CN111741591A - High-frequency antenna printed circuit board and preparation method thereof - Google Patents
High-frequency antenna printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN111741591A CN111741591A CN201910227636.2A CN201910227636A CN111741591A CN 111741591 A CN111741591 A CN 111741591A CN 201910227636 A CN201910227636 A CN 201910227636A CN 111741591 A CN111741591 A CN 111741591A
- Authority
- CN
- China
- Prior art keywords
- frequency antenna
- dielectric constant
- antenna printed
- circuit board
- low dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a high-frequency antenna printed circuit board which comprises a PCB body, wherein a copper layer is arranged on the PCB body, and low-dielectric-constant covering film layers are compounded on the upper surface and the lower surface of the PCB body. Compared with the traditional solder mask process, the cover film with the low dielectric constant has the same functions of insulating and protecting the circuit as the traditional PCB solder mask process, and meanwhile, due to the characteristics, thickness consistency and the like of the cover film, the loss in the signal transmission process can be reduced, and the PIM index of the antenna circuit board is improved.
Description
Technical Field
The invention belongs to the field of circuit board preparation, and particularly relates to a high-frequency antenna printed circuit board and a preparation method thereof.
Background
The common solder mask process of the traditional high-frequency antenna plate leads to larger signal loss in the transmission process due to higher dielectric constant of the solder mask; in addition, the traditional solder mask process inevitably causes uneven solder mask thickness due to the characteristic of manual operation, namely, the problem of larger difference of dielectric constants on the same surface is caused, and the signal transmission is also influenced, so that the current solder mask process cannot meet the development requirement of the high-frequency antenna board.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks, an object of the present invention is to provide a high frequency antenna printed circuit board and a method for manufacturing the same, which not only satisfy the functions of insulating and protecting the circuit, but also reduce the loss during the signal transmission process.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the utility model provides a high frequency antenna printed wiring board, includes the PCB board body, is equipped with the copper layer on the body, PCB board body upper and lower surface complex has low dielectric constant to cover the rete.
As a further improvement of the invention: the low dielectric constant cover film is 45um-50um in thickness. Further satisfying the functions of insulating and protecting the circuit.
As a preferred embodiment of the invention, the dielectric constant of the low-dielectric-constant covering film is 2.9-3.1, and signal loss in process transmission is avoided to the greatest extent.
A method for preparing the high-frequency antenna printed circuit board of claim 1, the covering film layers with low dielectric constant compounded on the PCB body, the upper surface and the lower surface are sequentially placed on the laminating steel plate of laminating equipment; pressing under 500-550psi pressure and 180 deg.C, melting the composite covering films on the upper and lower surfaces at high temperature; and then rapidly cooling and solidifying the covering film.
The invention is preferably that:
the invention adopts the insulating cover film with low dielectric constant to replace the traditional PCB solder mask process, ensures the average and consistency of the thickness of the PCB, can avoid signal loss in the transmission process to a great extent, and can improve PIM index in the transmission process.
Drawings
Fig. 1 is a schematic structural diagram of a high-frequency antenna printed wiring board according to the present invention.
Detailed Description
In order to enhance the understanding of the present invention, the present invention will be described in further detail with reference to the following examples.
Example (b): as shown in fig. 1, the invention relates to a high frequency antenna printed circuit board, which is composed of a low dielectric constant covering film layer 2, a PCB body 1 and a low dielectric constant covering film layer 2 from top to bottom; the PCB body 1 is a substrate insulating layer, and is formed with an upper copper layer and a lower copper layer. The low dielectric constant covering film layers 2 are respectively covered on the copper layers to realize the functions of protecting circuits and reducing transmission loss.
In order to ensure the insulation and protection of the cover film layer, the low dielectric constant cover film used in this example has a thickness of 50um and a dielectric constant of 3. Meanwhile, signal loss in the process of transmission is avoided to a great extent, and PIM indexes in the transmission process are improved.
The production process corresponding to the embodiment is as follows: placing the PCB body, the low-dielectric-constant covering film layers compounded on the upper surface and the lower surface on a laminating steel plate of laminating equipment in sequence; setting characteristic pressing parameters, namely pressing for more than 1 hour at the temperature of 180 ℃ under the pressure of 550psi, and melting the covering films compounded on the upper surface and the lower surface at high temperature; and then rapidly cooling and solidifying the covering film.
The above-mentioned embodiment of the present invention is only one embodiment of the present invention, and is only used for explaining the present invention, and not to limit the protection scope of the present invention, and all equivalent structures made by using the contents of the description and the drawings of the present invention are directly or indirectly applied to other related technical fields, and are within the protection scope of the present invention.
Claims (4)
1. The utility model provides a high frequency antenna printed wiring board, includes the PCB body, is equipped with the copper layer on the body, its characterized in that: the upper surface and the lower surface of the PCB body are compounded with low dielectric constant covering film layers.
2. The high-frequency antenna printed wiring board according to claim 1, characterized in that: the low dielectric constant cover film is 45um-50um in thickness.
3. A high-frequency antenna printed wiring board according to claim 1 or 2, characterized in that: the low dielectric constant coating film has a dielectric constant of 2.9-3.1.
4. A method for manufacturing the high-frequency antenna printed circuit board according to claim 1, wherein the low dielectric constant covering film layers compounded on the PCB body, the upper surface and the lower surface are sequentially arranged on a laminating steel plate of laminating equipment; pressing under 500-550psi pressure and 180 deg.C, melting the composite covering films on the upper and lower surfaces at high temperature; and then rapidly cooling and solidifying the covering film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910227636.2A CN111741591A (en) | 2019-03-25 | 2019-03-25 | High-frequency antenna printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910227636.2A CN111741591A (en) | 2019-03-25 | 2019-03-25 | High-frequency antenna printed circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111741591A true CN111741591A (en) | 2020-10-02 |
Family
ID=72645785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910227636.2A Pending CN111741591A (en) | 2019-03-25 | 2019-03-25 | High-frequency antenna printed circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111741591A (en) |
-
2019
- 2019-03-25 CN CN201910227636.2A patent/CN111741591A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110698112B (en) | Preparation method of low-dielectric-constant microwave dielectric substrate containing hollow ceramic powder | |
| CN105472912A (en) | Press fit method for high-voltage-resistant PCB with thick copper plate | |
| KR101451503B1 (en) | Inductor and method for manufacturing the same | |
| KR101740816B1 (en) | Chip inductor | |
| TW201616924A (en) | Multi-layer printed circuit boards suitable for layer reduction design | |
| CN108922779A (en) | A kind of chip through-hole gold electrode chip capacitor and preparation method thereof | |
| CN102548199A (en) | Circuit board and manufacturing method thereof | |
| CN106188998A (en) | A kind of PTFE medium substrate high-frequency copper-clad plate | |
| CN111741591A (en) | High-frequency antenna printed circuit board and preparation method thereof | |
| CN204929386U (en) | Thoughtlessly press HF link plate structure | |
| US20180114760A1 (en) | Package Substrate and Fabrication Method Thereof, and Integrated Circuit Chip | |
| CN111605265A (en) | Liquid crystal polymer disturbing copper-clad plate and manufacturing method thereof | |
| CN101868118B (en) | High-frequency circuit substrate and production method thereof | |
| CN114989418B (en) | Method for modifying polyphenylene ether resin, laminate film composite, laminate film, and substrate | |
| CN206611637U (en) | The product structure of multi-layer precise circuit is made on ceramic substrate | |
| CN201374874Y (en) | Printed circuit board | |
| CN112165788B (en) | Manufacturing method of waterproof PCB | |
| CN114103307A (en) | Low-warpage thermosetting resin copper-clad plate and preparation method thereof | |
| JP2016540467A (en) | Multilayer chip type ceramic radio frequency low pass filter and method of manufacturing the same | |
| JP3239180U (en) | New material layer structure manufacturing method for high-frequency wiring board and its product | |
| CN102427666A (en) | Manufacturing method of high frequency microwave circuit board base material | |
| CN209676576U (en) | A kind of structure preventing pcb board slab warping | |
| CN201700082U (en) | Polytetrafluoroethylene glass fiber ceramic base plate | |
| CN212936283U (en) | High-frequency circuit board | |
| CN211792206U (en) | Low dielectric constant PI film high frequency antenna printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201002 |