JPS5868934A - Etching of multilayer film - Google Patents

Etching of multilayer film

Info

Publication number
JPS5868934A
JPS5868934A JP16735881A JP16735881A JPS5868934A JP S5868934 A JPS5868934 A JP S5868934A JP 16735881 A JP16735881 A JP 16735881A JP 16735881 A JP16735881 A JP 16735881A JP S5868934 A JPS5868934 A JP S5868934A
Authority
JP
Japan
Prior art keywords
etching
multilayer film
layer
film
metal thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16735881A
Other languages
Japanese (ja)
Inventor
Takao Yamano
山野　孝雄
Masaru Doi
勝 土井
Yoshiaki Shimizu
良昭 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP16735881A priority Critical patent/JPS5868934A/en
Publication of JPS5868934A publication Critical patent/JPS5868934A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Abstract

PURPOSE:To enable to confirm visually completion of etching at respective layers when a multilayer film is to be etched by a method wherein metal thin films having the different colors are interposed between the respective layers of the multilayer film to be formed in a pattern by etching. CONSTITUTION:A multilayer film of chrome 2, 6, 10 and permalloy 4, 8 is formed on a substrate 1, and a pattern of resist 11 is formed on the multilayer film thereof according to the photoetching technique. Moreover between the respective layers of chrome and permalloy constituting the multilayer, metal thin films consisting of gold 3, 7 and copper 5, 9 having the different colors from the layers thereof are interposed. Accordingly by constituting the film by this way, when the respective layers are to be etched, because the metal thin film parts having the different colors are exposed on the surface of etching part, completion of etching can be confirmed visually.

Description

【発明の詳細な説明】 この発明は、エツチングによる多層膜のノくターン形成
に際し、多層膜の各層間に異色の金属薄膜を介在して視
覚的に各層のエツチング終点制御を行ない、精度良く所
望のパターンを得ることができるようにした多層膜エツ
チング方法に関する。DETAILED DESCRIPTION OF THE INVENTION When forming a notch in a multilayer film by etching, the etching end point of each layer is visually controlled by interposing a metal thin film of a different color between each layer of the multilayer film, thereby achieving a desired desired result with high accuracy. The present invention relates to a multilayer film etching method that allows a pattern to be obtained.

一般に、金属多層膜においては、ケミカル・エツチング
により、パターンを形成する場合、多層膜を構成するす
べての金属を同一速度で浸食するエッチャントへ用いる
ことが理想的である。しかし、そのようなエラチャン：
！−を見つけ出すことはほぼ不可能であるといってよく
、このため、実７を的には、一層ずつ違ったエッチャン
トでパターンを形成すること＆Ｃなる。この場合、間呟
となるのは、はとんどの金属が銀白色であるため、一層
ごとのエツチング終了を確認できない点である。また、
ドライエツチングでは、真空槽中の気体成分を発光等を
用いて調べることに□よっである種の金属の終点制御は
可能であるが、ウェットエツチングでは、終点制御はほ
ぼ不可能であり、時間制御という不安定要素を含んだ方
法を採らざるを得ない欠点がある。Generally, when forming a pattern in a metal multilayer film by chemical etching, it is ideal to use an etchant that erodes all metals constituting the multilayer film at the same rate. But Ella Chan like that:
! It can be said that it is almost impossible to find -. Therefore, the aim of the actual method is to form a pattern using a different etchant for each layer. In this case, the problem is that most of the metal is silvery white, so it is impossible to confirm the completion of etching for each layer. Also,
In dry etching, it is possible to control the end point of certain metals by examining the gas components in the vacuum chamber using luminescence, etc., but in wet etching, it is almost impossible to control the end point, and it is not possible to control the end point with time control. This method has the disadvantage of having to adopt a method that includes an unstable element.

た、とえば、薄膜磁気ヘッドの磁性層、たとえばパーマ
ロイでは、膜厚が３声程度と厚くなるため、付着強腿に
問題ＩＪ）あり、また、感慨特性の問題からもチタン゛
ｒｉ、クロムＣｒ等による接Ｎ層を挾み込んだ多層膜ｉ
す、。おが望よ、い。。カニＬ、１−１゜Ｃｒとパーマ
ロイとはともに銀白色であるため、視覚によるエツチン
グの終点制御ができず、エツチングが過度になりがちで
あり、オーバーエッチが極めて大きくなる欠点がある。For example, in the magnetic layer of a thin film magnetic head, such as permalloy, the film thickness is as thick as 3 tones, so there is a problem with adhesion.Also, due to the problem of emotional characteristics, titanium, chromium, Cr, etc. A multilayer film i sandwiching a contact N layer by et al.
vinegar,. I wish you good luck. . Since Crab L, 1-1°Cr and permalloy are both silvery white, the end point of etching cannot be controlled visually, and etching tends to be excessive, resulting in extremely large overetching.

この発明は、前記の点に留首し、多層膜の多層間にＡｕ
　、　Ｃｕ等一般的な金属と色の異なる金属薄膜を介在
させ、視覚的に多層膜の洛層のエツチングの終点制御を
行なうようにしたものであり、つぎｌにの発明を、その
実施例の薄膜磁気ヘッドの磁性層を示した図面とともに
詳細に説明する。This invention is based on the above points, and the present invention is based on the above-mentioned points.
, a metal thin film having a different color from a general metal such as Cu is interposed to visually control the end point of etching of the top layer of a multilayer film. A detailed explanation will be given with reference to a drawing showing a magnetic layer of a thin film magnetic head.

まず、ｌ実施例を示した第１図１Ｃついて説明する。First, FIG. 1C showing an embodiment will be described.

磁性層の多層膜は、＄１図に示すように、蒸着。The multilayer film of the magnetic layer is deposited as shown in Figure $1.

スパッタリング等の既成薄膜作成技術により得られたも
のであり、基板（１）上に、クロムＣｒ　（２１［ＩＫ
久］。It was obtained by existing thin film production technology such as sputtering, and chromium Cr (21[IK
Ku].

金Ａｕ　＋３１　［１００〜２００Ａ：１．パーマロイ
＋４１　Ｃ１５ＫＡ］　、銅（５１［１００〜２００　
Ａ　］、クロムＣｒ　ｌ’６＋　［５００Ａｌ　、金Ａ
ｕ　（７＋、［−１００つぎに、この多層膜の上に写真
蝕刻技術によりしはそれぞれの膜厚を示し、また、金、
Ａｕ　Ｉ３１．　Ｉ７１　、　　矩１ｃｕ　＋５１　、
　ｊ９１がそれぞれクロムＣｒ　（２１，＋６１．１１
０１　、バーマロ（’＋４１．　＋８１の各層と異なビ
色の介在金属薄膜である。Gold Au +31 [100-200A:1. permalloy +41 C15KA], copper (51 [100-200
A], Chromium Cr l'6+ [500Al, Gold A
u (7+, [-100) Next, the respective film thicknesses are shown by photolithography on this multilayer film, and gold,
Au I31. I71, rectangle 1cu +51,
j91 is chromium Cr (21, +61.11
01, Barmaro ('+41. This is an intervening metal thin film with a blue color different from each layer of +81.

そして、前記多層膜のパターン形成におけるエツチング
工程はつぎの順序で行なう。The etching process for patterning the multilayer film is performed in the following order.

（＋１第９層のクロムＣｒ　ｎｏ＋をＫＯＨ−に３Ｆｅ
　（ＣＮ）６混合浴液でエツチングし、エツチング部分
の表面に第８層の銅Ｃｕ　＋ｇ＋が露出した時点で当該
エツチング終了を確認する。当該エツチング終了が第１
図番ご示す状態で゛ある。(+1 9th layer chromium Cr no+ to KOH- 3Fe
Etching is performed using a (CN)6 mixed bath solution, and completion of the etching is confirmed when the eighth layer of copper Cu+g+ is exposed on the surface of the etched portion. The first step is to finish the etching.
It is in the condition shown in the drawing.

（１１）　　第８層の銅Ｃｕ　１９１および第７層のパ
ーマロイ（８）をＨＣノーＦｅ　Ｃノ３混合溶液でエツ
チングし、第６層の金Ａｕ　１７１の露出を確認してエ
ツチングを終了する。(11) Etch the eighth layer of copper (Cu) 191 and the seventh layer of permalloy (8) with a mixed solution of HC, Fe, C, and 3. After confirming that the sixth layer of gold (Au) 171 is exposed, the etching is completed.

（ｉｉｉｌ　　第６層の金Ａｕ　１７＋をヨードとヨウ
化アンモニウムとの混合溶液でエツチングし、第５層の
クロムＣｒ　＋ｅ＋の露出を確認してエツチングを終了
する。(iii) Etch the 6th layer of gold (Au 17+) with a mixed solution of iodine and ammonium iodide, confirm that the 5th layer of chromium (Cr +e+) is exposed, and complete the etching.

以下、（１）、叩＋’　（ｉｉＤと同様の要領で、第５
層のりｏ　Ｌ　Ｃｒ　Ｉ６１　、第４層の銅Ｃｕ　＋５
１　、第３層のパーマロイ１４１および第２層の金Ａｕ
　１３１を順番ごエツチングし、つぎ゛のｍ　ｌ　ＩＩ
のクロムＣｒ　（２）のエツチングにおいて、エツチン
グ部分に基板（１）の露出を確認することにより、当該
エツチングを終了し、これにより、エツチング、による
パターン形成が終了する。Below, (1), hit+' (in the same way as iiD, the fifth
Layer paste o L Cr I61, 4th layer copper Cu +5
1. Permalloy 141 in the third layer and gold Au in the second layer
131 in order, and the next m l II
In the etching of chromium Cr (2), the etching is completed by confirming that the substrate (1) is exposed in the etched portion, thereby completing the pattern formation by etching.

／ ところで、磁性層の多層膜を構成するクロムＣｒ。/ By the way, chromium Cr constitutes the multilayer film of the magnetic layer.

パーマロイの各層間に該各層と異なる色の金Ａｕ。Gold Au of a different color from each layer is placed between each layer of permalloy.

銅Ｃｕの金属薄膜を介在しない従来のエツチング方法で
は、エツチング部分にクロムＣｒと同色ノパーマロイが
露出し、エツチング終了を確認することができなかった
が、前記実施例によると、クロムＣｒ　ｎｏ＋　、　＋
６１のエツチング時、そのエツチング部分の表面に銅Ｃ
ｕ　１９１　、　＋５１が露出し、視覚的に当該エツチ
ング終了を確認することができるものであり、さらに、
銅Ｃｕ　４９１’、　＋５１　、パーマロイ（８１、−
１４１のエツチングにおいては、エツチング部分に金Ａ
ｕ　＋７１．　ｌｉｔが露出することによりエツチング
が終了を確認することがで門、エツチングが過度になる
ことを防止し、クロムＣｒ　（２）、　＋６１．　＋１
０１とパーマロイ＋４１．＋８１との多層膜をウェット
エツチングにより精度よくパターン化できφものである
。In the conventional etching method that does not involve a metal thin film of copper Cu, nopermalloy of the same color as chromium Cr is exposed in the etched part, and it is not possible to confirm the completion of etching. However, according to the above example, chromium Cr no+ , +
When etching 61, copper C is added to the surface of the etched part.
U 191 and +51 are exposed so that it is possible to visually confirm the completion of the etching, and further,
Copper Cu 491', +51, permalloy (81, -
In the etching of 141, gold A is applied to the etched part.
u +71. Excessive etching can be prevented by confirming the completion of etching by exposing the lit, Cr (2), +61. +1
01 and permalloy +41. A multilayer film of +81 mm can be patterned with high precision by wet etching.

なお、前記実施例において、接着層となる各りＯＡ　Ｃ
ｒ　（２１，１６１，’　１０１を省き、；パーマロイ
＋４１．＋８１の介在層として金Ａｕ、銅Ｃｕのみを用
いることも可能である。In addition, in the above embodiments, each OAC serving as an adhesive layer
r (21,161,' It is also possible to omit 101 and use only gold Au and copper Cu as the intervening layer of permalloy +41.+81.

つぎに、他の実施例を承した第２図以下の図面について
説明する。Next, the drawings from FIG. 2 onwards, which show other embodiments, will be explained.

第１図に示した磁性層において、クロムＣｒ　ｆ２）。In the magnetic layer shown in FIG. 1, chromium Cr f2).

１６１　、１１０１の有無にかかわらず、金Ａｕ　＋３
１’、　＋７１　、銅Ｃｕｆｉ＋、＋９１の介在により
磁性層の付着強度が低下する危険があるが、この場合に
は、第２゛図に承すように、基板（１）上のパターン部
分（１２１を被うメタルマスクＨ−８用い、基板（１１
への多層膜作成時、パターン部分Ｑ’ｂをメタルマスク
（１３１で被いながら、金Ａｕ　（３１゜（７：、銅Ｃ
ｕ　（５１、（９１の各金属薄膜をそれぞれ不要部分、
すなわち要浸食部分圓に形成し、第３図にホすように、
クロムｃｒ’　（２）、　＋６１　、′ｔｌｏｌとパー
７０イ（４）。Gold Au +3 with or without 161, 1101
1', +71, copper Cufi+, +91, there is a risk that the adhesion strength of the magnetic layer will be reduced, but in this case, as shown in Figure 2, the pattern portion (121 Using metal mask H-8 to cover the substrate (11
When creating a multilayer film for
u (51, (91) each unnecessary part of each metal thin film,
In other words, it is formed in the area that requires erosion, as shown in Figure 3.
Chrome cr' (2), +61, 'tlol and par 70 i (4).

（８）との多層膜のパターン部分（Ｉ２）以外の要浸食
部分（１４）の各層間に金属薄膜を介在する。(8) A thin metal film is interposed between each layer of the corrosion-required portion (14) other than the pattern portion (I2) of the multilayer film.

そして、前記多層膜の上にレジストパターンを形成し、
前述と同様のエツチング工程において、各エツチングの
終了を安浸食部分（１４）の色を見ることによって確認
し、霞ツチングの終Ａ−１１ｊ御を行なうことにより、
金Ａｕ、銅Ｃｕの金属薄膜を介在しない付着強度の大き
い磁性層のパターンを形成できるものである。Then, forming a resist pattern on the multilayer film,
In the same etching process as described above, the completion of each etching is confirmed by looking at the color of the lightly eroded part (14), and by performing the end of haze etching A-11j,
It is possible to form a pattern of a magnetic layer with high adhesion strength without interposing a metal thin film of gold (Au) or copper (Cu).

なお、一般的な多層膜においても、機能的に金Ａｕ　、
　＠ｌ１ｌＣｕ等の金属薄膜を介在させることのできな
い場合があるが、この場合も前記と同様に、多層膜のパ
ターン品分以外の要浸食部分の各層間に金属薄膜を介在
すればよい。In addition, even in general multilayer films, functionally gold, Au,
There are cases where it is not possible to interpose a metal thin film such as @l1lCu, but in this case as well, it is sufficient to interpose a metal thin film between each layer of the erosion required portions other than the patterned parts of the multilayer film.

以上のように、この発明の多層膜エツチング方法による
と、エツチングによ°リパターン形成される多□層膜の
各層間番こ、該各層と異なる色を有する金属薄膜を介在
することにより、視覚的に多層膜の各層のエツチング終
了を確認することができ、過度のエツチングを防止し、
所望のパターンを精度よく得ることができるものであ゛
る。As described above, according to the multilayer film etching method of the present invention, each layer number of the multilayer film to be repatterned by etching is visually improved by interposing a metal thin film having a color different from that of each layer. It is possible to visually confirm the completion of etching of each layer of a multilayer film, prevent excessive etching,
A desired pattern can be obtained with high precision.

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの発明の多層膜エツチング方法の実施例の薄膜
磁気ヘッドの磁性層をそれぞれボし、第１図はｌ実施例
の断面図、第２図以下の図面は他の実施例を示し、第２
図は分解斜視図１、＄３図は断面図である。 （２１、ｔｅｌ　、　１０１　・＝クロムＣｒ、　、　
＋３１　、　＋７１　・・・金Ａｕ、　１４１　、　＋
８１・・・パーマロイ、＋５１　、　＋９１−銅Ｃ’ｕ
、　（１２１−パターン部分、（１３）・・・メタルマ
スク、０４）・・・要浸食品分。 代理人　弁理士　藤　１）龍　太　部 系１図 第３図 第２図 ３The drawings show the magnetic layers of a thin-film magnetic head according to an embodiment of the multilayer film etching method of the present invention. FIG. 1 is a sectional view of the first embodiment, FIG. 2
The figure is an exploded perspective view 1, and the figure $3 is a sectional view. (21, tel, 101 ・=Chromium Cr, ,
+31, +71 ... Gold Au, 141, +
81... permalloy, +51, +91-copper C'u
, (121-pattern part, (13)...metal mask, 04)...part requiring immersion. Agent Patent Attorney Fuji 1) Ryu Taibe Kei 1 Figure 3 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】 ■　エツチングによりパターン形成される多層膜の各層
間に、該各層と異なる色を有する金属薄膜を介在したこ
とを特徴とする多層膜エツチング方法。 ■　多層膜の各層間に介在される金属薄膜の形成に、多
層膜のパターン部分を被うメタルマスクを用い、パター
ン部分以外の要浸食部分の各層間に金属薄膜を介在する
ことを特徴とする特許請求の範囲第１項に記載の多層膜
エツチング方法。[Scope of Claims] (1) A multilayer film etching method characterized in that a metal thin film having a color different from each layer is interposed between each layer of the multilayer film to be patterned by etching. ■ A metal mask that covers the pattern part of the multilayer film is used to form the metal thin film interposed between each layer of the multilayer film, and the metal thin film is interposed between each layer in the parts requiring erosion other than the pattern part. A multilayer film etching method according to claim 1.
JP16735881A 1981-10-20 1981-10-20 Etching of multilayer film Pending JPS5868934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16735881A JPS5868934A (en) 1981-10-20 1981-10-20 Etching of multilayer film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16735881A JPS5868934A (en) 1981-10-20 1981-10-20 Etching of multilayer film

Publications (1)

Publication Number Publication Date
JPS5868934A true JPS5868934A (en) 1983-04-25

Family

ID=15848232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16735881A Pending JPS5868934A (en) 1981-10-20 1981-10-20 Etching of multilayer film

Country Status (1)

Country Link
JP (1) JPS5868934A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219216A (en) * 1986-03-19 1987-09-26 Hitachi Ltd Thin film magnetic head and its production
JPH01118209A (en) * 1987-10-30 1989-05-10 Matsushita Electric Ind Co Ltd Production of thin film magnetic head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219216A (en) * 1986-03-19 1987-09-26 Hitachi Ltd Thin film magnetic head and its production
JPH01118209A (en) * 1987-10-30 1989-05-10 Matsushita Electric Ind Co Ltd Production of thin film magnetic head

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