JPS5877249A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5877249A JPS5877249A JP56174570A JP17457081A JPS5877249A JP S5877249 A JPS5877249 A JP S5877249A JP 56174570 A JP56174570 A JP 56174570A JP 17457081 A JP17457081 A JP 17457081A JP S5877249 A JPS5877249 A JP S5877249A
- Authority
- JP
- Japan
- Prior art keywords
- window
- light
- semiconductor device
- package
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 230000008034 disappearance Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 230000002269 spontaneous effect Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
本発明は素子に記憶さｎた情報が自然に消去されること
を防止できる半導体装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device that can prevent information stored in an element from being naturally erased.
一般ニ、たとえばＥ Ｐ −ＦＬ ＯＭ （Ｅｌｅｃｔ
ｒｉｃａｌ ｌｙｐｒｏｇｒｇｒｍａｂｌｅ Ｒｅａ
ｄ Ｑｎｌｙ Ｍｅｍｏｒｙ） ＋７）ように、紫外線
を用いて素子の記憶情報を消去するを式の半導体装置に
おいては、光照射用の窓が設けられている。In general, for example, E P -FL OM (Elect
rical lyprogrgrammable Rea
d Qnly Memory) +7) In a semiconductor device that uses ultraviolet light to erase information stored in an element, a window for light irradiation is provided.
ところが、従来の半導体装置においては、光照射用の窓
２は第１図に示すようにパッケージ１の上面に設けられ
ている。そのため、このような半導体装置の場合、窓が
外部の光ＫＩＮ出されたままであると、自然光により情
報が消失されてしまうおそれがあるので、実際の使用状
態では窓にシール等を貼る必要があった。However, in the conventional semiconductor device, the window 2 for light irradiation is provided on the top surface of the package 1, as shown in FIG. Therefore, in the case of such semiconductor devices, if the window is left exposed to external light, there is a risk that the information will be lost due to natural light, so it is necessary to put stickers etc. on the window during actual use. Ta.
しかし、このようなシール貼着作業は非常に面倒であり
、−実装コストも上昇してしまうという問題がある。However, such a seal pasting operation is extremely troublesome, and there are problems in that the mounting cost also increases.
本発明の目的は、前記従来技術の問題点を解消し、シー
ルを貼り付けたりしなくても記憶情報の消失を防止でき
る半導体装置を提供すること［６る。An object of the present invention is to solve the problems of the prior art described above and to provide a semiconductor device that can prevent the loss of stored information without pasting a sticker [6].
この目的を達成するため、本発明による半導体装置は、
光照射用の窓をパッケージの裏面側に設けたことを特徴
とするものである。To achieve this objective, the semiconductor device according to the present invention includes:
It is characterized by a window for light irradiation provided on the back side of the package.
以下、本発明を図面に示す一実施例にしたがってさらに
説明する。Hereinafter, the present invention will be further explained according to an embodiment shown in the drawings.
第２図は本発明による半導体装置の一実施例を裏面側か
ら見た斜視図である。FIG. 2 is a perspective view of one embodiment of the semiconductor device according to the present invention, viewed from the back side.
本実施例においては、たとえば、紫外線のような光を照
射することにより、素子に記憶された情報を消去するだ
めの光照射用の窓１２はバック−ジ１０の裏面側に形成
されている。In this embodiment, a light irradiation window 12 is formed on the back side of the bag 10 for erasing information stored in the elements by irradiating light such as ultraviolet rays.
すなわち、本実施例における光照射用の窓１２はビン１
４が延長している側に設けられている。That is, the window 12 for light irradiation in this embodiment is
4 is provided on the extended side.
したがって、本実施例によれば、半導体装置をプリント
基板等に実装する場会、ビン１４をプリント基板に実装
した状態では、光照射用の窓１２はプリント基板側に面
していることになるので、光はプリント基板で遮蔽され
、自然光が窓１２からパッケージｌＯ内に入って素子の
記憶情報を消失させてしまうことはない。その結果、窓
１２にわざわざ情報消失防止用のシールを貼る必要がな
く、シール貼着のための工数を省略でき、使用者におけ
る実装コストも低減できる。Therefore, according to this embodiment, when a semiconductor device is mounted on a printed circuit board or the like, when the bottle 14 is mounted on the printed circuit board, the light irradiation window 12 faces the printed circuit board side. Therefore, light is blocked by the printed circuit board, and natural light does not enter the package 10 through the window 12 and erase the information stored in the device. As a result, there is no need to take the trouble to affix a sticker to prevent information loss on the window 12, the number of steps required to affix the sticker can be omitted, and the installation cost for the user can also be reduced.
なお、本発明は記憶情報を光により消去する温式の半導
体装置に広く適用できる。Note that the present invention can be widely applied to warm type semiconductor devices in which stored information is erased with light.
以上説明したように、本発明によれば、シール等を貼る
ことなく記憶情報の消失を防止でき、工数お工び実装コ
ストを低減させることができる。As described above, according to the present invention, it is possible to prevent the loss of stored information without pasting a sticker or the like, and it is possible to reduce man-hours and mounting costs.
第１図は従来の半導体装置の上面側斜視図、纂２図は本
発明による半導体装置の一実施例の裏面側斜視図である
。
ｌＯ・・・パッケージ、１２・・・光照射用の窓、１４
・・・ビン
学、・。
代理人 弁理士 薄 １）利 幸 八゛； ： ：
、 、：・FIG. 1 is a top perspective view of a conventional semiconductor device, and FIG. 2 is a bottom perspective view of an embodiment of a semiconductor device according to the present invention. lO... Package, 12... Window for light irradiation, 14
...Binology... Agent Patent Attorney Susuki 1) Toshiyuki Hachio; : : :
, , :・
Claims (1)
る半導体装置において、光照射用の窓をパッケージの裏
面側に設けたことを特徴とする半導体装置。1. A semiconductor device in which information stored in an element is erased by irradiation of light from the outside, characterized in that a window for light irradiation is provided on the back side of a package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56174570A JPS5877249A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56174570A JPS5877249A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5877249A true JPS5877249A (en) | 1983-05-10 |
Family
ID=15980864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56174570A Pending JPS5877249A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877249A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60181036U (en) * | 1984-05-11 | 1985-12-02 | 吉田 章司 | UV-erasable read-only memory |
-
1981
- 1981-11-02 JP JP56174570A patent/JPS5877249A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60181036U (en) * | 1984-05-11 | 1985-12-02 | 吉田 章司 | UV-erasable read-only memory |
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