JPS5868956A - Resin composition for semiconductor sealing - Google Patents

Abstract

PURPOSE:To obtain an excellent contacting and adhesive properties, a low elastic coefficient and a low modulus of elasticity for the titled resin composition by a method wherein the resin composition, consisting of a polyfunctional epoxy compound, a hardening agent for epoxy resin and a chelating agent containing hydroxyl group and the like in a molecule, is used. CONSTITUTION:As the resin for semiconductor sealing, the resin composition consisting of a polyfunctional epoxy compound, a well-known hardening agent for epoxy resin consisted of phenol resin or formaldehyde resin, and the chelating agent containing at least one of a hydrocyl group, a phenylazo group and a Schiff group, is used. Using the resin of this composition, the contacting and adhesive properties can be improved, and the hardened material thus obtained has an excellent characteristics in low elastic coefficient, low expansion coefficient, heat-resisting property of high vitrification transition point and flexibility.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention has excellent adhesion and adhesion to semiconductor elements, and the cured product has low elastic modulus, low expansion coefficient, high glass transition temperature, heat resistance, and flexibility. The present invention relates to a resin composition for semiconductor encapsulation.

In recent years, in the field of electronic components, as the size and weight of electronic components have been reduced and reliability has increased, the trend has been to increase the size of semiconductor element pellets and to increase their functionality by combining active elements and passive elements.

Therefore, as a sealing material for various semiconductor devices, it is recommended to improve the adhesion and adhesion to metal inserts (including At electrodes, lead wires, frames, etc.), and to prevent penetration from the interface between the sealing material and the device. Many attempts are being made to minimize the occurrence of water damage and corrosion of metals (aluminum electrodes, lead wires, etc.).

Further, there is a strong demand for the sealing material to have a property that the influence of stress on the insert is small even when it is immediately molded into a semiconductor element.

Conventionally, epoxy-based, silicone-based, phenol-based, diallyl-based materials, and the like have been used as semiconductor encapsulation materials. , among them, Pheno.

An epoxy resin composition whose curing agent is a phenol novolasic resin obtained by condensing alcohol and formaldehyde under an acidic catalyst has relatively excellent adhesion and adhesion to inserts, and is suitable for semiconductor encapsulation. It has become the mainstream of stopper resins.

However, this type of resin composition does not have sufficient adhesion or adhesion to metal inserts, and problems such as corrosion and breakage of aluminum electrodes are observed due to moisture entering the interface between the two. In addition, if the resin composition is directly molded onto the element pellet without applying a flexible protective coat, the element pellet may crack or the bonding wire may be cut, resulting in damage to the sealing resin insert. Failures caused by stress are also observed.

As a countermeasure against this problem, it is important to improve the adhesion and adhesion of the sealing resin to the insert (cord pellet, pondage wire, frame, etc.) and to reduce the stress on the insert.

From this point of view, it has excellent adhesion and adhesion to metals such as gold, aluminum, silver, nickel, and cobalt, and has excellent mold releasability to metals such as iron, chromium, and manganese, which are the materials of molds. It shows good, selective adhesion depending on the type of metal, and the cured product has a low elastic modulus.
The development of soil-compatible resin compositions with low expansion coefficients and high glass transition points improves the adhesion and adhesion of sealing resins, and as a means of lowering the modulus of elasticity, the use of flexibilizing agents. -tf=7J
11 are possible. However, with this method, it is difficult to achieve a balance between improving adhesion and adhesion with the metal insert (frame) and mold release, and the glass transition point of the cured product decreases, resulting in poor reliability. The problem was that it was difficult to obtain a molded product with a high value.

This temple was built in view of the above-mentioned situation.
The object is to provide a resin composition for semiconductor encapsulation that has excellent adhesion and adhesion to inserts, a low elastic modulus, a low coefficient of linear expansion, and a high glass transition point.

The main points of the present invention are as follows: (1) A polyfunctional epoxy compound [A], a known curing agent for epoxy resin (Bl, and a chelate containing at least one hydroxyl group, phenylazo group, or Schiff group in the molecule) and (2) a resin composition for semiconductor encapsulation, in which the known curing agent 'CB' for epoxy resin is a phenol-formaldehyde resin.

It is in.

In the present invention, examples of the polyfunctional epoxy compound [A] include diglycidyl ether of bisphenol A, butadiene diepoxide, 3,4-epoxycyclohexylmethyl-(3,4-epoxy)cyclohexane carboxylate, vinylcyclohexane dioxide, 4
．． 4'-di(1,2-epoxyethyl)diphenyl ether, 4.4'-(1,2-epoxyethyl)biphenyl, 2.2-bis(3,3-epoxycyclohexyl)propane, glycidyl ether of resorcinol , diglycidyl ether of phloroglucin, diglycidyl ether of methyl 70roglucin, bis-(2,3-epoxycyclobentyl) ether, 2-(3,4-epoxy)
Cyclobexane-5,5-spiro(3,4-epoxy)
-cyclohexane-m-dioxane, bis-(,3,4
-epoxy-6-methylcyclohexyl)adipate,
N,N'-m-7enylenebis(4,5-epoxy-1
, 2-cyclohexane) dicarboximide, triglycidyl ether of baraminophenol, polyallyl glycidyl ether, 1'
, 3.5-)su(1,2-epoxyethyl) verizeli,
2.2',4.4'-cheetraglycidoxybenzophenone 0. Tri- or higher functional epoxy compounds such as polyglycidyl ether of phenol formaldehyde novolak, triglycidyl ether of glycerin, and triglycidyl ether of trimethylolpropane are used.

The above compounds can also be used in combination of one or more types depending on the use and purpose.

Next, in the present invention, a known curing agent for epoxy resin [
B], written by Hiroshi Kakiuchi: Epokino Resin, published September 1970, pages 109-149, written by l, ee, Neville: Epoxy)j, eS ins: MCQra
w -Hi J 113ook Company,
Inc., New York, 1957 Published 63
~Page 141 h Written by BruInst PtE:
Epoxylljesins technology
: Jnterscience publi-5her
s: New York Published in 196'8, 45~
Compounds described on page 111, for example, aliphatic polyamines, aromatic polyamines, second and 37ε
amines, carboxylic acids, carboxylic acid anhydrides, aliphatic and aromatic polyamide oligomers and polymers, polysulfide resins.

Synthetic resin initial condensates such as boron trifluoride-amine complexes, phenol resins, melamine resins, urea resins, and urethane resins, as well as dianediamides, carboxylic acid hydrazides, and polyamide resins, etc. One or more of the above curing agents can be used in combination depending on the use and purpose.

Further, in the present invention, the chelating agent [C] containing a hydroxyl group and at least one of a phenylazo group and a thick group in the molecule may be, for example, a hydroxyaldehyde compound [when the above formula X has nothing, CH'2-9SO2'
.

-o- or -co-. )] with primary amines (intermediate, Hp
(including repolymer). Examples of these include: or, etc. One or more of these can be used in combination.

The object of the present invention can be achieved by adding the chelating agent [C] in an amount of 50 parts by weight or less based on 100 parts by weight of the epoxy compound [A3].

In addition, in the present invention, various catalysts can be added for the purpose of promoting the curing reaction of the sealing resin composition,
Examples of the catalyst include tertiary amines such as triethanolamine, tetramethylbutanediamine, tetramethylpentanethiabane, tetramethylhexanediamine, triethylenediamine and dimethylaniline, and oxidative amines such as dimethylamineethanol and dimethylaminopentanol. Alkylamines and amines such as tris(dimethylaminomethyl)phenol and methylmofoline can be applied.

For the same purpose, catalysts such as cetyltrimethylammonium bromide, cetyltrimethylammonium chloride, dodecyltrimethylammonium iodide, trimethyldodecylammonium chloride, benzyldimethyltetradecylammonium chloride, penzylmethylpalmitylammonium chloride, allyldotecyl Quaternary ammonium salts such as trimethylammonium bromite, 1-benzyldimethylstearylammonium bromide, stearyltrimethylammonium chloride and benzyldimethyltetradecylammonium acetate can be applied, as well as 2-undecylimidazole, 2-methyl Imidazole, 2-ethylimidazole, 2-heptadecyl imidazole, 2-methyl-4-ethylimidazole, 1-
Butylimidazole, 1-propyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 1-
Cyanethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole.

Imidazole compounds such as 1-cyanoethyl-2-phenylimitasol, ■-azine-2-methylimidazole and l-azine-2-undecylimidazole, or t7h,) liphenylphosph/intetraphenylborate, triethylaminetetraphenylborate , N-methylmorpholine tetraphenylborate, pyridine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, and 2-ethyl-1°4-dimethylimidazole tetraphenylborate, and other tetraphenylboron salts are useful. .

Two or more of the above catalysts can be used in combination.

The amount of the catalyst added is not particularly limited, but it is sufficient to use it within a range of 10% by weight or less.

Furthermore, the resin composition of the present invention has the following properties depending on its use:
For example, zircon, silica, alumina, aluminum hydroxide, titania, zinc white,
Inorganic fillers such as calcium carbonate, magnesite, clay, kaolin, Merck, silica sand, glass, fused silica glass, asbestos, mica, various whiskers, carbon black, graphite, molybdenum disulfide, etc., release materials such as higher fatty acids and waxes. At least one type of coupling agent such as a molding agent, epoxy silane, vinyl silane, poran or alkoxy titanate compound may be added, and if necessary, a halogen-containing compound, acymonium oxide, phosphorus compound, etc. Flame retardant agents can be used for cicadas.

The above components can be blended by heating and kneading using a roll, niegu, coneater, Henschel mixer, or the like. Furthermore, if all the components are solid, a tri-blend method may be adopted in which the components are pulverized and then mixed.

Example 1 Hereinafter, the present invention will be specifically explained with reference to examples.
~11 As polyfunctional epoxy compounds, ECN1273 (epoxy equivalent: 225, manufactured by Chibe), EpIool (manufactured by Shell,
Two types of epoxy equivalent (475), novolak type phenolic resin HP607N (manufactured by Hitachi Chemical) as a curing agent
, maleic anhydride/4,4'-diaminodiphenylmethane melt reaction product, tetrahydro-7talic anhydride,
As the chelating agent, CI listed in Table 1], [II]
, [I[I:], triethylamine tetraphenylborate as a curing accelerator, epoxysilane KBM403 (manufactured by Shin-Etsu Chemical) as a coupling agent,
Fused silica glass powder was used as a filler, and various release agents and colorants were mixed in the predetermined amounts shown in Table 1.

Next, the formulation containing the above ingredients was added to 70-80%
After kneading for 10 minutes with a hot roll of C, the mixture was coarsely ground to obtain the desired resin composition for semiconductor encapsulation.

These compositions were converted into xsoC, 7oK9/(7)2.2
Transfer molding was carried out under the conditions of 10 minutes to prepare specimens having the characteristics listed in Table 1.゛

Claims (1)

[Claims] 1. A polyfunctional epoxy compound [A], a known curing agent for epoxy resins (BE, and a chelating agent [C] containing at least one of a hydroxyl group, a phenylazo group, and a Schiff group in the molecule) ] A resin composition for semiconductor encapsulation characterized by comprising: 2. Scope No. 1 of the patent, characterized in that the known curing agent for epoxy resin [B] is a phenol resin or a formaldehyde resin. The resin composition for semiconductor encapsulation as described in 2.