JPS5880891A - Method of inspecting printed circuit board - Google Patents

Method of inspecting printed circuit board

Info

Publication number
JPS5880891A
JPS5880891A JP56180151A JP18015181A JPS5880891A JP S5880891 A JPS5880891 A JP S5880891A JP 56180151 A JP56180151 A JP 56180151A JP 18015181 A JP18015181 A JP 18015181A JP S5880891 A JPS5880891 A JP S5880891A
Authority
JP
Japan
Prior art keywords
contact
wiring board
printed wiring
mask
inspected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56180151A
Other languages
Japanese (ja)
Other versions
JPH0142387B2 (en
Inventor
宮原 信文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANTO KASEI KOGYO
KANTOU KASEI KOGYO KK
Original Assignee
KANTO KASEI KOGYO
KANTOU KASEI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANTO KASEI KOGYO, KANTOU KASEI KOGYO KK filed Critical KANTO KASEI KOGYO
Priority to JP56180151A priority Critical patent/JPS5880891A/en
Publication of JPS5880891A publication Critical patent/JPS5880891A/en
Publication of JPH0142387B2 publication Critical patent/JPH0142387B2/ja
Granted legal-status Critical Current

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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はコンビニ、−夕を用いたシリ″ント配線板の検
査方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for inspecting a cylinder wiring board using a convenience store machine.

従来、プリント配線板検査装置は、嵐品である事が確認
された基準プリント配線板と、該基準プリント配線板の
ランド穴位置に対応して接触ぜンを設けたテストフイク
スチャーを用意し、該テストフイクスチャーと骸基準プ
リント配線板を重ねて、諌接触ビンを咳プリント配線板
のランド穴に接触させ、該接触ビンを順次電気的に走査
して、先づ該基準プリント配線板の配線情報を読取って
記憶する事によって、検査準備を完了し、次に該基準プ
リント配線板の代りに之と同一配置のランド穴と、配線
パターンを有する良否不明の被検査プリント配線板を用
いて、餓接触ピンを諒プリント配線板のランド穴に振触
させ、前記と同様に該接触ビンを順次電気的に走査して
、該被検査プリント配線板の配線情報を絖増p乍ら、R
K記憶されて居る基準ンリント配線板の配線?#報と比
較し、同一であるか台かで、良否の判定を行って居た。
Conventionally, printed wiring board inspection equipment prepares a reference printed wiring board that has been confirmed to be a defective product and a test fixture that has contact holes corresponding to the land hole positions of the reference printed wiring board. , overlap the test fixture and the reference printed wiring board, bring the contact bottle into contact with the land hole of the printed wiring board, and sequentially electrically scan the contact bottle to first touch the reference printed wiring board. Preparation for inspection is completed by reading and memorizing the wiring information of the reference printed wiring board, and then a printed wiring board to be inspected of unknown quality having land holes and wiring patterns in the same arrangement as the reference printed wiring board is used instead of the reference printed wiring board. Then, the contact pins are shaken against the land holes of the printed wiring board, and the contact pins are sequentially electrically scanned in the same manner as above to increase the wiring information of the printed wiring board to be inspected. R
Is the wiring of the standard printed circuit board memorized? They compared it with #report and judged whether it was the same or not.

尚、前記接触ぜンは、印加圧力によって、伸紬する構造
を有し、又、配線情報とは、例えば、。
The contact wire has a structure that is stretched by applied pressure, and the wiring information is, for example.

成る接触ピン査号と他の接触ビン査号への閣が電気的に
尋過でおるか、開放であるかを示す。
Indicates whether the connection between one contact pin number and another contact bottle number is electrically open or open.

しかし、此の様な検査装置では、被検査プリント配線板
のi*1kKpわせて、テストフイクスチャーをそれぞ
れ用意し交換しなければならないので、多種少量生産の
プリント配線板を検査するのは、コスト的に困難であっ
た。
However, with this kind of inspection equipment, it is necessary to prepare and replace test fixtures for each i*1kKp of the printed wiring board to be inspected. This was difficult due to cost.

上記間組点を克服するために、第1図に示す徐に、接触
ビンlを、絶縁基板2に、例えば、2.54mの格子状
に配列した、汎用テストフイクスチャ−3が考えられた
。此の方式をとると、例えば約32mX40mの有効寸
法を有するプリント配縁板を検査する□ための、テスト
フイクスチャーの接触−ンの数は、約20,000本と
なるが、前述した株なプリント配線板の種別毎にテスト
アイクスチャーを別々に用意する会費がなくなる。そし
て、此の汎用テストフイクスチャー3のkfilビンl
が、被検査シリ/トのランド穴以外の位置に尚って誤動
作を生じたり、傷をつけたりするのを防止するために、
同図に示す様に被検査プリント配線板4のランド穴!’
、6.?に対応した穴8が形成された絶縁体薄板から成
る、マスク9を用意し第2図に示す様に、接触ビン1m
、1bll@・・・の内被検査プリント配線板40ラン
ド大位置と対応する接触ビンのみを該プリント配線板と
接触させ、他の接触ビンは、該マスク9によって接触を
阻止されて居る状態とする。
In order to overcome the above problems, a general-purpose test fixture 3 was devised, as shown in FIG. 1, in which contact bottles 1 are arranged on an insulating substrate 2 in a grid of, for example, 2.54 m. If this method is adopted, the number of contact points of the test fixture for inspecting a printed wiring board with effective dimensions of approximately 32 m x 40 m, for example, will be approximately 20,000. There is no need to pay for separate test image textures for each type of printed wiring board. And the kfil bin l of this general purpose test fixture 3
However, in order to prevent malfunctions or damage to locations other than the land holes of the tested board,
As shown in the figure, the land hole of the printed wiring board 4 to be inspected! '
,6. ? A mask 9 made of a thin insulating plate with holes 8 corresponding to
, 1bll@..., only the contact bin corresponding to the large position of 40 lands of the printed wiring board to be inspected is brought into contact with the printed wiring board, and the other contact bins are prevented from contacting by the mask 9. do.

此の状態で、該接触ビンのすべてを順次電気的に走査し
て、骸プリント配線板の配線情報をM堆って記憶したり
、或は又配線情報をt&増って、既に記憶しである配線
情報と比較して検査を行なう事が考えられ穴。
In this state, all of the contact bins are sequentially electrically scanned to store the wiring information of the skeleton printed wiring board, or to add the wiring information to the memory that has already been stored. It is thought that the hole may be inspected by comparing it with certain wiring information.

しかし乍ら、此の僚な検査方法では、例えば。However, with this advanced testing method, e.g.

被検査プリント配線板のランド穴が4,000偶の場合
であっても、20,000本の接鯵、−ンの総てを電気
的に走査して居るので、!l!際上は、検査には全く関
係のないl 6.OU 0本の接触−ンに対する走査が
、無駄な時間を発生する事となった。
Even if the printed wiring board to be inspected has 4,000 land holes, all 20,000 land holes are electrically scanned! l! Actually, it has nothing to do with the inspection. 6. Scanning for OU 0 contacts resulted in wasted time.

一般的に、基準プリント配線板から配線情報を読取るの
fcl!する時間は、プリント配III板の良否判定を
行う検査時間と比較して、非常に長時間を要する場合が
多い。
Generally, fcl! reads wiring information from a reference printed wiring board! In many cases, it takes a much longer time than the inspection time required to determine the quality of the printed wiring board.

従って、本発明は、実際に必費とする接触ビンのみを走
査する様にして、短時間で基準プリント配線板から配線
情報を読取る拳の出来る、プリント配線板の検量方法を
提供する事を目的とするものである。
Therefore, an object of the present invention is to provide a printed wiring board calibration method that can read wiring information from a reference printed wiring board in a short time by scanning only the contact bins that are actually necessary. That is.

以下、本発明の畔細を回向に基づき説明する・第3図は
、上記の目的に使用するコンぜエータ制御汎用プリント
配線板検査装置の構成の一例を示すもので39は前述し
た接触ビン群を有するテストフィクスチャー、3141
検査義置全t+を制御するゾ關セッサー、32は操作用
コンソール、33及び34は、記憶部で、33は制−に
必要なソフトウェア領域、34は書込み及び絖出し可能
なRAM領域を示す。35はインターフェース部、36
IIi制御鄭、37は配線情報記憶部、38はテストフ
ィクスチャ−39の各澱触ピンを順次電気的に走査する
走査部である。
Hereinafter, the details of the present invention will be explained based on the direction. Figure 3 shows an example of the configuration of a general-purpose printed wiring board inspection device for controlling a condenser used for the above purpose, and 39 is the contact bin mentioned above. Test fixture with groups, 3141
32 is a console for operation, 33 and 34 are storage units, 33 is a software area necessary for control, and 34 is a RAM area capable of writing and starting. 35 is an interface section, 36
37 is a wiring information storage section, and 38 is a scanning section that sequentially electrically scans each contact pin of the test fixture 39.

先づ%M4図に示す#に、上述した格子状に配列した接
触ビン1を有するテストフィクスチャ−3、被検査プリ
ント配線板のランド穴に対応した位置に穴8を形成した
le縁体薄板から成るマスク9、及び短絡板10を用意
する。
First, # shown in the %M4 diagram is a test fixture 3 having contact bins 1 arranged in a grid pattern as described above, and a thin edge plate with holes 8 formed at positions corresponding to the land holes of the printed wiring board to be tested. A mask 9 and a shorting plate 10 are prepared.

短絡板lOは、導電体より成9、上述しfc接触ピンl
と接触すると、該ビンlと電気的に導通する性質を有し
てMp、接触状態をよp良くするために、同一〇如く接
触ビンlと対応した位置に穴ll管形成して4良φ。従
って、複数の接触ビンlが諒短絡板1Gと做触すると、
該接触ピン相互間は、導通状態となる。
The shorting plate lO is made of a conductor and is connected to the fc contact pin l as described above.
When in contact with the bottle 1, it has the property of electrically conducting with the bottle 1, and in order to improve the contact condition, a hole 1 pipe is formed at a position corresponding to the contact bottle 1 as shown in ○. φ. Therefore, when a plurality of contact bottles 1 come into contact with the short circuit plate 1G,
The contact pins are electrically connected to each other.

第41に於て、接触ビンlを、マスク9を介して短絡板
10に押圧すると、マスク穴と対応する位置の接触ビン
のみが短絡板10に接触して、該接触ビン相互間が導通
状態となるが、マスク9の穴は、被検査プリント配線板
のランド穴と対応した位11に形成されて居るので、結
局扱検査プリント配線板のランド穴と対応した位置の嵌
触ピン相互間が導通状態となる。
In the 41st step, when the contact bottle l is pressed against the short circuit plate 10 through the mask 9, only the contact bottle at the position corresponding to the mask hole contacts the short circuit plate 10, and the contact bottles are electrically connected to each other. However, since the hole in the mask 9 is formed at the position 11 corresponding to the land hole of the printed wiring board to be inspected, the distance between the fitting pins at the position corresponding to the land hole of the printed wiring board to be handled and inspected is as follows. Becomes conductive.

従って、すべての接触ビンを順次電気的に*食すると、
相互間が導通状態となって居る接触ビン査号を識別する
事が可能となるので、記憶部のソフトウェア領域334
C格納した、「接触ビン番号登録プログラム」を走らせ
てインターフェース35、制(81g36を介して走査
s38を制御し、相互間が導通状態KToる接触ビン番
号を、RAM領域34に記憶させるが、此の段階t−r
登録」と称する事とする。
Therefore, if we electrically eclipse all the contact bins in sequence,
Since it is possible to identify the contact bottle codes that are electrically connected to each other, the software area 334 of the storage unit
By running the "contact bin number registration program" stored in C, the scanning s38 is controlled via the interface 35 and control (81g36), and the contact bin numbers whose mutual connection is in a conductive state KTo are stored in the RAM area 34. stage t-r
It shall be referred to as "Registration".

次に、該短絡板lOを取外し、代りに第2図に示す様に
基準プリント配線板4を用意し、接触ピン1をマスク9
を介して4に押圧すると、削述した休に、4のラン、ド
l(s’、 e 、 7・・・のみに接触ピンla、l
b、lc・・・が接触する事となるが、該恢触ピン食号
は、上述し大通り、既に第3図のRAM領tIR34に
登録されて居るので、「配線情報検出プログラム」を走
らせて該登録ピン番号を順次読出し乍ら、登録ピン臂号
の接触ビン相互間のみを順次走査して配縁↑に@を読取
9、配縁情報記憶部37IIc格納する。
Next, the shorting plate IO is removed, a reference printed wiring board 4 is prepared instead as shown in FIG.
When pressed to 4 through
b, lc... will come into contact, but as mentioned above, the contact pin number has already been registered in the RAM area tIR34 in Figure 3, so run the "wiring information detection program". While sequentially reading out the registered pin numbers, only the contact bins of the registered pin arm numbers are sequentially scanned, @ is read in the alignment ↑, and the result is stored in the alignment information storage section 37IIc.

尚、第3図で轢配線情報記憶部37は、プロセッサー3
1とインターフェース35を介した独立したハードウェ
ア37として示しであるがゾロセッサー31より直接ア
クセス可能なRAM領域34をあてる事も可能である。
In addition, in FIG. 3, the track wiring information storage section 37 is the processor 3
1 and an independent hardware 37 via an interface 35, it is also possible to allocate a RAM area 34 that can be accessed directly from the processor 31.

又、登録されて盾ない接触ビンに関する配線情報は、「
配線情報検出プログラム」に依る事なく、すべて開放と
して3?lC格納しておけば良い。
In addition, wiring information regarding registered unshielded contact bins is available at
3, assuming that everything is open, regardless of the wiring information detection program? All you have to do is store it in LC.

此の段階を「配線情報の耽込み」と称する事とするが、
以上で被検査プリント配線板の検査準備を完了する。
This stage will be referred to as "embedding wiring information".
This completes the preparation for testing the printed wiring board to be tested.

上述した、「登録」及び「配線情報の読込み」を行う事
によって、「配線情報検出プログラム」で走査される接
触ビンの数は大巾に減る事となるので、検査準備に要す
る時間は大巾に節約される事が明白である。
By performing the above-mentioned "registration" and "reading wiring information", the number of contact bins scanned by the "wiring information detection program" will be greatly reduced, so the time required for inspection preparation will be greatly reduced. It is clear that there are savings.

又、次回の検査準備を行う際に、上記の「登録」及び「
配線情報の読込み」を繰返す手間を省くために、図示し
て店な−が、上記の配線情@h己惜部37に格納しであ
るデータを、コンピュータ制御の磁気テープ等に移して
おき、次回の恒査早伽の際に該蝉気デープから、37へ
格納すれば、尚一層の時間短縮が可能となるのは勿論で
ある。
In addition, when preparing for the next inspection, the above "registration" and "
In order to save the trouble of repeatedly reading the wiring information, the store shown in the figure transfers the data stored in the wiring information section 37 to a computer-controlled magnetic tape, etc. Of course, if you store the energy from the Semi-Qi deep into 37 at the time of the next Kousha Saya, it will be possible to further shorten the time.

1−検査」の段階では、纂2図に於て、基準プリント配
線板40代りに基準プリント配線板と同一配置のランド
穴と配III/々ターンを有する嵐否不明の被検査プリ
ント配線板4を用意□する。
1-Inspection'' stage, in Figure 2, in place of the reference printed wiring board 40, the printed wiring board 4 to be inspected, which has land holes and arrangement III/2 turns in the same arrangement as the reference printed wiring board, is used. Prepare □.

セして「配−情報の絖込み」と同様に、接触ぜンlをマ
スク9を介して、4に押圧し、第3図のソフトウェア領
域334C格納しである「検査プログラム」を走らせて
、該接触ビン相互間の配線すイ報を、配11iil+1
#報記憶s37に格納されて后る基準プリント配線板の
配線情報と順次比較して、良否の判定を行う。
Then, in the same way as ``Insertion of distribution information'', press the contact hole 1 to 4 through the mask 9, run the ``inspection program'' stored in the software area 334C of FIG. 3, The wiring information between the contact bins is distributed 11iil+1.
# It is sequentially compared with the wiring information of the reference printed wiring board stored in the information storage s37 to judge whether it is good or bad.

一般的には、「検査」段階では検査に要する時間は、「
配線情報の読込み」に賛する時間よシ短かい場合が多い
ので実際には、接触−ン数を限定して、走査する必要の
な一場合が多埴が、上述しfc「登録」ビンのみを走査
する方式をとれば検査時間を短縮出来る4Iは勿論であ
る。
Generally, the time required for inspection at the "inspection" stage is "
In many cases, the time taken to read the wiring information is shorter, so in reality, there are cases where it is not necessary to limit the number of contacts and scan, but only the fc "registration" bin is used as described above. Of course, 4I can shorten the inspection time by scanning the 4I.

以上の様に本発明は、振触ビンを格子状に配^したテス
トフイクスチャーと、仮検査プリント配線板に対応する
穴あきマスクを備え、該プリント配線板のランド穴に接
触するピン着号を「登録」シ、次に骸「登録」接触ピン
相互間のみを走査して「配線情報の耽込み」を行うよう
にしたので、基準プリント配線板の配線情報の読込みの
所要時間を大巾に短縮する◆ができる。
As described above, the present invention includes a test fixture in which shaking bottles are arranged in a grid pattern, a perforated mask corresponding to a temporary test printed wiring board, and pins that contact the land holes of the printed wiring board. Since the number is "registered" and then "registered" contact pins are scanned only to "incorporate wiring information", the time required to read the wiring information of the reference printed wiring board is greatly reduced. You can shorten it to width by ◆.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、汎用テストフイクスチャーの説明図、#!2
図は被検査プリント配線板をマスクを介して、汎用テス
トフイクスチャーに押圧した説明1、第3図はコンピュ
ータ制御汎用プリント配M板検査装置の構成の一例を示
す図、第4図は短絡板を用いる場合の説明図。
Figure 1 is an explanatory diagram of a general-purpose test fixture, #! 2
Figure 1 shows an explanation of the printed wiring board to be inspected being pressed against a general-purpose test fixture through a mask, Figure 3 shows an example of the configuration of a computer-controlled general-purpose printed wiring board inspection device, and Figure 4 shows short circuits. An explanatory diagram when using a plate.

Claims (1)

【特許請求の範囲】[Claims] l 各種のプリント配置mmの検査を可能とするために
格子状に配列された接触ビンを備えた汎用テストフイク
スチャーと、被検査プリント配線板のランド穴位置に対
応して穴が形成された絶縁体から成るマスクと、該接触
ビンと接触した時に該接触ビン相互間を電気的に短絡す
る短絡板と、被検査プリント配線板用の基準プリント配
線板とを用意し、先づ、骸マスクと該短絡板とを重ねて
、該マスクの穴を貫通して該デストフイクスチャーの接
触ぜンを該短絡板に接触させて短絡板に接触する一ン誉
号を登鈴する拳を第1スデツゾとし次に、該テストフイ
クスチャーの接触ビンを諒マスクの穴を貫通して数基・
準プリント配線板のランド穴に振触させて前記゛登鋒さ
れたぜン喬号間の配線情報を読取る蔓を@2ステップと
して、検査準備を完了する事を特徴とするプリント配線
板の検査方法。
l A general-purpose test fixture with contact bins arranged in a grid to enable inspection of various print placement mm, and holes formed corresponding to the land hole positions of the printed wiring board to be inspected. A mask made of an insulator, a shorting plate that electrically shorts between the contact bottles when they come into contact with each other, and a reference printed wiring board for the printed wiring board to be inspected are prepared, and first, a mask is placed on the mask. and the short-circuiting plate, pass through the hole of the mask, bring the contact point of the death fixture into contact with the short-circuiting plate, and make a first fist that touches the shorting plate. 1. Next, insert several contact bottles of the test fixture through the holes in the mask.
Inspection of a printed wiring board characterized in that test preparation is completed by shaking the land hole of the semi-printed wiring board and reading the wiring information between the mounted wires as @2 steps. Method.
JP56180151A 1981-11-10 1981-11-10 Method of inspecting printed circuit board Granted JPS5880891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56180151A JPS5880891A (en) 1981-11-10 1981-11-10 Method of inspecting printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56180151A JPS5880891A (en) 1981-11-10 1981-11-10 Method of inspecting printed circuit board

Publications (2)

Publication Number Publication Date
JPS5880891A true JPS5880891A (en) 1983-05-16
JPH0142387B2 JPH0142387B2 (en) 1989-09-12

Family

ID=16078285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56180151A Granted JPS5880891A (en) 1981-11-10 1981-11-10 Method of inspecting printed circuit board

Country Status (1)

Country Link
JP (1) JPS5880891A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59122555U (en) * 1983-02-08 1984-08-17 株式会社フジクラ Printed circuit board inspection equipment
WO2018078752A1 (en) * 2016-10-26 2018-05-03 三菱電機株式会社 Inspection device and inspection method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418070B2 (en) * 2015-06-05 2018-11-07 三菱電機株式会社 Measuring device, measuring method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59122555U (en) * 1983-02-08 1984-08-17 株式会社フジクラ Printed circuit board inspection equipment
JPH026375Y2 (en) * 1983-02-08 1990-02-15
WO2018078752A1 (en) * 2016-10-26 2018-05-03 三菱電機株式会社 Inspection device and inspection method

Also Published As

Publication number Publication date
JPH0142387B2 (en) 1989-09-12

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