JPS5877072U

JPS5877072U - Substrate for mounting semiconductor elements

Info

Publication number: JPS5877072U
Application number: JP17103981U
Authority: JP
Inventors: 貞広　昌利
Original assignee: 三菱電機株式会社
Priority date: 1981-11-16
Filing date: 1981-11-16
Publication date: 1983-05-24

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図および第２図は従来の装置を示す概略図、第３図
はデュアルインラインタイプの半導体素子を示す概略図
でａは正面図、ｂは側面図、Ｃは下面図である。第４図
はこの考案の一実施例を示す概略図、第５図は基板構成
を示す概略図である。図中、１はデュアルインラインタイプの半導体素子本体
、３．４．　５．　６は導電部列、５１゜６１は導電部
、５２．５３および６２．６３はピン挿入穴、７は基板
、１１は端子である。なお同一符号は同一または相当部
分を示す。1 and 2 are schematic diagrams showing a conventional device, and FIG. 3 is a schematic diagram showing a dual in-line type semiconductor element, in which a is a front view, b is a side view, and c is a bottom view. FIG. 4 is a schematic diagram showing an embodiment of this invention, and FIG. 5 is a schematic diagram showing the structure of the substrate. In the figure, 1 is a dual in-line type semiconductor element body, 3.4. 5. Reference numeral 6 designates a conductive part array, 51.degree. 61 a conductive part, 52.53 and 62.63 pin insertion holes, 7 a substrate, and 11 a terminal. Note that the same reference numerals indicate the same or equivalent parts.

Claims

[Claims for Utility Model Registration] 1. In a board on which a dual-in-line type semiconductor element is mounted, a plurality of conductive parts arranged linearly at predetermined intervals corresponding to one row of pins of the semiconductor element are provided. A second conductive part row consisting of a plurality of conductive parts linearly arranged at predetermined intervals is provided corresponding to the first conductive part row and the other pin row of the semiconductor element, and each conductive part row of the conductive part row is At least two pin insertion holes spaced apart by a predetermined dimension in the direction of the opposing rows of conductive parts are arranged in the part so that the corresponding pin insertion holes of each conductive part are located on a straight line, and the first The distance between the pin insertion holes formed in each conductive part of the second conductive part row is different from the distance between the pin insertion holes formed in each conductive part of the second conductive part row. A substrate for mounting semiconductor elements. 2 Utility model registration claim 1 characterized in that each conductive part of both conductive part rows is provided with two pin insertion holes, respectively.
A substrate for mounting a semiconductor element as described in 1.