JPS5869937U - membrane circuit device - Google Patents

membrane circuit device

Info

Publication number
JPS5869937U
JPS5869937U JP16523981U JP16523981U JPS5869937U JP S5869937 U JPS5869937 U JP S5869937U JP 16523981 U JP16523981 U JP 16523981U JP 16523981 U JP16523981 U JP 16523981U JP S5869937 U JPS5869937 U JP S5869937U
Authority
JP
Japan
Prior art keywords
lead wire
circuit device
wiring conductor
membrane circuit
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16523981U
Other languages
Japanese (ja)
Inventor
浩 横山
木船　深志
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP16523981U priority Critical patent/JPS5869937U/en
Publication of JPS5869937U publication Critical patent/JPS5869937U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図はそれぞれ膜回路装置の従来例の要部を
示す断面図、第３図は本考案の一実施例を示す断面図で
ある。 ３・・・・・・銅箔、５・・・・・・リード線、７・・
・・・・中間層、８・・・・・・表面層。FIGS. 1 and 2 are sectional views showing essential parts of a conventional example of a membrane circuit device, and FIG. 3 is a sectional view showing an embodiment of the present invention. 3... Copper foil, 5... Lead wire, 7...
...Middle layer, 8...Surface layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に絶縁して設けられた配線導体に接続された回路
素子が前記配線導体の他の部位とリード線により接続さ
れるものにおいて、配線導体の少な（ともリード線が接
続される部位の上にリード線と超音波ボンディング可能
の金属からなる層が該金属より大きな音響インピーダン
スを有する金属からなる層を介して被着することを特徴
とする膜回路装置。When a circuit element connected to a wiring conductor provided insulated on a board is connected to other parts of the wiring conductor by a lead wire, there is a small amount of wiring conductor (both above the part to which the lead wire is connected). A membrane circuit device characterized in that a layer made of a metal capable of being ultrasonically bonded to a lead wire is adhered to the lead wire via a layer made of a metal having a higher acoustic impedance than the metal.
JP16523981U 1981-11-05 1981-11-05 membrane circuit device Pending JPS5869937U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16523981U JPS5869937U (en) 1981-11-05 1981-11-05 membrane circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16523981U JPS5869937U (en) 1981-11-05 1981-11-05 membrane circuit device

Publications (1)

Publication Number Publication Date
JPS5869937U true JPS5869937U (en) 1983-05-12

Family

ID=29957445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16523981U Pending JPS5869937U (en) 1981-11-05 1981-11-05 membrane circuit device

Country Status (1)

Country Link
JP (1) JPS5869937U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134933A (en) * 1979-04-10 1980-10-21 Chiyou Lsi Gijutsu Kenkyu Kumiai Preparaion of aperture for electron beam exposing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134933A (en) * 1979-04-10 1980-10-21 Chiyou Lsi Gijutsu Kenkyu Kumiai Preparaion of aperture for electron beam exposing device

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