive path 3.
上記導電路および電極は、銅張積層板のエッチングまた
は、化学メッキなどの任意の方法で形成することができ
る。The conductive paths and electrodes can be formed by any method such as etching a copper-clad laminate or chemical plating.
第１の導電路３の上面の後述するジャンパ回路と交差す
る位置には、エポキシ樹脂−有機酸一三級アミン系の絶
縁塗料を印刷することにより絶縁層８を重層し形成する
この際硬化剤として用いられる有機酸としては、例えば
、無水フクル酸、ヘキサヒドロ無水フタル酸、テトラヒ
ドロ無水フタル酸、無水メチルナジツク酸、ドヂシニル
無水コハク酸などがあり、硬化剤として用いられる三級
アミンとしては、例えば、トリ・２，４，６ジメチルア
ミノメチルフェノール、ベンジルジメチルアミン、トリ
エタノールアミン、イミダゾール塩ながある。An insulating layer 8 is formed by printing an epoxy resin-organic acid monotertiary amine-based insulating paint at a position where the upper surface of the first conductive path 3 intersects with a jumper circuit to be described later. Examples of organic acids used as curing agents include fucuric anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, and dodicinylsuccinic anhydride. Tertiary amines used as curing agents include, for example,・Contains 2,4,6 dimethylaminomethylphenol, benzyldimethylamine, triethanolamine, and imidazole salts.
そして、このようなものにおいて、有機酸としてヘキサ
ヒドロ無水フクル酸を１００重量部および三級アミンと
してトリ・２，４，６ジメチルアミノメチルフェノール
を２重量部用いたものがエポキシ樹脂用の硬化剤として
は最適な効果を有する。In such products, 100 parts by weight of hexahydrofucric anhydride as an organic acid and 2 parts by weight of tri-2,4,6 dimethylaminomethylphenol as a tertiary amine are used as curing agents for epoxy resins. has optimal effect.
また、エポキシ樹脂−有機酸−三級アミンの配合は、エ
ポキシ基１当量に対し有機酸は０．５〜２．０当量の範
囲で可能であるとともに有機酸１００重量部に対して三
級アミンは０５〜３．０重量部の範囲で可能である。In addition, in the epoxy resin-organic acid-tertiary amine formulation, the organic acid can be used in a range of 0.5 to 2.0 equivalents per equivalent of the epoxy group, and the tertiary amine can be used per 100 parts by weight of the organic acid. can range from 0.5 to 3.0 parts by weight.
そして、本実施例においては、エポキシ樹脂としてエピ
コート８２８を６０重量部およびエピコート８７１を４
０重量部、有機酸としてヘキサヒドロ無水フタル酸を５
９重量部、三級アミンとしてトリ・２，４，６ジメチル
アミノメチルフェノールを１重量部、シリカ粉を１００
重量部配合したものが最適なものとして絶縁層８を形成
する絶縁塗料に使用される。In this example, 60 parts by weight of Epicoat 828 and 4 parts by weight of Epicoat 871 were used as epoxy resins.
0 parts by weight, 5 parts of hexahydrophthalic anhydride as organic acid
9 parts by weight, 1 part by weight of tri-2,4,6 dimethylaminomethylphenol as a tertiary amine, 100 parts by weight of silica powder.
A mixture of parts by weight is optimally used in the insulating paint forming the insulating layer 8.
ここにおいて、上記絶縁塗料にはその硬化剤として三級
アミンが添加されている為、絶縁層８は印刷後短時間で
硬化する。Here, since a tertiary amine is added to the insulating coating as a curing agent, the insulating layer 8 is cured in a short time after printing.
そして、この絶縁層８の上面を通して第３の電極６およ
び第４の電極７を結ぶ導電路としてのジャンパ回路９を
第３図および第４図の如く銀導体により形成する。A jumper circuit 9 as a conductive path connecting the third electrode 6 and the fourth electrode 7 through the upper surface of the insulating layer 8 is formed of a silver conductor as shown in FIGS. 3 and 4.
このジャンパ回路９は、銀ペーストを所定配線位置にス
クリーン印刷した後、１５０℃で一時間硬化させること
により形成する。This jumper circuit 9 is formed by screen printing silver paste on predetermined wiring positions and then curing it at 150° C. for one hour.
このとき、第１の導電路３と上記ジャンパ回路９とを絶
縁する絶縁層８は、エポキシ樹脂を用いている為、耐熱
性、可撓性および、電気的特性にすぐれたものとなる。At this time, since the insulating layer 8 that insulates the first conductive path 3 and the jumper circuit 9 is made of epoxy resin, it has excellent heat resistance, flexibility, and electrical characteristics.
そして、最後にジャンパ回路９などの絶縁基板１上に形
成された回路の保護用として、第５図および第６図に示
す如く、回路の端子電極、例えば第１の電極ないし第４
の電極２，４，６，７を除いた絶縁基板１の上面全部に
絶縁性のオーバコート１０を施す。Finally, as shown in FIGS. 5 and 6, terminal electrodes of the circuit, such as the first to fourth electrodes, are used to protect circuits formed on the insulating substrate 1 such as the jumper circuit 9.
An insulating overcoat 10 is applied to the entire upper surface of the insulating substrate 1 except for the electrodes 2, 4, 6, and 7.
本発明によれば、絶縁基板上に形成された導電路の上面
に絶縁層と導電路を順次に重層形成する多層印刷配線板
の製造方法において、上記絶縁層を溶剤を含まない無溶
剤型のエポキシ樹脂−有機酸一三級アミン系の絶縁材料
により形成する為、加熱しても溶剤の蒸発がなく、更に
は塗料のレベリング性が優れているので平滑となり、こ
の絶縁層にピンホールを生ずることなく、耐熱性、可撓
性および電気的特性にすぐれたものとなるとともに、上
記三級アミンには活性水素を含まない為上記導電路を形
成する銀導体に悪影響を与えることなく、信頼性の高い
多層印刷配線板を提供するものである。According to the present invention, in a method for manufacturing a multilayer printed wiring board in which an insulating layer and a conductive path are sequentially layered on the upper surface of a conductive path formed on an insulating substrate, the insulating layer is formed using a solvent-free type that does not contain a solvent. Epoxy resin - Because it is formed from an organic acid monotertiary amine insulating material, the solvent does not evaporate even when heated, and the paint has excellent leveling properties, making it smooth and causing pinholes in this insulating layer. In addition, the tertiary amine does not contain active hydrogen, so it does not adversely affect the silver conductor that forms the conductive path, improving reliability. The present invention provides a multilayer printed wiring board with high performance.
第１図ないし第６図は、本発明の一実施例を示す多層印
刷配線板の製造方法の説明図であり、第１図は第１の工
程を示す説明図、第２図は第１図■一■断面図、第３図
は第２の工程を示す説明図、第４図は第３図■−■断面
図、第５図は最終工程を示す説明図、第６図は第５図■
一■断面図である。
１・・・・・・絶縁基板、３・・・・・・導電路として
の第１の導電路、５・・・・・・導電路としての第２の
導電路、８・・・・・・絶縁層、９・・・・・・導電路
としてのジャンパ回路。1 to 6 are explanatory diagrams of a method for manufacturing a multilayer printed wiring board showing one embodiment of the present invention, FIG. 1 is an explanatory diagram showing the first step, and FIG. 2 is an explanatory diagram showing the first step. ■1■ cross-sectional view, Figure 3 is an explanatory diagram showing the second process, Figure 4 is a cross-sectional view of Figure 3--■, Figure 5 is an explanatory diagram showing the final process, and Figure 6 is Figure 5. ■
It is a cross-sectional view. DESCRIPTION OF SYMBOLS 1...Insulated substrate, 3...First conductive path as a conductive path, 5...Second conductive path as a conductive path, 8... - Insulating layer, 9...Jumper circuit as a conductive path.
Claims (1)
電路を順次重層し形成する多層印刷配線板の製造方法に
おいて、上記絶縁層をエポキシ樹脂−有機酸一三級アミ
ン系の絶縁材料により形成することを特徴とする多層印
刷配線板の製造方法。1. In a method for manufacturing a multilayer printed wiring board in which an insulating layer and a conductive path are sequentially layered on the upper surface of a conductive path formed on an insulating substrate, the insulating layer is formed of an epoxy resin-organic acid monotertiary amine-based insulating material. A method for manufacturing a multilayer printed wiring board, characterized in that it is formed by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9385478A JPS588159B2 (en) | 1978-08-01 | 1978-08-01 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9385478A JPS588159B2 (en) | 1978-08-01 | 1978-08-01 | Method for manufacturing multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5521144A JPS5521144A (en) | 1980-02-15 |
| JPS588159B2 true JPS588159B2 (en) | 1983-02-14 |
Family
ID=14093995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9385478A Expired JPS588159B2 (en) | 1978-08-01 | 1978-08-01 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS588159B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62195772U (en) * | 1986-06-03 | 1987-12-12 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068521U (en) * | 1983-10-17 | 1985-05-15 | 日立マクセル株式会社 | electrochromic display element |
| JPH04115044A (en) * | 1990-09-05 | 1992-04-15 | Hiraki Igaki | Heat insulating wall material and construction method for wall using heat insulating wall material |
-
1978
- 1978-08-01 JP JP9385478A patent/JPS588159B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62195772U (en) * | 1986-06-03 | 1987-12-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5521144A (en) | 1980-02-15 |
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