JPS5877057U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS5877057U JPS5877057U JP17103681U JP17103681U JPS5877057U JP S5877057 U JPS5877057 U JP S5877057U JP 17103681 U JP17103681 U JP 17103681U JP 17103681 U JP17103681 U JP 17103681U JP S5877057 U JPS5877057 U JP S5877057U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead wire
- external lead
- frame
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａは従来の樹脂封止形半導体装置の一例を示す平
面図、第１図Ｂは第１図ＡのＩＢ−ＩＢ線での断面図、
第２図はこの考案の一実施例の樹脂封止形半導体装置を
示す平面図である。
図において、１は半導体チップ、２はダイパッド部、３
はダイパッド支持用外部リード線、４は電極引出し用外
部リード線、５は内部リード線、６は封止用樹脂である
。なお、図中同一符号はそれぞれ同一もしくは相当部分
を示す。FIG. 1A is a plan view showing an example of a conventional resin-sealed semiconductor device, FIG. 1B is a sectional view taken along line IB-IB in FIG. 1A,
FIG. 2 is a plan view showing a resin-sealed semiconductor device according to an embodiment of this invention. In the figure, 1 is a semiconductor chip, 2 is a die pad part, and 3 is a semiconductor chip.
4 is an external lead wire for supporting the die pad, 4 is an external lead wire for leading out electrodes, 5 is an internal lead wire, and 6 is a sealing resin. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
ら上記ダイパッド部の近傍まで伸びるように設けられた
電極引出し用外部リード線と、上記ダイパッド部の周縁
端面から伸びて上記ダイパッド部を上記フレーム部分に
支持させるように設けられ上記電極引出し用外部リード
線の断面形状と同一の断面形状を有するダイパッド支持
用外部リード線とを備えたリードフレームの上記ダイパ
ッド部に半導体チップを装着し、上記電極引出し用外部
リード線とこれに対応する上記半導体チップの電極とを
内部リード線で接続し、上記半導体チップ、上記ダイパ
ッド部、上記電極引出し用外部リード線の所要部分、上
記ダイパッド支持用外部リード線の所要部分および上記
内部リード線を封止用樹脂で封止したのち、上記リード
フレームの上記フレーム部分を除去してなるものにおい
て、上記ダイパッド支持用外部リード線を上記ダイパッ
ドの周縁端面部の複数箇所にそれぞれ複数本配設したこ
とを特徴とする樹脂封止形半導体装置。a frame portion, a die pad portion, an external lead wire for drawing out an electrode provided so as to extend from the frame portion to the vicinity of the die pad portion, and an external lead wire extending from the peripheral end surface of the die pad portion to support the die pad portion on the frame portion. A semiconductor chip is mounted on the die pad portion of a lead frame, which is provided with an external lead wire for supporting a die pad and has the same cross-sectional shape as the external lead wire for leading out the electrode. A lead wire and a corresponding electrode of the semiconductor chip are connected by an internal lead wire, and the semiconductor chip, the die pad portion, a required portion of the external lead wire for leading out the electrode, and a required portion of the external lead wire for supporting the die pad are connected. and a device obtained by sealing the internal lead wires with a sealing resin and then removing the frame portion of the lead frame, wherein the die pad supporting external lead wires are placed at multiple locations on the peripheral end surface of the die pad, respectively. A resin-sealed semiconductor device characterized in that a plurality of semiconductor devices are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17103681U JPS5877057U (en) | 1981-11-16 | 1981-11-16 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17103681U JPS5877057U (en) | 1981-11-16 | 1981-11-16 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5877057U true JPS5877057U (en) | 1983-05-24 |
Family
ID=29962976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17103681U Pending JPS5877057U (en) | 1981-11-16 | 1981-11-16 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877057U (en) |
-
1981
- 1981-11-16 JP JP17103681U patent/JPS5877057U/en active Pending
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