JPS5863758U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS5863758U JPS5863758U JP15709781U JP15709781U JPS5863758U JP S5863758 U JPS5863758 U JP S5863758U JP 15709781 U JP15709781 U JP 15709781U JP 15709781 U JP15709781 U JP 15709781U JP S5863758 U JPS5863758 U JP S5863758U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- encapsulated semiconductor
- lead wire
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の樹脂封止型半導体装置の側面断面図、第
２図は従来の樹脂封止型半導体装置の部分を示す平面断
面図、第３図は本考案の樹脂封止型半導体装置の一実施
例を示す側面断面図、第４図は本考案の樹脂封止型半導
体装置の一実施例の部分を示す平面断面図、第５図〜第
７図はリード線と樹脂体の界面に生ずるせんｍｌ力の変
化を表わす説明図である。
２・・・金属基板、３・・・半導体ペレット、４・・・
金属細線、５・・・樹脂体、６・・・リード線。FIG. 1 is a side sectional view of a conventional resin-sealed semiconductor device, FIG. 2 is a plan sectional view showing a portion of a conventional resin-sealed semiconductor device, and FIG. 3 is a resin-sealed semiconductor device of the present invention. FIG. 4 is a plan sectional view showing a portion of an embodiment of the resin-sealed semiconductor device of the present invention, and FIGS. 5 to 7 show the interface between the lead wire and the resin body. FIG. 3 is an explanatory diagram showing changes in shearing force generated in the process. 2... Metal substrate, 3... Semiconductor pellet, 4...
Fine metal wire, 5...resin body, 6...lead wire.
Claims (1)
該半導体ペレットの電極に接続された金属性のリード線
および前記半導体ペレットと金属基板とリード線の一部
をおおうよう封止した樹脂体からなる半導体装置におい
て、前記リード線を折れ曲がった形状としたことを特徴
とする樹脂封止型半導体装置。a metal substrate; a semiconductor pellet fixed on the metal substrate;
In a semiconductor device comprising a metallic lead wire connected to an electrode of the semiconductor pellet, and a resin body sealed to cover a portion of the semiconductor pellet, the metal substrate, and the lead wire, the lead wire has a bent shape. A resin-sealed semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709781U JPS5863758U (en) | 1981-10-23 | 1981-10-23 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709781U JPS5863758U (en) | 1981-10-23 | 1981-10-23 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5863758U true JPS5863758U (en) | 1983-04-28 |
Family
ID=29949627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15709781U Pending JPS5863758U (en) | 1981-10-23 | 1981-10-23 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5863758U (en) |
-
1981
- 1981-10-23 JP JP15709781U patent/JPS5863758U/en active Pending
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