JPS5868905A - Trimming method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a trimming method.

Conventionally, for example, in order to adjust the characteristics of a circuit incorporated in a printed circuit board, a semi-fixed resistor,
A semi-fixed capacitor, Tofunne, etc. is used.
Automation of this adjustment process is extremely difficult.

10,000, Thick film circuit technology uses the sandbranuto method (in which the resistor is scraped off by dusting it with powder), the V-za method, and the V-za method. There is a method of trimming using K, such as (cutting the resistor with a laser beam). There is also a method of adjusting the circuit operating state, in which trimming is performed while the thick film C circuit is in operation to absorb the backlash of transistors, capacitors, etc. and adjust the characteristics of the IC circuit. This is called functional trimming. All trimming in thick film technology is automated, and laser trimming in particular has excellent work speed and automatic control mechanisms.

The present invention replaces the conventional IT electronic device circuit adjustment using semi-fixed resistors with film circuit elements (thick film circuit elements and thin film circuit elements are collectively referred to as thick film circuit elements in the present invention) formed on a fine substrate. The circuit adjustment of an electronic device is carried out by trimming a membrane circuit element (referred to as a membrane circuit element), and the details thereof will be explained below with reference to an embodiment shown in the drawings. In the embodiment, a thick film circuit element is taken as an example.

In the embodiment shown in FIG. 1, (1) is a printed circuit board made of epoxy or the like, +21 (3) is a circuit element connected to the copper foil pattern (4) formed on the printed circuit board (1),
(5) is an insulating substrate made of a 1T-17FI board or the like on which a thick film circuit element forming a circuit is formed together with the circuit element (2) (31, etc.) mounted on the printed circuit board (4). On the base plate (5) are printed and fired thick film resistors +6) +6) (6) and the thick film resistors +6 as shown in Figure 2.
1 (6) (6) Terminal parts (7) (7) (7)... in which conductors are printed and fired are provided at both ends of each of (6) (6), and one end is connected to the terminal part (7). )(7)...
It is a thick film resistor component (9) with a conductive bottle (81 (81...) attached to it. Also, the front part Iv waist resistance f61+61... and the terminal part (7) (
7) On the surface of the Zetsuzen substrate (5) on the side where... is provided,
+! A protective MmαO consisting of ?3 edge trees of epoxy etc. is coded so that a portion of each of the U-thick film thick film resistors (61 (6)) is exposed.

^ Then, the insulating substrate (51) on which the thick film resistors (6) (61-...
[a It is soldered to the copper foil pattern r41 of the printed board (1). In this way, the thick film resistor (61(6)(
The circuit incorporated in the printed circuit board (1) including 61 is operated, and the characteristics of the entire circuit are measured.
) (By trimming 61, the characteristics of the print can be adjusted.

Figure 3 shows other 5J! Example 1 is shown in which the insulating substrate (5) on which the thick film resistor (6) is formed is connected to the copper foil pattern (4) of the printed board (1) through the bottle.
is connected by solder. For this reason, as shown in FIG. Next, a specific example of a method for manufacturing a thick film resistor component (111) without a bottle as shown in FIG. 4 will be described with reference to FIG. 5.

The insulating substrate for thick film resistor parts @ has thin 11113 strips for cutting parallel to each other at a certain distance from both ends.
A pair of grooves G3 (hereinafter referred to as F nucfib grooves (to)) are formed, and long grooves α◆stops are formed on the grooves 113C13 at a predetermined distance [Fig. 5 (A)]. No. 1. First, use a silver-palladium conductor to connect the terminal parts (7) (7)... of the thick film resistor as shown in Figure 5 (b)).
, 阿 Groove α 滲α枦...Print to make it look bitter. Next, a silver palladium conductor was applied to the inner surface of the long tilt Q4104J by μm printing, and as shown in FIG.
Thick film resistor (61 (61 (6
1 is printed and the insulating substrate @ is fired. And #e
Divide 3m base (b) along 11103 (13) for scribe to make a thick film resistor component (see Figure 5).

In FIG. 5), the dotted portions indicate the portions to which the silver-palladium conductor is applied.

Next, another method of manufacturing a thick film resistor component that does not require the bottle shown in FIG. 4 will be described with reference to FIG. 6.

The groove 03q3 intersects approximately 1 square corner (
Figure 6 (a)]. 1. Print the terminal parts (7) (7)... of the thick film resistor using a silver-palladium conductor as shown in Figure 6).

Print thick film resistor +61+6)(6). Then, divide this along the scribe groove <13 (13) and apply silver badge ram conductor to the arrowed areas [Fig. 6 e].Finally, the whole is baked to complete the product [Fig. 6←] of.

In FIG. 6), the dotted portions indicate that silver-palladium conductors are applied.

Thick film resistor component αυ completed using the above manufacturing method
As shown in Fig. 5, the printed circuit board (1) is connected and fixed with the copper foil pattern (4) of 11 by soldering, and the printed circuit board (1) is assembled by irradiating the V-za beam from the direction of arrow B. Adjustments can be made to electronic devices.

In the above embodiment, a function trimming method using thick film resistors as thick film circuit elements has been described, but other elements that can be formed by thick film technology include capacitors and fills.

Figure 7 shows a thick film capacitor (e) with a variable capacitance, with a lower electrode (e) on the base.
is provided, and a dielectric αQ is placed on top of the lower electrode (
To) facing the upper f! Six electrodes are combined, and one insulator layer is placed on top of it. Then, for example, the lower electrode (
If the laser beam is formed into a comb shape as shown in the figure, the capacitance can be changed step by step by aiming the laser beam from the direction of arrow C and trimming by shifting the irradiation position in the direction of arrow C. . In addition, in this example, the lower part [pole α9 is made into a comb shape, but the upper part [pole aη] may be made into a comb shape, or both the lower part ti (to) and the upper part αη are made into a comb shape and one trimming is performed. There is no need to say that it is okay to do so.

FIG. 8 shows an example of a thick film coil designed to adjust the inductance in stages.
is printed in a spiral shape on an insulating substrate, the insulator (4) is sandwiched between the two, and multiple taps are inserted from predetermined positions on the conductor 09.
(211211... [this tap is also printed on the insulating substrate]) is pulled out to form one end of the thick film coil.Then, to adjust the inductance, the @ tap is (2
)... is achieved by trimming by cutting sequentially with a laser beam from the direction of the arrow.

Figure 9 shows another example of a thick film coil that can adjust the inductance in stages. A membrane coil/L/r24 is formed, and a plurality of layers drawn out from predetermined positions of the coil/L/@ are printed on an insulating substrate. Then, by performing the above-mentioned tough trimming, the inductance can be adjusted stepwise.

In this way, the present invention (1) and (2) are devised so that not only thick film resistors but also thick film capacitors and thick film coils can be trimmed. The material is formed on an insulating substrate, and then
Not only can it be used to adjust the circuit of an electronic device by attaching it to a top board and performing functional trimming, but it can also be used for 2m or 6mm thick film resistors, thick film capacitors, and thick film coils. How to form and trim them on insulating substrates is possible. Furthermore, active elements such as transistors may be mounted on the same insulating substrate along with the thick film resistor, thick film capacitor, and thick film coil. 19,
``In the embodiment of the present invention, the insulating substrate on which the thick film circuit element is formed is attached to the printed board and trimming is performed, but this is not the only reason for trimming. 1. Place the insulating substrate on which the
! ! [! You can also trim it by leaving it in place. Also, although all of the embodiments of the present invention have been explained using thick film circuit elements as an example, it is also possible to adjust the circuit of an electronic device by trimming in the same way even when #fusuma circuit elements are used. do not have.

As explained above, the trimming method of the present invention is as follows.

The circuit of the itT electronic distribution device was adjusted by trimming the mirror circuit element while operating the circuit of the electronic device incorporating the signal circuit element formed on the insulating substrate. , it is possible to automate the circuit adjustment that was previously done by humans using semi-fixed resistors, etc., improving work efficiency, and it is also very advantageous for CONUT because it eliminates the need for parts such as semi-fixed resistors. The young fruit is played.

[Brief explanation of drawings]

The drawings relate to the present invention; FIG. 1 is a side cross-sectional view showing an example of a method for mounting and trimming a thick film resistor component on a printed circuit board, and FIG. 2 is a diagram showing a thick film resistor component used therein. FIG. FIG. 5 is a side sectional view showing another embodiment of a method for mounting and trimming a thick film resistor component on a printed circuit board, and FIG. 4 is a perspective view of the thick film resistor component used therein. 5(8) is a drawing showing one embodiment of a method for manufacturing a thick film resistor component used in the shape shown in FIG. 5, and FIG. 6 is a drawing showing another manufacturing method. FIG. 7 is a partially sectional view of a thick film capacitor with variable capacitance. Figure 8 shows variable inductance #
FIG. 9 is a diagram showing one embodiment of a film coil, and is a diagram excluding another embodiment of a thick film coil whose inductance can be varied. (5)...Insulating substrate, 7 prefectures...Thick film resistor, (To)...Thick film coil ν, (E)...
・Thick film capacitor. 5:2 Figure 7 Figure 8 Figure 9; 21 Sword

Claims (1)

[Claims] (The circuit of the electronic device is adjusted while operating the circuit of the electronic device in which the i-edge substrate on which the 11 membrane circuit element is formed is assembled.) A trimming method characterized by: