JPS5879931U - 温度過昇防止装置 - Google Patents
温度過昇防止装置Info
- Publication number
- JPS5879931U JPS5879931U JP17599781U JP17599781U JPS5879931U JP S5879931 U JPS5879931 U JP S5879931U JP 17599781 U JP17599781 U JP 17599781U JP 17599781 U JP17599781 U JP 17599781U JP S5879931 U JPS5879931 U JP S5879931U
- Authority
- JP
- Japan
- Prior art keywords
- prevention device
- rise prevention
- overtemperature rise
- overtemperature
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002265 prevention Effects 0.000 title claims 3
- 238000007789 sealing Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Fuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17599781U JPS5879931U (ja) | 1981-11-25 | 1981-11-25 | 温度過昇防止装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17599781U JPS5879931U (ja) | 1981-11-25 | 1981-11-25 | 温度過昇防止装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5879931U true JPS5879931U (ja) | 1983-05-30 |
JPS6128361Y2 JPS6128361Y2 (en, 2012) | 1986-08-22 |
Family
ID=29968649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17599781U Granted JPS5879931U (ja) | 1981-11-25 | 1981-11-25 | 温度過昇防止装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5879931U (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228661A (ja) * | 2005-02-21 | 2006-08-31 | Anzen Dengu Kk | 温度ヒューズ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3309481A (en) * | 1965-03-04 | 1967-03-14 | Micro Devices Corp | Thermal switch with thermally collapsible member |
JPS54114738U (en, 2012) * | 1978-02-01 | 1979-08-11 |
-
1981
- 1981-11-25 JP JP17599781U patent/JPS5879931U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3309481A (en) * | 1965-03-04 | 1967-03-14 | Micro Devices Corp | Thermal switch with thermally collapsible member |
JPS54114738U (en, 2012) * | 1978-02-01 | 1979-08-11 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228661A (ja) * | 2005-02-21 | 2006-08-31 | Anzen Dengu Kk | 温度ヒューズ |
Also Published As
Publication number | Publication date |
---|---|
JPS6128361Y2 (en, 2012) | 1986-08-22 |
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