JPS5859864A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS5859864A
JPS5859864A JP56159891A JP15989181A JPS5859864A JP S5859864 A JPS5859864 A JP S5859864A JP 56159891 A JP56159891 A JP 56159891A JP 15989181 A JP15989181 A JP 15989181A JP S5859864 A JPS5859864 A JP S5859864A
Authority
JP
Japan
Prior art keywords
layer
partial glaze
substrate
melting point
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56159891A
Other languages
Japanese (ja)
Other versions
JPH0245595B2 (en
Inventor
Akihiko Kawachi
河内 明彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP56159891A priority Critical patent/JPS5859864A/en
Publication of JPS5859864A publication Critical patent/JPS5859864A/en
Publication of JPH0245595B2 publication Critical patent/JPH0245595B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE:To improve reliability and the quality of print, by a method wherein a substrate is provided with a partial glaze comprising the upper part which is made of a low fusing material and the lower part which is made of a high fusing material, and said substrate is further provided thereon a heating section comprising a thin film resistant layer and an electrode layer that supplies power to said resistant layer. CONSTITUTION:First a high fusing glass layer 25 is printed and burned. Next, a low fusing glass frit paste is printed and burned at lower temperature than the high fusing glass layer is burned. As a result, the low fusing glass layer 26 is formed without giving any damage to said high fusing glass layer 25, thereby providing a very smooth surface of the partial glaze having neither unevenness nor pin holes. Further, since the skirt part of the glaze is covered by the reasonable flow of the low fusing glass, the surface of the partial glaze is connected with the surface of the substrate with no radical distinction nor angle. Thus, accuracy of pattern and good quality of print are obtained.

Description

【発明の詳細な説明】 本発明は、上方部が低融点材質、下方部が高触点材質よ
りなる部分グレーズi11を備えたサーマルヘッドに関
する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head including a partial glaze i11 whose upper part is made of a low melting point material and whose lower part is made of a high contact point material.

本発明の目的は、信頼性の高いサーマルヘッドを提供す
ることにある。
An object of the present invention is to provide a highly reliable thermal head.

本発明の他の目的は、印字品質がよく、明瞭な印字の行
なえるサーマルヘッドを提供することにある。
Another object of the present invention is to provide a thermal head that can print clearly and with good print quality.

本発明の更に他の目的は、低電力で印字の可能なサーマ
ルヘッドを提供することにある。
Still another object of the present invention is to provide a thermal head capable of printing with low power.

サーマルプリント方式は、発熱抵抗体にパルス状電流を
流すことにより発生するジュール熱を感熱記鑓紙に伝達
して発色記録を行なうか、感熱リボンのインクを熱によ
り紙に転写記録を行なうものである。
Thermal printing is a method in which Joule heat generated by passing a pulsed current through a heating resistor is transferred to thermal recording paper to create color recording, or ink from a thermal ribbon is transferred to paper using heat. be.

サーマルプリント方式は、機構が単純でかつ信頼性が高
く、シかも低コスト化が可能であり、騒音も少ないなど
の多くの利点から、大型ラインプリンターから超小型軽
量プリンターまで広範な分野への応用がなされており、
ファクシミリ用’tUじめトじてパーソナルコンピュー
ター周辺など、情報処理分野に欠かせないものとなりつ
つある。
The thermal printing method has many advantages such as a simple mechanism, high reliability, low cost, and low noise, so it can be applied to a wide range of fields from large line printers to ultra-compact and lightweight printers. has been done,
It is becoming indispensable in the information processing field, including facsimile machines and personal computer peripherals.

感PA記録紙も各種考案されており、多色記録。Various types of PA recording paper have been devised, allowing multicolor recording.

同時複写記録2階調記録等画像記録方式としても有望視
されている。特に感熱転写方式は、従来サーマルプリン
ト方式の難点と石れていた保存性も解決し、印字品質も
明瞭で、今後の展開が期待されている。
It is also seen as promising as an image recording method such as simultaneous copy recording and two-tone recording. In particular, the thermal transfer method solves the problems of the conventional thermal printing method and its poor shelf life, and the print quality is clear, so it is expected to continue to develop in the future.

サーマルプリント方式の生命となる発熱抵抗体、即ちサ
ーマルヘッドは、薄膜方式、厚膜方式、半導体方式など
があるが、現在分解能、印字速度。
The heating resistor, or thermal head, is the lifeblood of the thermal printing method, and there are thin film, thick film, and semiconductor methods, but currently resolution and printing speed are limited.

長期信頼性、更にコストなどの多くの点から、薄膜方式
の優位性が立証されている。薄膜サーマルヘッドを説明
する為に、その−例の漿要’t−wIJ1図に示す。
The superiority of the thin film method has been proven in many respects, including long-term reliability and cost. In order to explain the thin film thermal head, an example of the thermal head is shown in Figure 1.

第1図は、薄膜サーマルヘッドの断面を示す図である。FIG. 1 is a diagram showing a cross section of a thin film thermal head.

アルミナ等の絶縁基板1に平滑面を形成するガラスグレ
ーズ層2が40〜60μ愼の専みにコートされており、
その上VCT a @ N等の発熱抵抗体膜5が形成さ
れている。更にその上には、発熱部4に電力を供給する
為のAu等の電接5がパターニングされている。その上
i!には、耐酸化保護層6が約2μ情、更に耐摩耗層7
が約10μ溝形成されている0通常耐酸化保護層6は5
top。
An insulating substrate 1 made of alumina or the like is coated with a glass glaze layer 2 with a thickness of 40 to 60 μm to form a smooth surface.
Moreover, a heating resistor film 5 such as VCT a@N is formed. Furthermore, an electrical connection 5 made of Au or the like for supplying power to the heat generating part 4 is patterned on it. Besides, i! The oxidation-resistant protective layer 6 has a thickness of approximately 2μ, and the wear-resistant layer 7
The normal oxidation-resistant protective layer 6 has a groove of about 10μ.
top.

耐摩耗層7はTIklOB  がそれぞれスパッタ方式
で形成されている。
The wear-resistant layer 7 is formed of TIklOB by a sputtering method.

第1図は、薄膜サーマルヘッドの一例を示したもので、
更に高惟p4Bt鼻尽す為に、構造、形状。
Figure 1 shows an example of a thin film thermal head.
Furthermore, the structure and shape are designed to satisfy Takayoshi p4Bt.

第2図に、印字品質を良くする為の構造の例を示す、ア
ルミナ等の絶縁性基板7の上に、発熱部8の下Sに相当
する部分にのみグレーズ層9全形成して感熱紙との接触
管良くシ、熱を効率よく感熱紙に伝達し、印字品質を向
上せしめている0部分グレーズ層9の上部の構造は、第
1図の例と同svこ、発熱抵抗体膜10111E極11
.耐酸化保護層12.耐摩耗層15が形成され、パター
ニングされている。
Figure 2 shows an example of a structure for improving printing quality.Thermal paper is made by forming a glaze layer 9 entirely on an insulating substrate 7 made of alumina or the like, only in a portion corresponding to the bottom S of the heat generating part 8. The structure of the upper part of the 0-part glaze layer 9, which makes contact with the tube well and efficiently transfers heat to the thermal paper and improves printing quality, is the same as the example shown in FIG. 1, and the heating resistor film 10111E pole 11
.. Oxidation-resistant protective layer 12. A wear-resistant layer 15 is formed and patterned.

これらのサーマルプリンターは、その用途によって発熱
体の配列、パターニングがそれぞれ異なっている。
These thermal printers have different arrangement and patterning of heating elements depending on their use.

ファクンミリ、ラインプリンター等には、横一列ドツト
型のヘッドが用いられる。これは紙送り方向に垂直にド
ツトを並べたものである。英数字。
Facility printers, line printers, and the like use dot-type heads in horizontal rows. This is an arrangement of dots perpendicular to the paper feed direction. Alphanumeric characters.

漢字、カタカナ等を印字するンリアルプリンターには、
紙送り方向と同方向にドツトを並べた縦一列ドツト型の
ヘッドが用いられる。シリアルプリンター用には、その
他にドツトマトリクス型ヘッドやセグメント型ヘッド等
が用いられる。
Nreal printers that print kanji, katakana, etc.
A vertical dot type head is used in which dots are arranged in the same direction as the paper feeding direction. For serial printers, dot matrix type heads, segment type heads, etc. are also used.

第5図に、横一列ドツト型ヘッドの例を示す。FIG. 5 shows an example of a horizontal single-row dot type head.

絶縁性基板14上に発熱部15が矢印で示す紙送り方向
に垂直に多数個形成されている0発熱部15に電流を供
給する電極16が形成され、絶縁性基板14の端部には
、外部回路との接続端子17が形成されている。場合に
よっては、点線で示し皮様に、部分グレーズ層18を形
成して印字品質を良くすることも試みられる。
A large number of heat generating parts 15 are formed on the insulating substrate 14 perpendicular to the paper feeding direction shown by the arrow. Electrodes 16 are formed to supply current to the heat generating parts 15, and at the ends of the insulating substrate 14, A connection terminal 17 with an external circuit is formed. In some cases, it is attempted to form a partial glaze layer 18 in a leather-like manner as shown by the dotted line to improve printing quality.

第4図に、縦一列ドツート型ヘッドの例を示す。FIG. 4 shows an example of a vertical single-row doublet type head.

絶縁性基金19上に発熱部20が矢印で示す紙送り方向
に並行に多数個形成されている0通常7ドツトの場合が
多いようである。発熱@20にt′流を供給する電、極
21が形成され、絶縁性基板19の端部には外部回路と
の接続端子22が形成されている。場合によっては、点
線で示した様に部分グレーズ層25を形成して、印字品
質を良くすることも試みられている3、 これらの部分グレーズ層は、低融点ガラスフリットをペ
ースト状とし、印111方式でアルミナ等の基板上に必
要なパターン形状になした後、所定の温度で焼成してバ
インダーを飛散させると共VC済融して、ガラス状とし
て表面を滑らかにする0通常こわらのガラスの焼成温度
は、500℃から700℃とされている。これらの焼成
温・度は、ガラスに含有される低融点成分、例えば酸化
鉛などの割合によって決められる。
A large number of heat generating parts 20 are formed on the insulating base 19 in parallel to the paper feeding direction indicated by the arrow. In most cases, the number of heat generating parts 20 is 7 dots. An electric pole 21 is formed for supplying a t' current to the heat generation @20, and a connection terminal 22 for connecting to an external circuit is formed at the end of the insulating substrate 19. In some cases, attempts have been made to improve printing quality by forming a partial glaze layer 25 as shown by the dotted line. After forming the required pattern shape on a substrate such as alumina using a method, it is fired at a predetermined temperature to scatter the binder, and is melted by VC to form a glass-like surface with a smooth surface.Normally stiff glass. The firing temperature is 500°C to 700°C. These firing temperatures and degrees are determined by the proportion of low melting point components such as lead oxide contained in the glass.

部分グレーズ層の目的として、ある程度の簡さを保持し
なければならない、少なくとも40μm以上の高さが必
要とされる。従って低融点のガラスでは焼成時に流れて
しまい、高さを保つことが難しい、その為に高さを保つ
ためには、600℃以上の融点の高融点のガラスが用い
られる。しかしこの場合も、流れを防ぎ高さを保持する
操作が行なわれる。この為に部分グレーズ層表面に凹凸
やピンホールが残って、発熱抵抗体層のパターニングに
支障を起しやすい、又、部分グレーズ層の裾野の部分、
即ち基金との境界においても、基板とのぬれ性がよくな
い為に元々表面N度の良くないセラミックスである基板
表面との間で大きな角度がついて、特に電極リード線の
75ターニングの際、パターンが切れてしまう現象が生
じていた。
For purposes of partial glaze layers, a height of at least 40 μm is required, which must maintain a certain degree of simplicity. Therefore, glass with a low melting point will flow during firing and it is difficult to maintain the height. Therefore, in order to maintain the height, a high melting point glass with a melting point of 600° C. or higher is used. However, in this case as well, operations are performed to prevent the flow and maintain the height. For this reason, unevenness and pinholes remain on the surface of the partial glaze layer, which tends to cause problems in patterning the heating resistor layer.
In other words, even at the boundary with the substrate, there is a large angle between the surface of the substrate, which is made of ceramic which originally has a poor surface N degree due to poor wettability with the substrate, and especially when turning the electrode lead wire at 75, the pattern There was a phenomenon where the disc was cut off.

本発明は、これらの不都合を解決して、部分グレーズ層
を高くして印字品質を良くすると共に、パターン精度も
良くして信頼性を高めると共に、感熱記録紙との密着性
を良くして、低電力での印字を可能としたものである。
The present invention solves these disadvantages, improves printing quality by increasing the height of the partial glaze layer, improves reliability by improving pattern accuracy, and improves adhesion to thermal recording paper. This enables printing with low power.

即ち本発明は、部分グレーズ層の下層部に高融点ガラス
を用い、上層部に低融点ガラスを用いたものである。
That is, in the present invention, high melting point glass is used in the lower layer of the partial glaze layer, and low melting point glass is used in the upper layer.

第5図に本発明の実施例を示す、アルミナ基板24上に
高融点ガラス層25.低融点ガラス層26からなる部分
グレーズ層を形成している。
An embodiment of the present invention is shown in FIG. 5, where a high melting point glass layer 25 is placed on an alumina substrate 24. A partial glaze layer consisting of a low melting point glass layer 26 is formed.

この*Xを実現する為の方策として、まず高融点ガラス
層を印り11焼成した後、更に低融点ガラスのフリット
のペーストを印jli11し、先の焼成温度よりも低い
温度で焼成する。このようにすることにり、先の高融点
ガラス層は何らそこ彦われずに更に低融点ガラス層が形
成され、部分グレーズ層の表面は非常に滑らかとなり、
凹凸やピンホールは除去され、裾野の部分でも低融点ガ
ラスが適度に流れ出している為に、部分グレーズ層の表
面と基板の表面とが急激な断絶や急激な角度をなすこと
なくつながり、パターンの切断などの不良も生じなくな
り、パターンの精度も向上し、良好な印字が可能となり
、分解能も向上した。
As a measure to realize this *X, first, a high melting point glass layer is marked 11 and fired, and then a low melting point glass frit paste is stamped 11 and fired at a temperature lower than the previous firing temperature. By doing this, a low melting point glass layer is formed without any deterioration of the previous high melting point glass layer, and the surface of the partial glaze layer becomes extremely smooth.
Irregularities and pinholes are removed, and the low melting point glass flows out even at the base, so the surface of the partial glaze layer and the surface of the substrate are connected without abrupt discontinuities or steep angles, and the pattern is Defects such as cutting no longer occur, pattern accuracy has improved, good printing is possible, and resolution has also improved.

本発明により、低電力で明瞭な印字が信頼性高く行なえ
るサーマルヘッドが完成した。
According to the present invention, a thermal head that can perform clear printing with low power and with high reliability has been completed.

即ち、漢字が明瞭に誠別のできる印字が20ドツト以上
の発熱部を備えた縦−判型の本実施例により可能となっ
た。又、通常1ドツト当り2ミリジユ一ル以上のエネル
ギーを要していた発熱部も、本実施例によれば1ミリジ
マール以下で印字が十分可能であった。又、貴意時点に
おいて、電極リード部のパターン部の切断による不良は
全く発生しなかつfc。
That is, printing of kanji characters that can be clearly distinguished is made possible by this embodiment of the vertical format, which is equipped with a heat generating part of 20 or more dots. Further, although the heat-generating portion normally requires more than 2 millijoules of energy per dot, according to this embodiment, it was possible to print with less than 1 millijoule. Furthermore, at this time, there were no defects caused by cutting of the pattern part of the electrode lead part.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は薄膜サーマルヘッドの断面を示す図である。第
2図は部分グレーズ層を持つ薄膜サーマルヘッドの断面
を示す図である。第5図、第4WAは部分グレーズ層を
持つサーマルヘッドの例を示す図である。第5図は本発
明の一実施例を示す図である。 1・・・l[基fi!       2・・・ガラスグ
レーズ層3・・・発熱抵抗体膜   4・・・発熱部5
・・・電 極      6・・・耐酸化保護層7・・
・耐摩耗層     8・・・発熱部9・・・グレーズ
層   10・・・発熱抵抗体膜11・・・電 極  
   12・・・耐酸化保護層1S・・・耐摩耗層  
  14・・・絶縁性基板15・・・発熱部     
16・・・電 極17・・・接続端子    18・・
・部分グレーズ層19・・・絶縁性基17B   20
・・・発熱部21・・・電 極     22・・・接
続端子25・・・部分グレーズ層 24・・・アルミナ
基鈑25・・・高融点ガラス  26・・・低融点ガラ
ス以上 出願人 株式会社諏訪精工舎 代理人 弁理士 最上  務 々 N1図 ? 第2図
FIG. 1 is a diagram showing a cross section of a thin film thermal head. FIG. 2 is a cross-sectional view of a thin film thermal head with a partial glaze layer. FIG. 5, 4WA is a diagram showing an example of a thermal head having a partial glaze layer. FIG. 5 is a diagram showing an embodiment of the present invention. 1...l [base fi! 2...Glass glaze layer 3...Heating resistor film 4...Heating part 5
...Electrode 6...Oxidation-resistant protective layer 7...
- Wear-resistant layer 8... Heat generating part 9... Glaze layer 10... Heat generating resistor film 11... Electrode
12... Oxidation-resistant protective layer 1S... Wear-resistant layer
14... Insulating substrate 15... Heat generating part
16... Electrode 17... Connection terminal 18...
-Partial glaze layer 19...insulating group 17B 20
... Heat generating part 21 ... Electrode 22 ... Connection terminal 25 ... Partial glaze layer 24 ... Alumina base plate 25 ... High melting point glass 26 ... Low melting point glass or higher Applicant Corporation Suwa Seikosha agent Patent attorney Mogami Tsutomu N1 diagram? Figure 2

Claims (1)

【特許請求の範囲】[Claims] 部分グレーズを設けた基板上に薄膜抵抗層と、該薄膜抵
抗層に給電する電極層とからかる発熱部ヲ備工たサーマ
ルヘッドにおいて、該部分グレーズの上方部が低融点材
質、下方部が高融点材質よりなることを%徴とするサー
マルヘッド。
In a thermal head that is equipped with a thin film resistance layer on a substrate provided with a partial glaze and a heat generating part that is connected to an electrode layer that supplies power to the thin film resistance layer, the upper part of the partial glaze is made of a low melting point material and the lower part is made of a high melting point material. Thermal head is made of melting point material.
JP56159891A 1981-10-07 1981-10-07 Thermal head Granted JPS5859864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56159891A JPS5859864A (en) 1981-10-07 1981-10-07 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56159891A JPS5859864A (en) 1981-10-07 1981-10-07 Thermal head

Publications (2)

Publication Number Publication Date
JPS5859864A true JPS5859864A (en) 1983-04-09
JPH0245595B2 JPH0245595B2 (en) 1990-10-11

Family

ID=15703429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56159891A Granted JPS5859864A (en) 1981-10-07 1981-10-07 Thermal head

Country Status (1)

Country Link
JP (1) JPS5859864A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60141569A (en) * 1983-12-28 1985-07-26 Pentel Kk Thermal head
US4612433A (en) * 1983-12-28 1986-09-16 Pentel Kabushiki Kaisha Thermal head and manufacturing method thereof
CN105427983A (en) * 2016-01-25 2016-03-23 娄底市安地亚斯电子陶瓷有限公司 Temperature resistance-trimming 75-kiloohm resistor chip and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479145U (en) * 1977-11-15 1979-06-05
JPS5543825A (en) * 1978-09-21 1980-03-27 Tokyo Shibaura Electric Co Substrate and method of manufacturing same
JPS5549802A (en) * 1978-10-05 1980-04-10 Fujitsu Ltd Glazing paste and glazing ceramic
JPS56118050U (en) * 1980-02-12 1981-09-09
JPS56131993A (en) * 1980-03-19 1981-10-15 Tokyo Shibaura Electric Co Glazed board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479145U (en) * 1977-11-15 1979-06-05
JPS5543825A (en) * 1978-09-21 1980-03-27 Tokyo Shibaura Electric Co Substrate and method of manufacturing same
JPS5549802A (en) * 1978-10-05 1980-04-10 Fujitsu Ltd Glazing paste and glazing ceramic
JPS56118050U (en) * 1980-02-12 1981-09-09
JPS56131993A (en) * 1980-03-19 1981-10-15 Tokyo Shibaura Electric Co Glazed board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60141569A (en) * 1983-12-28 1985-07-26 Pentel Kk Thermal head
US4612433A (en) * 1983-12-28 1986-09-16 Pentel Kabushiki Kaisha Thermal head and manufacturing method thereof
JPH0460025B2 (en) * 1983-12-28 1992-09-24 Pentel Kk
CN105427983A (en) * 2016-01-25 2016-03-23 娄底市安地亚斯电子陶瓷有限公司 Temperature resistance-trimming 75-kiloohm resistor chip and preparation method thereof

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JPH0245595B2 (en) 1990-10-11

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